Order by: Relevancy | Date
Jun 16, 2014 | Are both red and green leds on for the driver cards (they are located in the bottom right of the machine). If they are both on then you have an interlock opened. If this is the case....check the side doors....sometimes they are not shut all the way. Let me know what you find. Bob
Apr 7, 2014 | I drilled a small hole from the other side in order to get my thermocouple under the inductor pad. I did not have anything on hand to fill the hole, so I covered with kapton tape the best I could. I suspect that is why it looks like it should work.
Mar 13, 2014 | Why don't you try to make your step on the squeegee side? that way you shouldn't have any issues with cleaning.
Feb 27, 2014 | I dont know if this helps but we do a 10-board-cleaning after 10 prints or cycles we stop and with lint free towels with alcohol and a air gun we clean it, you should clean one side then the other. Hope it helps
Aug 20, 2013 | I don't know about a poster, but we just print the Data Sheet for parts with questionable polarity markings. Just remember, that not all SMT LEDs are marked by Cathode. We have ONE LED that we use that the manufacturer puts a dot on the anode side.
Jul 10, 2013 | HI guys, Problem solved.....reason is the SD card's location in on the fixed side of the reflow oven,i believe there is not much convection heat blown towards the component.... Pleased to hear if any rgds
Jun 10, 2013 | Check to make sure the side covers are closed. It is probably an interlock problem. Also if you have carts...make sure the plunger switches are down. Good Luck
Mar 22, 2013 | Does anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those little preform remnants everywhere!
Mar 18, 2013 | The paste is going to roll as before because you have to apply the coating on the bottom side of the stencil. Also the coating that wears out will most probably go to your stencil cleaning paper as that the process wehn you actually have friction with this layer.
Mar 13, 2013 | Not knowing XPM ovens , have zones are usually top heat and bottom, you replaced one heater panel-platten thus have a another above or below, maybe one above or below also is faulty causing heat spot on one side of oven ?
Dec 12, 2012 | OSHA regulates eye protection under 29 CFR 1910.132 I've had inspectors confirm that eye protection was ANSI Z87.1 compliant, but have never had anyone question the level of protection provided by side shields.
Nov 14, 2012 | Ryan, in some cases we use 2 pastes with different melting temperature (LF SAC and PbSn)for complex boards with components on two sides. And we want to try to replace LF SAC with low melting paste.
Sep 19, 2012 | Hi Melissa, We mount this component in the bottom side with adhesive epoxy and the solder is done on the wave solder machine. During the wave solder machine, we have the problem as like the picture.. no solder in one of the pads...
Jun 28, 2012 | I'm sorry. These are SMT caps such as a C0805C271J1GAC. Small 0805 caps. I know they gennerally give you solder balls that sit on the side of those parts but they wash off.
Jun 11, 2012 | take a look at http://www.tri.com.tw linear motors side cameras 3 ccd camera technology
Jun 5, 2012 | How deep is the indent? I would say as long as it is hitting nothing but net (the solder fill), your fine. Besides, you should notice indents on your solder fillets of components on the top-side as well. This is also expected and acceptable.
May 22, 2012 | The spacing, and the length as everything else on this board solders great. As far as the amount of flux goes, I altered the fluxer recipe to both spray more and less to see if either had an effect, again nothing noticable...well less was noticable, nothing changed with more. Top side picture
May 22, 2012 | A picture of the top side of the connector would be helpfull too. I assume the 2 large leads in the front are part of that connector too.
Apr 10, 2012 | these would be the guys to talk to at your end http://www.goppm.com/ depending on your machines you may want to upgrade the software side to enable a more user friendly setup environment
Apr 5, 2012 | if you want to get some sort of a joint even to allow AOI to inspect you can overprint on on the outer lead by 3 thou or so. This will give you a joint that can be seen from the side for inspection purposes.
Apr 3, 2012 | Hi, where can i place a manual tray feeder on OPAL XII - Assembleon. I tried to put the tray on rear side feeders positions and teached components array positions but an error occurred "software outlimits".
Feb 6, 2012 | Yes. You need to educate your customer... On a side note, hopefully these boards hasn't gone through wave over your LF solder pot.. This will contaminate your solder pot and won't be cheap to fix it.
Dec 4, 2011 | Thanks for the reply bobpan. I had the motor power on. I did have a side panel that was not shut all the way. Once I shut that, the error went away and it made it through its startup sequence. No errors. Thanks for the help.
