Electronics Forum | Tue Aug 17 13:36:17 EDT 2010 | hegemon
Since you have home plated the apts and done solder reduction, I would take a look at your soldering profile. We have run into this before when running no-clean and found that reducing the initial ramp rate to the flux activation was a help in the
Electronics Forum | Sat Aug 21 15:02:32 EDT 2010 | jry74
I have a pcb with 750 plated through holes that get Holtite sockets inserted into them. I have a method of pressing in 10 sockets at a time. However, when we are done, the board has bad warpage on the X and Y axis. Does anyone out there have any t
Electronics Forum | Mon Aug 30 08:57:54 EDT 2010 | stevezeva
Hi Stephen, Once they've been soldered down, you're stuck with doing touch labor on each and every one. But you might be suprised how quickly this can be done with the right tools. Are they all the same value resistor? If so, that should make things
Electronics Forum | Mon Oct 04 11:34:29 EDT 2010 | vetteboy86
I've done minimal research to this point and understand my issue with solder on the double sided boards is due to oxidation that occures on the unpopulated pads when the board makes its first trip through the reflow oven. We did run both sides in a
Electronics Forum | Mon Oct 11 12:02:32 EDT 2010 | smt_guy
Hi, we have been baking parts like QFP's and BGA once they past MSL requirements. But now I have some SOIC's with MSL 3 Rating that needs to be baked. I wonder if I can bake them together with the PVC Antistatic Tubes. Can these tubes withstand the
Electronics Forum | Sun Dec 26 23:33:38 EST 2010 | raghu
Thanks for your reply sir, We have done production with Machine application earlier, of control electronics sub- assys of some boards with acrylic conformal coating by using one tank... And some boards with polyurathan conformal caoting by usin
Electronics Forum | Tue Dec 28 09:52:28 EST 2010 | flipit
Use a 0.002" to 0.003" thick stencil. Use an electroformed stencil from Photo Stencil or one of the others. Use -500 +635 paste or a -500 paste or type 5 or greater paste. I have printed at 0.008" pitch with 0.004" pads. It can be done.
Electronics Forum | Fri Jan 07 10:27:50 EST 2011 | rpatel28364
We havn't done any failure analysis on this BGA. We have this information from customer. currently we dont have anything to check solderability for BGA. Only thing we rly is Profile on solder sample un populated board. Also we are building only 100 u
Electronics Forum | Wed Feb 09 13:24:31 EST 2011 | waveroom
I have a customer who's solder paste is drying out on their stencils. Humidity 40-45, Temp 70degrees, no air blowing on stencil, no cleaning stencils with chemicals. Handling of paste is done correctly. I'm thinking maybe the paste froze during shipm
Electronics Forum | Thu Mar 03 02:00:37 EST 2011 | kemasta
I tried, but error:- Attribute validation error for tag CFFILE. The value of the attribute destination, which is currently /var/www/smtnet/Forums/Attachments//, is invalid. The error occurred on line 12. Try go to this url and view:- http://img845.
