double sided pcb

"double sided pcb" search results in the Electronics Forums

12781 result s found for "double sided pcb" in the Electronics Forums

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Speaking of Lead

May 7, 2008 | OK, you may be using this forum for your political rants - but if not, I will appease you one more time: Issue one at hand: Blame a political leader for my mistakes. I wish it were that easy. I'd blame Oprah for my top side wetting issues. Issue two at hand: EPA is a Communist Organization

bending CSM84 push rods

Mar 28, 2008 | Hello, all, I have been having problems with bent push rods on my Philips CSM84. I have caught it a couple times when it happened, but it happens so fast I still don't know exactly what the sequence is that causes this. The push rod is clipping a feeder trip lever from the side. I am assuming

quad qsv-1 gantry - quad align issues

Jan 23, 2008 | the pockets and inserting my first board it placed about 300 components and then it quit running. The error it gave was (Head#1 Qalign Failure on D13[8]QA Error: Bad Alignment.. Side 2 Failure). I checked all the connections on the Qalign units and everything seemed to be fine, rebooted and ran another board

MANEX ERP or DBA Manufacturing - any user comments?

Oct 1, 2007 | , but was told that it wasn't so great at accounting. I know that the Aegis folks come from a Manufacturing/Engineering background, and would expect that if they did offer an MRP tool that it would be great at process control, and maybe a little weaker on the MRP side. In the end, each system would most

CSP rework station advice needed

May 17, 2007 | Hi All. We are a tiny startup company developing an IC in a flip-chip CSP package. We find ourselves in need of being able to remove and replace (ie rework) our chip on a characterization board. The board will not be big and the chip is very small... 2.3mm/side with a 6x6 ball array at 400um

Mix Technology Board Processes

Apr 23, 2007 | , it depends on the board technology that your company uses. Typically, if you have bottom-side actives and lots of assemblies that have things smaller than 0805, glue/wave is NOT the way to go, and it will always yield worse than reflow/reflow. Also glue/wave adds cost if it's being dispensed instead

Pick & place

Mar 26, 2007 | have been great. However the down side of this is the cost is very high, because to get the extra speed you need to place passive components with a separate machine to the IC's and larger BGA components. Basically one machine is for fine pitch placement, and the other is a chip shooter. That works

i want to know what i need to made a manufacturing line for smt

Mar 15, 2007 | machines, a Soltec 10 zone oven, and Soltec wave for soldering connectors. That works great for us, is extremely accurate and stable, and we do about 6 product change overs a day with single sided boards. Others on the forum will be able to suggest similar configurations they use and know and how stable

Wave Soldering Process Restrictions

Feb 21, 2007 | I've experienced in the past related to this. I would, initially, expect that you wouldn't lose parts...the glue shouldn't break down, and you've got surface tension on your side. cheers, ..rob

BGA opens

Jan 24, 2007 | /flex. Also check the ramp up/down rates for the reflow profile being used, as well as time above liquidus and peak temps. If it is a thick and dense board, they may be on the cool side, etc. If the BGA has an integrated spreader on it, you may need very high preheats and longer than normal above liquidus

Looking for help with Fuji IP-1 start-up problem

Jan 20, 2007 | is not plugged into side of the IP-1 it boots up fine, zeros, feeds boards and performs production OK. But obviously we can only produce programs that are in the memory and cannot program any new production. Any hints as to where to look would be wonderful. Regards, Bert van den Berg

Solder paste handing

Jan 15, 2007 | . WHY?" Solder paste can separate (to some degree) in the tube leaving you with either more or less flux to metal ratio. For this reason, we store the tubes on their side so that any separation (flux at the top, solder spheres at the bottom) would still have a faily consistant ratio when it is dispensed

BGA adapter boad?

Jan 5, 2007 | layer to keep the cost down. This would also eliminate the need to do micro-BGA level rework. The part would be attached to a small board with a grid of round pads on the bottom side spaced so that we can have access with a HP-3070 tester and the mother board would have the same grid. After the module

Marking on shrink tubing

Jan 3, 2007 | and we end up wasting abunch of markers. The printer may not be used for a week or more, then it might be needed for two or three different sizes of markers for the same job. The sensor is somewhat buried and not easy to align. On ours it is easy to adjust, but you're off to the side so you can

GSM Belt Transfer

Dec 11, 2006 | From the main UPS window: [System setup] > [Drop down menus] > Machine > Configuration > Parameters > Axes => You are now on a page with 3 menus > on the left side menu [Axis choice] scroll down and mark [Transfer belts] > On the upper right menu [Configurable Values] > mark [Default maximum

Wave Solder - solder bubbles/outgassing??

Nov 14, 2006 | it has huge solder bubbles in the vias and un-used thruholes. These are bubbles not solid solder. You can puncture the bubble and open it up to reveal a hollow barrel. The bubbles are on both the top and bottom side of the boards. I don't think an air knife will have any effect to cure this. Ours

Which AOI to buy?

