Electronics Forum | Wed Jan 05 07:40:06 EST 2000 | jacob lacourse
we have looked into a number of depaneling machines and can't justify the cost. what we are trying to do is to eliminate failures due to part stress when employees are breaking out the boards by hand. I heard about pneumatic scissors one day but to
Electronics Forum | Wed Jan 12 16:53:06 EST 2000 | Jason Webbs
Jacob, There are several companies I saw at a recent trade show that had "nibblers" that snap the tabs out. They are also called "board shockers" because they really shock the boards when they snap out the tabs. I did talk to a guy from a company
Electronics Forum | Fri Dec 17 06:11:33 EST 1999 | Christopher Lampron
Henry, TNT makes some good points. I have also found that the use of a 2% silver solder paste (provided that it's allowable) can help reduce the occurance. You may want to run a thermal profile on the PCB is question. Is the board thermaly equalized
Electronics Forum | Tue Dec 21 19:57:45 EST 1999 | Russ
All of the information so far has been great, I would like to add one more thing to the puzzle. We have utilized a "homeplate" aperture on the stencil when the pad geometry or PCB design prohibits all of the above mentioned remedies. The hompeplat
Electronics Forum | Thu Dec 02 09:56:32 EST 1999 | Larry Johnson
Okay, I believe that the XY table on our CP4-2 is not working correctly. When we place smaller parts (603,805,RNETS, etc...) they aren't seated in the paste all the way. Larger parts aren't a problem. They are kind of "floating" on top of the paste.
Electronics Forum | Thu Dec 02 09:45:02 EST 1999 | Larry Johnson
Okay, I believe that the XY table on our CP4-2 is not working correctly. When we place smaller parts (603,805,RNETS, etc...) they aren't seated in the paste all the way. Larger parts aren't a problem. They are kind of "floating" on top of the paste.
Electronics Forum | Sun Nov 14 11:45:08 EST 1999 | Jeff Ferry
Back to Wolfgang's original request. Stacking chip components is just one of many unusual mods that are being added to IPC 7711 Rework of Electronic Assemblies. While some may deem this technique unacceptable, it is a relatively common practices
Electronics Forum | Thu Oct 28 17:46:44 EDT 1999 | Gary Kemp
My company manufactures memory modules and I'm finding solder specs on the gold fingers following the reflow process. We are using a no-clean solder paste. The spec sheet warns against crossing the 140 degree C mark during the soak stage, preventin
Electronics Forum | Thu Oct 28 18:14:51 EDT 1999 | John Thorup
Try looking for paste contamination somewhere. Dirty stencil, printer table or fixtures. Placement table/fixtures. Reflow belt/conveyer. Reuseable finger covers, if used. Try covering the fingers with Kapton tape during different stages of the proc
Electronics Forum | Thu Oct 14 09:05:17 EDT 1999 | Brian
Nancy, Cliff, There are pros and cons. Some of the longer threads take an age and a day to download when the server is busy, if everything is intact since the birth of Adam. Personally, I prefer it as is because I'm damn lazy and hate scrolling down
.gif)
