Electronics Forum: dispense (Page 101 of 110)

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef

Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via

adhesive on pads

Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas

* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo

Universal instruments registration

Electronics Forum | Wed Apr 17 23:00:11 EDT 2002 | lysik

A DEK 265 Mark 1 is an old system. That does not mean that it does not work well. It is a very good system. It has however past it's 7 year support life. As far as a person that works for a OEM working on your machine there is no law that says he or

gold connectors

Electronics Forum | Fri May 31 17:04:02 EDT 2002 | davef

We use boots / shunts er wutt ever you call them to protect solderable component surfaces from wave soldering. Not sure how it would work in your case try: * Kinnarney Rubber 450 Main St. P.O.Box 37 Mantua, N.J. 08051 609-468-1320 fax 7438 http://ww

Can F4G connect with more than 8 CP7 or QP3?

Electronics Forum | Tue Jun 11 14:45:59 EDT 2002 | stefwitt

I can not find a F4G in Fuji�s equipment list. Siemens has a F4 ( flexible fine pitch machine ) and also a GII ( glue dispensing machine ), which both would make sense to add to your equipment list. Machines are �connected� together with their conve

Tombstoning

Electronics Forum | Thu Jun 13 11:27:25 EDT 2002 | davef

>*Changing paste >EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current application naturally is stencil printing.

Tombstoning

Electronics Forum | Fri Jun 14 09:15:02 EDT 2002 | edahi

DaveF, Yeah you got that right...because the initial stages of the project, the products would only attach 1 passive (capacitor) hell when things got too cheesy they wanted to attach 20 caps or so....this is not like board assembly, this only 1 Flip

Shrinkage in paper phenolic pcbs

Electronics Forum | Fri Aug 23 10:28:23 EDT 2002 | davef

Ah, CHEAP boards. You pay me now, you pay me later, eh? The buyers get BIG bonuses. The production types get trashed, 'cause they can run aboard they've been doing for years. Wassup? For a specification, look to: * IPC-6011 - Generic Performance

Increasing placement machine productivity

Electronics Forum | Mon Mar 03 09:57:26 EST 2003 | msivigny

Hello markt, If you're only running at 85%, you've got some things to look into! First, it's good you know that you're operating at 85% with some measurables that help you determine that. Now, the easiest methodical way to improve productivity on SMT

Cp and Cpk values

Electronics Forum | Mon Mar 03 11:06:13 EST 2003 | msivigny

Hi floydl, I completely understand when it comes to data crunching after long hours of performing measurements, it's the last and most important arduous task in obtaining performance data. If a measurement and evaluation process that traditionally to


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