Electronics Forum | Wed Jun 23 10:05:17 EDT 2004 | exmaintenanceleader
Hi Grant, I'm ex Fuji service engineer I install also at Sagem Czecz Republik (Kladnow near Prague) in 2000 they use at new lines MPM- 2XCP643E and 1xUniversal GSM (French owen (I do not remember the exacly tipe) at second hand line they use 2x and
Electronics Forum | Fri Sep 24 20:40:18 EDT 2004 | dennispoquiz
Date: September 07, 2004 09:23 AM Author: V.Hazzlewood Subject: Program Optimization of Sanyo V820 series (V822,821) I use a V820 machine. There is no command. I have also got a manual for a V821 machine and they have included a command. In the
Electronics Forum | Thu Jan 20 17:14:39 EST 2005 | jbrower
Today, I have just finished evaluating Kester's EM907 (SAC305)lead free solder paste and found that for our applications it performs as expected. End result that I am encouraged with the results that we got. The equipment that I used: An SMT2020 to
Electronics Forum | Fri Feb 11 18:51:16 EST 2005 | primus
The operators use SET SEQ and SET SEG. I know all about getting these wrong, because if you forget the "Q" or the "G" you get SET SE which is SET SENSOR. That REALLY messes up our BEC! But then again, I believe our BECs are all calibrated wrong anywa
Electronics Forum | Thu Apr 07 08:02:44 EDT 2005 | Grant
Hi, I used to run a clean room, and it's right, most of the dust is created internally. You will need to add some HEPA filtering to the area, and an air handling unit that can control temp and humidity as well to get correct environmental control.
Electronics Forum | Fri May 13 16:23:03 EDT 2005 | patrickbruneel
PR What you're up against is the usual bottom line manufacturing "cost" I have no direct experience with CEI, but I have experience competing with low labor cost. I have to disagree with Russ that Singapore cant handle high mix low volume because t
Electronics Forum | Thu Jan 05 15:09:37 EST 2006 | grantp
Hi, What studies? Can you post a link? I am not sure what the difference is between a ceramic BGA that the high temp solder ball is not expected to collapse, and a lead free solder ball that's run through a lead process and also does not collapse b
Electronics Forum | Fri Mar 17 14:53:08 EST 2006 | Board House
Hi Brad, Being that I work for a board house here is my take on this issue. In the past it used to be 1 scrap per palt up to 10% of the total order. scrap is supposed to be sepperated to location and packaged sepertaly. Then it turned into No Scra
Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris
Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
