double sided pcb

"double sided pcb" search results in the Electronics Forums



12781 result s found for "double sided pcb" in the Electronics Forums

Order by: Relevancy |   Date

Topaz X error

May 10, 2019 | on the left and right sides of the head assembly respectively. The sensor sends light beam through 3 holes in the body of the head assembly. I have seen dust in these holes as the most likely cause. You can gently clean the holes with a small bristle and blow air into the holes. Be careful not the damage the sensor on the other side of the hole. If you need more help, write to me at vinit@prosem.in

First time Pick and Place Machine

Jul 21, 2017 | , but it is way more work than it should be. Do your homework before you buy anything, and if your budget allows to do so (money, floor space, power,air), buy 2 pick and place machines. You can double your output when both machines are up, and if 1 of them goes down you can continue to run by moving all

Which AOI /SPI System is the Best? Viscom S3088; Koh Young 8030 or Parmi Xceed

Jan 22, 2016 | AOI from CyberOptics is simply the best when it comes to all the requirements as you have listed. They are beating the pants of everyone in side by side evaluations. CyberOptics pioneered SPI. How can you go wrong choosing a company that virtually gave birth to all of these new kids on the block

Seeking Thru-hole Process Flow Solution

Oct 24, 2013 | slideline like flow and has the laser for quality purposes. I want to know what else you guys may know of for a flow process with a high mix low volume floor. I don't think we want to spend the money on something fully automated so that won't be in the cards. Also, we produce 2 sided boards (SMT parts) so is there a cut and clinch machine besides Contacts that can cut and clinch with parts on both sides of the board? Thank you

NEED UNIVERSAL MANUAL

Apr 24, 2013 | side A side B can use the same board file) Then afterwards you will want to edit the product to add, Z zones, Feeder setup, Fiduals... Fiduals is a bit odd, after makeing them you will have to go in the order list and define a global correction (use all 3 fids & set scope for board and whole

Machine AOI

May 22, 2012 | board), than the other two. Plus it's lighting was superior than that of the Mirtec. The inspection algorithms are very versatile (like the Mirtec), but I felt the programming was easier and the escape rate less than the Mirtec. A word of advice: Which ever system you purchase, consider one with side -angle cameras, or at least upgradeable to side-angle cameras. This will increase your inspection coverage. You will find that YesTech's support is very good. They have been very helpful to me in the past. I don't know about Mirtec, but YesTech's software is upgradeable for as long as you own it

Stress induced during V-score depaneling

Jun 17, 2011 | of the operators cutting the boards at a different orientation, and on a different line, then had been done in the past. She was cutting component-side up. Traditionally we cut these particular boards upside down. Call it luck, but they were normally cut on different depanelers that did not allow, due to clearance, the boards to be cut component-side up; therefore, they were forced to cut them upside down and we never had issues, until this new operator began cutting the boards on another line and at a different orientation. It wasn't the depaneler itself. We tested it with the board upside down

PTH crystal is malfunction when humidity is up to 90%

Jul 6, 2010 | the failure in the chamber.. The problem disappear when they clean the PCBA bottom side, especially on the crystal area(Bottom side)....Some people think that this could be flux residue related issue..However, the PCBA look clean..I don't think this is flux residue that lead to this problem..As far as I know

Unusual solderability issue

May 7, 2010 | Hi Derek, just curious of one thing - are the vias within the BGA's the only vias covered or are all vias on the board covered. Just trying to figure out what is making this area different from the rest of the board. Regarding leaching, I do not believe this would affect you on the capped side of the board, typical if there were trapped fluids or residues they would leach out of the uncapped side or you would see blistering were the caps have lifted or would show staining. Contaminates with Enig, silver & tin finishes can happen in quite a few placed do to they are put on just after Solder mask

QFP Coplanarity Error

Mar 11, 2010 | Poor man's approach to assessing coplanarity issues: * Get two pieces of 2X4 wood that are the same length, about three inches long * Cut the end of one of the pieces at a 45* angle, so that the 45* angle cut leaves a face on the four inch side of the piece of wood * Glue the two pieces together on the four inch sides, so that the 45* cut faces outward. * Do something to the surfaces of the wood do de-ESDify them, making it easier for the ESD-person to maintain composure when he / she catches you doing this thing * Glue a mirror to the 45* face Tada!!! You have made a Dave's Wonder Coplanarity

