Electronics Forum | Fri Dec 17 14:31:52 EST 2004 | Dreamsniper
I got this issue: Voids in almost every ball of my BGA's processed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Wed Dec 29 16:27:24 EST 2004 | Demar
Well I recently went with Circuitcam but I use the MCS platform still. To be honest I am not 100% sold on the software yet. I have already found bugs in the software that will likely never be fixed based on my outdated MCS platform. The only problem
Electronics Forum | Wed Jan 26 09:51:51 EST 2005 | jbrower
Sure, to be a true lead free enviroment all components need to be lead free or fall within the specifications of lead free as defined by the RoHS Directive. What I am doing is starting stage 1 of our journey. Layed out it looks some thing like this.
Electronics Forum | Tue Feb 01 12:52:19 EST 2005 | jbrower
Hi Tom, I did talk to Bob Gilbert about the sn100c. His comment is that it is a nickle stabalized alloy. Simplisticly, the tin and copper molecules would rather bond with the nickle. He also mentioned that with the SAC alloys, the manufactuers were
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Mon Feb 07 08:34:46 EST 2005 | Dougs
we are still looking into possible causes, we have rigged up a test to determine whether the cap is cracked and have ran a controlled batch off of SMT, these were all tested and look OK. I'm looking into buying some small strain gages to place over
Electronics Forum | Wed Feb 09 12:31:54 EST 2005 | russ
We are not doing this right at the moment but I have done it with great success. Of cource it depends on your pad layout we have a 20 mil gap in between pads, we printed at 10 mil wide with a 5mil stencil. I will try to find the glue we used, I kno
Electronics Forum | Mon Mar 21 22:09:28 EST 2005 | dlkearns1
Did you get your answer? From all the reading I've done since your posting, does this issue happen when running a "specific" program or any/all programs ? Just a thought, as MOD codes can be tricky. Also check the thru-holes on that backplain conn th
Electronics Forum | Mon Mar 21 04:35:13 EST 2005 | Base
Just thinking out-of-the-box literally: If you can not get a second hard-disk into the machine, why not take the hard-disk out of the machine and attach it to a PC. Once it has been connected as an auxilliary hard-disk to a PC it is very easy to make
Electronics Forum | Wed Mar 30 19:54:36 EST 2005 | mattkehoe
We've already done it for a customer. We used 63/37 ssd's on the top side where the are a few caps and one 256 pin QFP, coated with adhesive flux to hold the component, and lead free un flattened ssd's on the bottom to be attached to the other boar
