Electronics Forum | Thu Oct 24 15:35:47 EDT 2002 | davef
Biological Oxygen Demand (BOD). A test that measures how much of the oxygen dissolved in water is consumed by biological oxidation of the chemical in the water during the stated period of time. [Water from an exceptionally clear lake might show a BO
Electronics Forum | Fri Oct 25 11:21:05 EDT 2002 | soupatech
This may sound like a stupid question but keep in mind I am very new at this and most of the training I have recieved has been from operation manuals and this forum (thanks to all). Our purchasing agent (new hire) is ordering a stencil for the first
Electronics Forum | Mon Oct 28 07:07:39 EST 2002 | cyber_wolf
It has been my experience that when all conditions are as they are supposed to be there should be zero or very little deflection. When you start placing components with pick and place equipment that does not have a Z pressure sense, you run the possi
Electronics Forum | Mon Oct 28 18:59:25 EST 2002 | tkenny007
Specs for Bow and Twist for PCBs (IPC-A-610C, 10.6. There may be an update by now). I also have a note in our quality guide referencing (IPC-TM-650, 2.4.22) and (MIL-STD-105D). In summary, a PCB should not bow more than 0.040" with all four corner
Electronics Forum | Wed Nov 06 10:31:30 EST 2002 | davef
First, from what you say, it's unclear that there is a "solderability" issue with your connectors. Different appearance of the soldered connection from one side of the connector to the other is what we're talking about [I think]. But it is curious.
Electronics Forum | Wed Nov 06 12:56:10 EST 2002 | slthomas
What I'm seeing is an occasional pattern of tear drop shaped features in a sea of nice shiny solder. The little islands don't really have any relief.....it's more of a surface finish feature than a 3-dimensional feature. The wetting angles are good,
Electronics Forum | Fri Nov 08 11:37:44 EST 2002 | jonfox
1. Back in the early days of consumer digital cell phones, we ran into the same problem. PCB with 2000 parts in a 5"x2" area, and double sided. We ended up using our standard vacuum tooling for the NIC side and stiff ESD safe foam for the NAC side
Electronics Forum | Mon Nov 25 20:57:23 EST 2002 | Kermit
Thanks to everyone who has responded so far. We are going with dedicated tooling for our phone cards but not for our system cards so that takes that out of the equation for the former, will evaluate for the system bds.. Thanks for the info.. Regard
Electronics Forum | Mon Nov 11 17:16:11 EST 2002 | soupatech
Hi, I use the Fuji MCS-16F. The disks I have are labled.... MCS 2E System Disks #1 - #10 Version 3.38 MCS 2 Option Disks #1 - #2 V2.54 Automatic Programming 10 MCS 2 Option Disks #1 - #2 V2.49 HOST Communication 11 OS-9/6800 Level 1 System Di
Electronics Forum | Wed Nov 13 04:36:46 EST 2002 | iman
does anyone know what environment factors(specifications?) and process control parameters(printer & reflow?) are optimal for running SMT using type 4 and type 5 solder paste respectively? Any pitfalls to avoid? The product we have been asked to use
