Electronics Forum: distribution (Page 21 of 34)

MSD Bake Ovens

Electronics Forum | Thu Apr 15 01:51:52 EDT 2004 | kmccarten

Hi Haritt; In response to your request to information regarding cabinet manufacturers I would invite you to look at http://www.drycabinets.com which could give you some interesting if not valuable information regarding the functionality of desiccant

Immersion Silver

Electronics Forum | Sun Jun 06 09:20:03 EDT 2004 | michaeljm

My department and I have been working with immersion silver on and off for about four years and we have compiled quite a bit of data for the Alpha and MacDermid immersion silver chemistries. We have not encountered any assembly or storage related is

Flex circuits

Electronics Forum | Sat Jul 03 10:03:22 EDT 2004 | Bryan Sherh

Things to consider are: * Thermal expansion > characteristics of you flex and your pallet > should be better matched. We use G-10. * > Placement of your two sided tape should be > better, more uniformly distributed. We run strips > the length o

Questions about SMT Process Control

Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef

Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr

Rohs and WEEE

Electronics Forum | Sat Jan 29 08:46:20 EST 2005 | davef

The RoHS Directive complements the WEEE Directive. * Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive [2002/95/EC] affects manufacturers, sellers, distributors and recyclers of electrical and electronic equ

SMT Product Line Expansion

Electronics Forum | Thu Apr 28 08:29:22 EDT 2005 | andymackie

If what you are talking about is "assembly materials", then consider the following: - Solder paste - Wavesoldering fluxes - Bar (for filling wavesolder pots) - Underfill (for TCE-mismatched CSP's and flip-chip) - Cleaning fluids (for post-reflow boa

Boards Bowing

Electronics Forum | Fri Sep 30 10:13:54 EDT 2005 | Cmiller

We are having a random problem with boards bowing significantly. Its a large through hole board with only one QFP on it. The bowing occurs during the SMT reflow. The only conclusion I can come to is a problem at the board house that made it. I just w

SMT issues

Electronics Forum | Thu Feb 09 08:34:07 EST 2006 | davef

If your component meets ANSI/J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires, then the problem is at your customer's operation. If the problem is at your customer's operation, it's very difficult to anal

Long term effect of lead free solder on plating

Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef

Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass

RoHS Channel Stock

Electronics Forum | Thu Jun 29 21:52:13 EDT 2006 | grantp

Hi, Ok I am a little confused about an aspect of RoHS as I just heard some comments from a major manufacture that it's ok for a dealer of a product to ship a NON RoHS product to a customer after July, but you cannot distribute a NON RoHS product to


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