Part identification

Jan 6, 2010 | The transistor on your Audiovox VE926 Commax CL-70MA board is double marked. You are looking for a "DF S2N" You're not the first with this problem. Look here for leads: *

Motherboard become NO POST when humidity increase to 90%

Nov 20, 2009 | disappear.. This problem also can disappear if we clean the motherboard bottom side, especially near to the BGA bottom side...This action lead them to believe that this could be flux residue that induce this defect... However,as far as I know, flux residue can cause this problem when its absorb enough

AOI side angle cameras

Jul 14, 2009 | AOI side angle cameras that the machine consistently provided better defect coverage than the competitive machine, especially with regard to solder inspection. All of our machines are configured with side angle cameras. These cameras are fully programmable and are very effective for inspecting regions of interest

Contact Systems Vision Codes

Nov 10, 2008 | parts at the same time, due to different camera settings. That said, if you look down into the tape loaded into the feeder, the single leg side of the SOT23 should be towards the tape locating fingers. This is "Zero" orientation. When the part flys across the camera you are seeing the legs out the left and right side, correct? This, opposed to legs up and down on the screen. Please post the actual error code you are getting. Also, are the Contact machines new to you, or are you experienced with this sort of thing and just stumped on this particular part?

OT: Wavesolder Process Engineer Needed

Jul 15, 2008 | difference unless the wave dynamics change between the front side of the board entering the wave and trailing side leaving the wave. The things you need to check are: A. Is your solder wave set-up with the proper wave dynamics (check the links below last chapter wave setup and wave dynamics). I suspect

What caused this reflow issue?

Apr 16, 2008 | bottom side, and the parts did not fall off until topside, we couldn't check the profile for bottom side. Also, becuase the SMT lead was in a meeting the operators chose to run continuously while tweaking the topside reflow profile. They should have stopped but becuase of the missing SMT lead and mixed

Pasting a thru-hole part at SMT

Dec 5, 2007 | (RA)=(��)(L/2)(L/2)-(��)(H/2)(H/2) Required solder volume (SV)=HV-LV "Required Print Volume (PV)=(2)(SV) (50%) " Required Print Area (PA)=(F)(PV)/stencil thickness F=Inspection Factor .7=no fillet .9=fillet on both sider 0.8=fillet on primary side 1.0=large fillet on both sides Note: Must consider the solder

via under a smd pad ?

Nov 23, 2007 | . * Via plug - From opposite of component side, 50~75% of via, nonconductive epoxy. * Via fill - From opposite of component side, +2 mils, -10 mils of conductor surface, nonconductive epoxy. * Via fill and plate over - Conductive or nonconductive epoxy. No via hole in pad for SMT. Background references

wave soldering + header connector assembling problem

Nov 8, 2007 | the area may also cause some difficulty. I note that the plane is poured on the board edge side of the connector, and I can't see why from this picture (ie. I can't see any of the connector pins on that side of the connector connected to the plane). Other notes in this thread are all valid, as well

CSM VIII Bearing

Oct 16, 2007 | these are the right spare parts pages. Then, you could get a price/availability from Assembleon, hopefully without paying up front, then to be told they don't have any left! What you are looking for is the linear bearing sliders that hold the gantry on the twin tracks at the left and right side of the machine ? If so, two sliders and one rail appear to be listed as a single part (makes some sense). Left rail is "service code" 12NC5322 463 41152 for CSM 66 III and ends with 41154 for CSM 84 and 84V III. The right side rail is 12NC5322 463 41151 for a CSM 66 III and ends with 41153 for the CSM 84 and 84 V III

2512R Lead Free Solder Joint Reliability

Aug 24, 2007 | the reliability of 2512R on L-F soldering. Luky who can buy those books. Found interesting some one proposing to use 2512R High Power Resistor with Wide Terminlas type (the terminal are on chip longer sides instead of on the classic narrow side of chip). It seams they can offer longer life when submitted

Solder wave shutdown

Jun 6, 2007 | Ok smartbutt, you can play evil guru all you want, but you cant dispute math which is a constant thing even on your side of the planet - which you think is the smartest. Letdo the math shall we? Even you have to turn your pot on to solder. You have admitted this so you are one more step closer are on 160 minutes. Now over hear on the dumm side of the planet 280 minuts is biggerthan 160 minutes. Even your hero Mr. Bluebird would agree to this numbers.