Nov 4, 2006 | Mirtec was the fact that the machine provided better defect coverage than the Yestech system, especially with regard to solder inspection...there was no comparison. I also ran a very simple Gage R&R test on the two systems to test repeatability. The Mirtec machine won easily. On a side note, the Mirtec

Cleaning Paste from 2nd Side Print

Nov 1, 2006 | Dave, your points certainly have merit and I wouldn't make a habit out of that method. We did it onl

Local Fiducials

Oct 19, 2006 | the one on the opposite side of the package. They are placed where the designer had room. I've been trying to tell our customer that these fids do us no good, as when you find the centers of the fids, and draw a line through them, the center of the line is not the center of the component. I generally get

Need an ESD Guru

Oct 17, 2006 | and carbon impregnated bags are conductive/static-dissipative. As I also recall, conductive/dissipative is better than anti-static. However, I'm having trouble articulating exactly why this is the case. Anyone have any advice for making this argument? As a side note, we're also discussing the need

Lead Free boards

Aug 28, 2006 | 's unless they are set up for this finish. Finish is applied before shipping product. Chemical spray coating over virgin Copper. I dissagree that you should not work with your board house. This is a team effort and all sides have pro and cons to finishes and materials, the goal is to make product

MPM Hi e

Aug 2, 2006 | the camera and y-platen when you knock it off so as not to damage it. When I say knock it off, I mean a sharp blow with the side of your fist will do the trick but be ready to catch it when it falls off and watch where you are hitting the camera cube at - look for some frame-work to hit so you don't knock

Stencil cleaners.

Jul 17, 2006 | jet technology. The sprays will broadcast the solder balls throughout the process chamber and contaminate the populated side �A� of a reflowed board. Ultrasonic technology will not broadcast the solder balls. The solder balls fall away from the board by gravity. So, if the board is oriented properly (populated side up), the solder balls will not contaminate to populated side. Studies by GEC Maroni and the EMPF Laboratory are summarized in an article by William Kenyon, �Why Not Ultrasonic Cleaning?� (side walls and plumbing of the chamber of a spray technology stencil cleaner and ions often flow

mpm up2000 backdoor?

Jun 22, 2006 | config. has a line called "Manual Mode Output Side". You can set this to left or right. You change this in DOS (config.). You view these settings in Supervisor and above mode under machine configuration.

Oop's Pb BGA's in a RoHS process?

Jun 20, 2006 | Electronics%20Assembly.pdf To be on the safe-side and to eliminate the "reliability" question mark, I would block out stencil apertures on the Pb BGA device, and manually apply tacky flux before pick-and place. The hotter Pb-Free temps. should be fine to collapse your Sn-Pb ball. The main concern

Oop's Pb BGA's in a RoHS process?

Jun 16, 2006 | made some tests in a lab on this scenario, and the answer is not conclusive. It will work with some components and sometime the same component from different vendors will not. Our company and customers will just go on the safe side. Questions: 1: Are these pcba:s expensive? 2. Do you need to take back

Problems with SN100C in a Soltec Delta C Wave

Jun 10, 2006 | put a Dr. and a Expert Guru in front of and after my name I am an expert in this field. So here goes! I reccomend usin' a propane torch and liberal doses of Organic flux on the top side of your board. But don't wash off the flux, because some guy in shipping said it was ok to ship like that.That way

Topside Heat on Board

Jun 2, 2006 | ) The temp that the flux manufacturer is referencing is a reading taken just before the board makes contact with the solder. So your 110-120 degrees is just before the solder contact and the reading is on the top side. As Patrick said, the best tool to use is a profiler. It works by attaching thermocouples

Business question for you CMers

May 18, 2006 | in the verbage of a contract, but in lieu of that, what say you all? My boss thinks we fullfilled our end of the deal (assemble and test), but I can see the other side as well in that it could be assumed that providing assembled, tested boards could mean that they all function.

Seeking very low volume production reflow oven

Apr 26, 2006 | board. Not to knock APS, but I would be very suspicios that you can achieve uniform heating across your board. If the delta T is high you will be faced with having part of the board reflow while another part will not. Once the cooler part of the board reaches the melting point, your hotter side

CP4 of death

Apr 13, 2006 | by about .2mm I repeated this and every time, the parts kept shifting another .2mm To try and determine the problem, I placed a dial micrometer touching the side of the XY table, and got the servo counter value for the Y motor. (lets say 19000 pulses) I then brought the table to load position, manually


Apr 11, 2006 | and heat required to melt the joint may require you to keep parts away from this area. Pre-heat. A lot of selective solder people forget about preheat. If they do, then they also forget about the delta T from preheat to soldering station. This can be critical for top side wetting. Board travel. A

Siemens S15/F3 skipping component

Apr 11, 2006 | and continue placing all other parts. I have been told that you can disable a gantry and place all the other parts that are on the opposite side but this is not much better than aborting the job as we have to do now. I can't believe that Siemens would have transgressed in their machines capabilities

Flux Residues In Lead Free Wave Soldeing Process

Mar 30, 2006 | " philosophy. They have nice activators which can survive the chip wave and penetrate nicely into your through holes giving you that nice top-side wetting that everyone wants to see. Search the archives on VOC-Free flux and you'll find lots of good threads in there.

