Electronics Forum | Thu May 16 04:54:33 EDT 2013 | aj
Hi all, I have an intermittent problem on a 265 GSX printer. "Position error" on the rising table.. quite a lot of work has been done with no success. such as motor, break , encoder replaced....diagnostic checks etc.... Machine could run for a few
Electronics Forum | Wed Jul 10 16:34:23 EDT 2013 | hegemon
Preheating is critical in Vapor Phase Soldering. One trick that is done is to use the "soft vapor" area just above the soldering vapor, some machines can pause just before going into the soldering vapor. Using that pause above the vapor to continue
Electronics Forum | Tue Jul 16 19:46:36 EDT 2013 | tuxd3v
Hi, I have never done a pcb route for SPI or I2c, I need communication lines for SPI @10Mhz and I2c@1Mhz. I don't know what steps I have to follow to make this communication Lines. Does I Need to look to this lines like "Trasmission Lines", becaus
Electronics Forum | Mon Aug 05 14:13:09 EDT 2013 | rway
I haven't done this either but have an idea of how I would address it. First, let me ask, are your leads crimped or straight? Most likely they are crimped which means you should get reflection from the lead. You could try a solder inspection (reve
Electronics Forum | Fri Oct 04 16:08:28 EDT 2013 | hegemon
Same idea but simpler execution. Verify Solder pot temperature. Verify Temperature of Solder as it leaves the nozzle. Verify preheating gets your PWB up to 90C-120C prior to soldering. Check machine speed, verify 4 seconds contact with solder at
Electronics Forum | Mon Sep 23 12:59:12 EDT 2013 | pauldavis4
New pcba supplier sent us first article pcbas (SMT, Wave & hand solder operations) that failed our testing due to no-clean flux residues found under ICs and around passive capacitors. Second lot came in and had 100% pass yield, but we still see a cl
Electronics Forum | Thu Dec 05 17:59:14 EST 2013 | hegemon
By hand, we apply a precision die cut plastic protective film to a particular "lens" product. It is of the "peel the backing off and apply" style product. Due to the ESD event possibilities, this application is done in an area far away from any ele
Electronics Forum | Wed Mar 19 08:38:13 EDT 2014 | davef
I can't picture much of what you're saying, not for nothing, I'm just not connecting. During assembly, solder mask can affected by heat and chemicals. Typically this would be during: * Soldering * Cleaning I will tell you this: Not to defend assem
Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak
what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal
Electronics Forum | Fri May 23 04:22:39 EDT 2014 | andrzej
Thanks Hege. I've done some research and this might be the root couse: 1. Too thin HAL layer which leads to formation intermetallic Cu-Sn layers on surface after 1-st reflow (most probably) 2. Poor quality of solder for HAL process. 3. Problem