Reflow oven profiling - frequency ???

May 16, 2007 | variation int he system. You need to organize yourself a test unit, Datapaq have a good one or you can design your own, I've inlaid thermocouples in a 400mm square CDM carrier before across the width of the oven... that's important, you need to understand the side to side delta in your machines. Once you

Conformal coating IS-410 boards

Apr 21, 2007 | the boards using Bioact EC-ultra. We ran a bare panel right out of the package on only one side and the coating was fine. I put the same board through the reflow oven and coated the other side and the adhsion was poor. I will run some more tests with boards in that particular oven today to asses

Competing in the global economy

Apr 18, 2007 | , China is projected to overtake Germany as the world�s biggest exporter in 2008. Since 2000, China has more than doubled its share in world merchandise exports. Meanwhile, the US trade imbalance with China grew to $232.5 billion, the highest ever with a single country. The United States has accused

soldering robot

Mar 28, 2007 | the SMD. The units Pete C (wonder if he knows Pete F?) suggested are better and faster. Top side wetting is thing to watch out with these machines. Depending on your board and part(s), you may have to preheat to get good top side wetting. Fluxing is another issue. Applying by hand is sloppy and may

Fuji GP-341

Jan 9, 2007 | steps from the GP 2/3 operation manual the reading goes to "2767" while the blade is down then returns to the 2512/oFl4 reading. After a short delay I get an error message "PRESS SET L(R) NG" depending on which side I try to measure. The books do not give much info on this system and Fuji wants me to register the machine before technical support. I wouldn't mind paying Fuji if I knew they could solve the problem. They have not been much help on older machines lately. I isolated one squeegee side at a time and I get the same reading so I believe the transducers are OK. Has anyone come across

TNT-A capacitors placement problem at CP-6

Dec 31, 2006 | Thanks Mika. I will have opportunity to check it out in New Year, because now we dont have production. So far we have beeen using vision type 11 and to be honest this type of defect, that placement of TNTA at flank side, happend very seldom. Usually it happens at the end of reel, and probably ,7; Nozzle =1,3 and with turrent speed 60% and table speed Low with clean nozzle and good feeder we cant protect our product from such situtation and sometimes Cp-6 can put component at flank side. I was trying with Front Light but for this component with bright body and silver J legs vision system cant find

Criteria for thermocouple wire attachment

Dec 21, 2006 | described and get a pretty good profile Paragraph 2 >>>> Now you must take into account your total board mass as well. If you have tons of heat sinks, or parts on the other side that can affect your profile, you should have them on the board when profiling. That�s where the "engineering" part in all this comes in. 2. When profiling something like a D-Pak, you may want to drill a hole form the opposite side thru the board so the t-couple hits the ground pad od the D-Pak. Use adhesive to fill the hole and keep the t-couple in place. This will give a very accurate reading of what a real board

BGA ball crack at pad/solder ball interface

Nov 29, 2006 | Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach heat sink to the BGA. Heat sink anchor pullout is a retention spring that press across the BGA package top surface and locks on both sides at the 2 hooks soldered to the board next to the edge of the BGA package. We found crack at the corner and outside rows of BGA ball. The crack appear at the pad/solder ball interface, but, majority are still

Air inclusion in solder paste

Mar 26, 2006 | Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in middle) We get what appears to be random not to fold in air when exercising before putting on the stencil. What I am wondering is if the printing process itself is bringing air into the paste. At the start and end of the print stroke the blades lift, generating a slight peak. As the next blade comes in contact with the paste from the opposite side

