Electronics Forum: does (Page 446 of 882)

Calibration problem FUJI NXT III

Electronics Forum | Wed Apr 17 13:48:32 EDT 2024 | jdengler

I have a AIMEX III and we have seen the top cover on the conveyor being pushed out of postion when someone does maintenance. I beleive the NXT's use the same configuration. Check to see that the cover is pushed all the way over where the PCB would

Re: IC leg of RF unit lifted..

Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F

Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan

Re: Dull Solder

Electronics Forum | Fri Nov 12 08:55:43 EST 1999 | Wolfgang Busko

Hallo Edmund, what does dull mean in your case ? It�s nearly impossible to say something about it without more information. Dull or shiny isn�t a clear or better no indicator for good or bad. Some companies add other metalls to the solder to get rid

Re: Tombstoning

Electronics Forum | Tue Oct 12 16:08:44 EDT 1999 | Brian

| I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).

Re: SMT adhesives

Electronics Forum | Sat Sep 25 09:00:44 EDT 1999 | John

| I am developing a DOE for evaluating SMT adhesives. I would like to evaluate 3 different vendor dispensing adhesives. I currently have the Heraeus PD955M and the Loctite 3609 and 3618 selected for evaluation. I would like to add another manuf

Re: pallet design for thin pcb's

Electronics Forum | Wed Sep 22 09:25:42 EDT 1999 | Wolfgang Busko

| | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the scree

Re: I wonder

Electronics Forum | Thu Sep 09 21:50:53 EDT 1999 | kyung sam park

2 will have enormous impact on every other process. | | thank in advance. scott. I appreciate your sincere answer. would tell me the hint about printer if i's possible To tune our smt process we have to know what is the major X's for defect.

Re: I wonder

Electronics Forum | Thu Sep 09 22:18:13 EDT 1999 | Dave F

2 will have enormous impact on every other process. | | | thank in advance. | | | scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X

Re: Cleaning Electroplated Solder

Electronics Forum | Sat Aug 21 12:29:28 EDT 1999 | Brian

| I have a layer of electroplated solder (10/90) that appeares to have some sort of contaminent on it. Water will not wet to the layer in some areas. I have tried using 10% HCl in DI as a cleaner as well as 7.5% Fluoboric acid in DI. Neither has t

Re: Micro-BGA soldering

Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon

| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F


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