Electronics Forum: double and reflow and design (Page 1 of 11)

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 07 02:24:54 EDT 2019 | ameenullakhan

Hi Dave, Yes the lead was there before reflow. After reflow it has bent inside. The component was inspected before placement. We are unable to analyze, what might have went wrong. Regards, Ameen

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Aug 13 02:33:04 EDT 2019 | ameenullakhan

Hi , Thanks for the reply. Yes CCGA was checked before placement and sending to reflow oven. The latest suspect form few cross functional team member is like. It is due to improper reflow profile " Column kick out " has happen. I am

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Thu Aug 22 22:19:13 EDT 2019 | sssamw

From the picture you present, it is a pin in paste part with pin length 2.2mm (a good length for 1.6mm PCB thickness), and seems the pin tilted and touch on PCB surface, thus causes up-part. Sorry I cannot image pin tilted not before placement but i

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef

I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 05:28:47 EDT 2019 | ameenullakhan

Your inputs are always valuable and help a lot. Thanks for the inputs.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 09:50:51 EDT 2019 | ameenullakhan

Attached is the image of lead lift in ccga

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan

thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 02 10:06:37 EDT 2019 | davef

I don't get it. The liquidus of 80Pb/20Sn is like 280*C. Your reflow temperature got nowhere near that value. Where did that material go? Is it folded back under the component? Disappeared? Was it ever there? Ask someone while analysis tools to hel

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan

Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef

Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.

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