Fighting solder beads

Mar 18, 2006 | Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finepitch one (pitch = 0.5mm). Please find geometry and process parameters below: Pad size: 0.508mm x 0.254mm Aperture size: 0.482mm x 0.229mm (12.5um reduction from each side) Solder paste type: type 4, particle size: 20um-38um Squeegee pressure: 5.4kg Squeegee speed: 50 mm/sec Separation speed: 20 mm/sec Stencil type: nickel, electroformed Stencil thickness

Question on Thermal Overstress on BGA Balls During Rework

Mar 17, 2006 | side. The bulge was only present on one side, and not on every ball (maybe 10% of the balls were affected). The joints had a dull grey finish on visual inspection, which I at first attributed to using 63-37 paste on an ENIG finish PWB. Now I am not so sure. Could this have been a device

Paste in hole (sate of the art)

Feb 21, 2006 | -layers plated up 1 oz. Most of theses designs have inter-layer connections to the pins. All of the assemblies are two-sided surface mount and the interface to the customer is generally PTH connectors or PTH pins that are either coined or turned, square or round, and range in diameters from 0.020 to 0 the math, over-size the apertures and rely on the wicking-effect to from the solder-fill during second-side reflow. For the friction-fit pins, we do the math and ensure only the plating in the barrel comes into play, keeping the FR4 out of the way since we would violate IPC, customer desire, common

CP6 Nozzle sticking

Jan 27, 2006 | be coming from the pick up side of the machine instead of the placment side.

Lead free component VS vision on Mydata M12

Nov 9, 2005 | week or two, you WILL get a response. The vision on the 0805s, I can attest that it is due to the plating. I had a header yesterday that was giving me fits, since it only had leads on one side, and the plastic body was a glossy white. After reading all the literature on lighting, etc underneath, ambient is 45 degrees and back is usually on the side. I have had great luck in adjusting these numbers, but takes a while to get used to. Hope this helps. Dan

Lead free component VS vision on Mydata M12

Nov 9, 2005 | position from the feeder I look at two 0805 sitting side by side, one RoHS and the other one non-RoHS, the difference is obvious. The RoHS part is doll VS the non-RoHS is shinny. Thanks ! Red

A.O.I recommendation

May 26, 2005 | Good Morning, We have several Mirtec table top machines. We bought the first one when it was under the Samsung name. We had the advantage of doing a side by side comparison with several other systems. The Mirtec was the leader in performance. Since our initial purchase, we have transitioned from

Solder in wave soldering: Which one is the best?

Feb 28, 2005 | TO JAY: What type of assemblies are you having 50-75% fill on. - Capacitor, resistor Are they single sided? - Yes Plated through hole? - No Is this a recent problem? - Yes, first time, but we don't know how long it last. TO RUSS: What is your topside preheat temp just prior to hitting residues on the bottom side, we don't know why and how ... What is your flux application method? - Spray fluxer (lateral movement) Have you tried other fluxes from Alpha and/or other Mfgrs? - Not for the moment

AOI

Jan 26, 2005 | Good Morning TM, We have a table top AOI (actually several of them) We did a side by side evaluation when we first looked at it. We looked at Qualectron, NSpec and Mirtec (Samsung at the time). Some of the criteria that was important to us: *Library Based- you do not want to have to reprogram

PBGA vias throwing solder balls

Sep 14, 2004 | be more trouble than they�re worth. "1) Reduce via hole size" [If you reduce the via drill size below 18 thou, you see additional charges and probably see no improvement.] "2) Use blind vias (not sure this is possible)" [This sounds daunting, without seeing your board.] "3) Button fill from the pad side - mask can not get into pad area (not sure Suppliers can manufacture reliably)" [This has potential. Eliminate the plugging from the bottom-side if you do this. Why aren�t we doing this in the first place? Regardless, you�ll still see solder balls.] "4) Allow solder balls as long as they can not short