Heat Sink for QFP

Mar 28, 2006 | Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obviously any increase in the in thermal pad should

Grid lok system

Feb 28, 2006 | back at our history at wave. Our number one defect was missing parts. This was never cause by the wave maCHINES BUT WE NEVER LOOKED AT A BOARD UNTIL AFTER WAVE. Since we started using the gels our only problem have been skips and top side wetting. Mostly cuase the fluxer programs are messed up

Where's the rush?

Feb 24, 2006 | these days it looks to me like the whole world has become a beta test side. The scary part is (before the lead free) when I promoted a flux requiring a topside heat of 130C topside I almost got thrown out the door because the components would be damaged. Now when someone goes lead-free I see temperatures up

Soltec Parts - cheap?

Feb 16, 2006 | of OEM parts they will source them from that facility rather than paying the original machine manufacturer exhorbinant prices that are passed on to you. The distributors may also be in the same boat as you. I'm not going into bat for these guys but.....there are often two sides etc.

Beginners' steps to run wave soldering process

Feb 16, 2006 | Hello, We�ve ordered the line machinery for our TV factory. It should be ready after two to three months. We will start producing Analog CRT TVs using single sided FR2 or CEM1, thru-hole components and tin-lead wave soldering process. Knowing that we have no prior experience in wave soldering

Do you need to bake after parts are in the Dry Cabinet

Jan 30, 2006 | once boards have got out from washing machine conveyor) to blast boards with dry compressed air (35 PSI max) for few seconds just under the TBGA body side, or contact housing of VHDM connectors. Following process step was to put all the boards inside an oven at 90�C for at least 30 minutes

PVA Conformal Coating Machine

Dec 22, 2005 | to speed up programming and running time). After the oven I let boards cool down then run the next side. Work orders that used to take 2-3 days now take about 3 hours to complete. We run the chain conveyer and everything runs in a fixture, mostly designed in house. Programming on our machine is done with a

Samsung SM320 VS Assembleon 8 head Opal XII

Dec 17, 2005 | Samsung SM320 don't have sensor for recognizing component. Only using Fly&Fix camera. In first time the korean samsung service engineer advised me (3,7light settings for chips and the machine generated many dumps, sometimes 50 or more per day. But now with (Side:9&Outer:5 light settings machine

Fine Pitch Stencil Design

Dec 14, 2005 | 's; if so, there's room to reduce on all 4 your designers violate BGA-to-via spacings and/or not enough resist in-between... this is the type of stuff your stencil manufacturer DOESN'T know. A good Engineer will know these things, have a feel for his processes, use CAD tools to design his

Comet Philips machine error

Nov 18, 2005 | . Now just release all the emergency switches/covers and try to release the emergency. Then go at the back side and check the LED sequence on the connection board. It basically tells you the reason for the emergency. If it gives a logic to you, solve it. If not, I would first format the Flash Disc

CP6 Performance

Nov 16, 2005 | Hi, There are a few different types of CP6 which I think the main differences are on the board loading side of things. To briefly answer your questions: 1.What is the actual CPH you are getting during production. There are a lot of variables to consider to get your CPH. Component types

Comet Philips machine error

Nov 15, 2005 | in the lower left square of the monitor a red flashing message "L013: 2nd limit over" after that the initialization process finish and I can go in to >>I/OPERATION ==> >1/RUNNING ==> but any command that I try gives an E100 error and in the left side of the monitor a square with: Conditions Initialized

Problem with y-axis Yamaha84 SMT mounter

Oct 26, 2005 | . This will probably NOT fix the problem though you may be lucky. If you do not wish to remove the motor to do this take off the side cover and this will give you access - awkward access but access nonetheless. Check brush wear as per manual, but again replacing worn brushes will probablt NOT fix the problem. Do

Same wave process do not apply to all finish board

Oct 14, 2005 | for this is that heat has a natural rising flow, it will be easier for the flux to wick-up to the topside pad on the component side. Heating only from the bottom will increase the capillary force of the flux and the solder. The natural forces in soldering are free why not using them. Concerning conveyor speed I

tape splicing pros and cons

Sep 23, 2005 | of the advantages of other methods. But with the option to splice or not to splice, the end user can make their own choice. As a side note, our 8mm feeders have an option for a large reel hanger (13 inch dia.) and a tether on the cover tape take up spool to minimize the component loss without a cover tape leader

checking QFP's for opens

Sep 13, 2005 | and prod, do it under a scope, limit it to suspect joints and be prepared to touch up (not a good thing in and of itself) every one of them. We had a problem once at my last employer and it became the normal process to drag solder all 4 sides of every (there were 12) QFP 100 after reflow, on every board

Reflow Oven

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