Electronics Forum: does (Page 761 of 882)

White Residue / Vapor Degrease

Electronics Forum | Thu Jan 14 22:59:08 EST 1999 | Chris G.

I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get white

Re: White Residue / Vapor Degrease

Electronics Forum | Mon Jan 18 21:05:15 EST 1999 | Dave F

| I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get whi

Re: Surface Mount Connector Strength

Electronics Forum | Thu Jan 14 23:38:34 EST 1999 | Chris G.

| I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some con

Re: Nepcon 2000???

Electronics Forum | Wed Feb 03 14:20:34 EST 1999 | johnp

| What's going on with Nepcon next year??? | I have heard rumors allot of the big guys are moving to IPC/SMEMA show on a long beach somewhere in Calif.. | | Any info on who is planning to attend Nepcon 2k would be nice | Fuji?? | Universal??? |

Re: Process Control (Stencil Printer)

Electronics Forum | Tue Jan 12 14:59:14 EST 1999 | Earl Moon

| What would be a good metric for process control of a stencil printer? (fully automatic, vision equipped, stendil printer). | I'm doing some more DEK 265 GSX's with everything imaginable hung on them. Have done Lt's and the MPM2000. This makes mach

Re: 20 mil pitch applications

Electronics Forum | Fri Jan 08 16:48:13 EST 1999 | Earl Moon

| Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what ac

Re: 20 mil pitch applications

Electronics Forum | Tue Jan 12 00:33:30 EST 1999 | Jason

| | Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what

Re: Desoldering of TSOP and TSOJ

Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F

| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |

Re: Why so little interest in Bulk Fed passives?

Electronics Forum | Wed Jan 06 19:28:35 EST 1999 | Michael Allen

Actually, the capability does exist, even on chip shooters w/ feeder carriages. We've been using Sanyo's cassette feeder on their turret machine (TCM3500) for over a year with 0603 caps. I don't know about Fuji or Panasonic. | I'm not sure I'm off

Re: N2 Reduction

Electronics Forum | Tue Dec 29 12:57:08 EST 1998 | Earl Moon

| Does anyone have angles on how to reduce N2 consumption at reflow process (i.e. process control equipment, etc.)? | | Any help would be appreciated | N2 consumption is very "machine" and process dependent. Some machine designs are better equipped


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