MPM AP25 Calibration

Jul 27, 2004 | Not an easy task and requires calibration jig. MPM support field service is your best bet. The adjustment screws for the prizm located on left side of camera will adjust the x direction. There is a set screw on the front that must be loosened first. The prizm is in like a little cradle The adjust sets on the left push on each side of the cradle so if you loosen one say the top one and tighten the bottom one it will pitch the prizm counter clockwise looking from the front. This adjusts the x offset. For Y there is another set that holds the whole cradle in place. Loosen this set and a sloted

Warming up solder paste at start of days production

Jul 27, 2004 | of each and run them side by side after a month or so of storage. I am willing to bet that you will see no performance differences. Even as far out as six months. Anyways, that's my two cents. Carry on.

squeegee blade design

Oct 23, 2003 | The SEMA listing [ http://www.smema.org/smema5.pdf ] says: * D CUT SQUEEGEE: A single diamond edge squeegee which is shaped like an upside down house and made of polyurethane. * FOUR-SIDED DIAMOND EDGE SQUEEGEE: A polyurethane 3/8 x 3/8 four sided, four edged squeegee. The diamond corners are used as the printing edges. * TRAILING EDGE SQUEEGEE: Any squeegee mounted at an angle such that the printing edge of the squeegee trails behind the print head and the face of the squeegee slopes forward. Alden Johnson at Cookson

OMNIFLOW 10

Sep 18, 2003 | machines to air cooled. Maintenance of a Nitro Cool system is high compared to an air cooled machine. I then went from Omniflo 7 ovens to Omniflo 10's to shave off reflow time. With the Electrovert air cooled ovens, I found that by specifying a 6", exit side, exhaust port, it performs better than the stock 4" diameter arrangement. The nitrogen oven is specified at 150cfm for both entrance and exit exhaust ports. The air cooled oven is 150cfm at the entrance and 300cfm at the exit exhaust. This bias towards the exit side of the oven helps to keep it clean even in a high volume environment

Moisture under chip capacitors

Sep 11, 2003 | I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look at one board which was reported to have a 0805 56K the following: http://www.stevezeva.homestead.com/files/SMTAdhesive.jpg The image showed the bottom side of the cracked resistor after removal (white), with a portion of solder mask (green) and SMT adhesive (red

Automation Equipment Registration Fees

Jun 12, 2003 | . As an objective (not an end user of a P&P machine nor do I work for an OEM manufacturing such equipment) reader, both sides make logical oints as to why the fee is/isn't justified. It seems those who are hard hit by the whole "fee" policy are either owners of the equipment who became owners before the policy and the right to examine their financial records. Always wondered what is the profit margin of an OEM in a 2 billion dollar industry. On the other side, in the defense of the placement machine OEM's, those nice brochures don't come cheap.

Wave soldering profiling

Jun 10, 2003 | Preheating: The temperature of the board (component side) during preheating should go as quick as possible to 45 �C (with maximum slope of 2 �C/Sec) and just before soldering an temperature of 85 �C. Wetting time: The time between the moment of first contact (between the parts to be soldered in the areas on the component side of the board. However, forced cooling directly after solder bath, may cause unequal contractions, which will initiate cracks and therefore not advised. If cooling down is needed because of the temperature from the carrier is rising to high, the best place will be before

Standard kit in LVHM environment

May 13, 2003 | ,000 Siplace performs 100 % or if I paid only $ 30,000 for it and I am happy if it does only 50 %. If I run two machines side by side, I�m faster and more effective, than with any number of change over tables, which are rare and expensive even on the used machine market. The Siplace S 20 was certainly

BGA attach eval.

Apr 1, 2003 | side of the board to prevent the dye from escaping through them. * If that is not possible, place the sample in a glass beaker. 1.2 Fill the dam with dye [We just use ITW Dymon, DYKEM Steel Red, 800.443.9536. There are 'real' dyes out there that are very good.] or alternatively pour the dye the viscosity of the dye getting too high. 1.5 Pour the surplus dye from the sample. 1.6 Dry the sample at 100�C for 15 minutes. 2 Remove the part 2.1 Close and secure vice grips on the part. 2.2 Gently twist the part on a plane parallel to the board. 2.3 Move the vice grips to the other two sides and twist

Capillary Underfill process

Facility Closure