Nov 24, 2011 | Oh wow, I suppose that would fix it huh? That's too bad that the whole unit had to be replaced, but look on the bright side, you should have a decent amount of spare hydra parts now right? haha
Nov 23, 2011 | Are you stuck with pin transfer for some reason? Screen printing is more repeatable and easier to m
Nov 4, 2011 | tombstonesmt: Ammonia based masks can create solderability issues after they are removed. You can get non-ammonia based latex mask material but down side is slower cure and cost a little more as they have higher levels of latex etc
Aug 20, 2011 | I will try to get a pix for heels. Normal IPC standard Yes, all for sides are the same (ignore the little misalignment, usually that is fine). I wonder if the IC is maybe too lite and 'swims' on the liquid tin and if it would help to put some weight on the IC?
Jul 28, 2011 | Hi, what kind of issues i could get if the i do not provide heal properly in my footprint ? In my current design 0603 resistor package footprint heal is missing by 3 mils each side Please help
Jul 27, 2011 | We bought air dispenser guns that fit the cartriges. I can't remember where we got them - sorry. We built little aluminum "holsters" for the sides of the machines to put the guns in. The guns are hooked up to air with low pressure regulators. Works good for us.
Jun 15, 2011 | You don’t need top heaters as long as you can reach the flux manufacturers recommended board top side temp.
Jun 15, 2011 | I have a wave that does NOT have top side preheats. I have not worked with a machine like this in the past. The majority of my experience revolve around topside temps prior to entering the wave. Has anyone else worked with a process like this? What are the differences and What works best?
Apr 11, 2011 | Hi all, How about the Sony Chip Shooter in your side? Are they difficult to sell? BTW,who has Sony Feeders for selling?Pls contact me,i need it urgently. Thanks&best regards! Lisa
Mar 25, 2011 | Are the solder balls what we would call ' mid chip ' solder balls where a single or sometimes a few larger solder balls are positioned somewhere along the side of the chip or are they the solder paste powder particles spread around the pads ?
Mar 21, 2011 | Passives first reflow, and BGAs second side reflow. Uses only one heating cycle for your BGAs, and the passives will stay in place just fine given correct profile parameters. There are a few exceptions, but this is generally how it is done. My $.02 'hege
Mar 21, 2011 | I would run the passive side first just because the BGA is probably moisture sensitive and I wouldn't want to have to keep track of the time between first and second reflow.
Mar 4, 2011 | Hello all are you using h.p. gold spliceable feeders if so there is a black knob on the side of the feeder that has to point to correct pitch
Mar 3, 2011 | I've seen this with through hole via in pad with soldermask plugging from the opposite side. Baking the boards solved it. Not using such a horrible via in pad method would also have solved it, but that wasn't an option. Is this ball sitting on a via?
Dec 15, 2010 | We side with your operator. Poor pad design is the largest contributor to component shift. If you posted pictures, we might have a livelier discussion about alternate explanations.
Nov 11, 2010 | We guess the nickle has a rougher that normal finish AND the gold is at or below your specification. The nickle bumps are poking through the gold and are oxidized, preventing contact with you ATE probes. If this is correct, it would be interesting to do sections on some of your second side solder
Sep 29, 2010 | TH Parts are hand loaded - some are wave soldered and some hand soldered. smt 1206 on top side can be reflowed as you suggested but it's addition of one more step of reflow cycle in process for production. and i think that's why they are reluctant on this. Appreciate your feedback.
Sep 29, 2010 | by manual. What is the part? i mean package. How are you soldering it? All SMT are on bottom side so production is using reflow soldering method for soldering all SMT packages except i want to place ONE SMT CAPACITOR Package 1206 on top side but prodution denying it as they don't want to hand solder SMT to be physically close as possible to IC and since i don't have space to put PTH Pad or smt pad on BOTTOM Side the only option i see is to place SMT 1206 on top side. using this forum i want understand if sodering smt by hand is commonly acceptable during production ? Thanks a lot for reply.
Sep 12, 2010 | Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Aug 22, 2010 | Hello, why you did not made it lead free the side with 5 medium sized BGA's ? that why you may been assembly and the large lead free BGA.
Aug 20, 2010 | Companies accept boards for recycling based on their expectation of making money by recovering the metal from the boards. Do your side rails contain metal?
Aug 10, 2010 | is it usual if the board has warpage on both sides after wave soldering? And, if it is, please advise me how to solve it. Thanks in advance.
Jun 25, 2010 | Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during refl
Jun 25, 2010 | Good Morning JM, Does anything come into physical contact with the BGA in question during the ref
Mar 31, 2010 | If you dissconnect the crash beam sensor one at a time at the front leaving the remaining one connected you’ll be able to identify what side is causing the problem. Then you will be able to hopefully remove the object or adjust the position of the beam sensor slightly. www.accuspares.com
Mar 27, 2010 | Well I'll be damned! I was printing this on the fiducial side. Silly me. I should have read the manual closer. Thanks for the help.
Mar 23, 2010 | Hi, To provide closure and help the healing process and maybe benifit someone else down the road... The problem was the UPS battery had gone dead. Back side of oven, near the exit end. rob
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