Electronics Forum: downs (Page 311 of 462)

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Thu Sep 11 09:59:47 EDT 2008 | rarnold

Paste stored tip down, so separation in the tube is not suspect. Remember that the defect was produced on a screen printer running with a Rheopump. A few more details are that the strip of the board containing the uncoalesced solder is consistent w

NEW to Philips Topaz-X need help programming

Electronics Forum | Sat Nov 29 09:56:59 EST 2008 | blacksi27

What the other user was talking about is correct, converting it from gerber to machine cad. It is hard explaining programming SMT to a new user unless shown by another experience operator. I am also getting a topaz x pretty soon and I'll try to hel

OSP coating verification

Electronics Forum | Mon Sep 29 17:31:39 EDT 2008 | davef

Q1.Does anyone know a way to verify the amount of OSP coating on a board? A1. There is no specification. Thickness is difficult to measure. Thickness is product related. There are at least six major suppliers. Years ago, here on SMTnet, J Medernach s

SMT Connector, Placement Issues

Electronics Forum | Fri Oct 03 10:24:17 EDT 2008 | chineechooze

I have a problem with placement repeatability and accuracy on this Samtec connector. The customer wants to use a "nubbed connector" which has to be placed in the corresponding PCB holes. When the nubs miss the holes, the part becomes "lifted." SEE

Problems placing PLCC4 parts with Fuji IP1 - any help/ideas?

Electronics Forum | Wed Oct 15 17:20:57 EDT 2008 | mbrunton

2, I have to scroll down to the bottom to see the image... and the outline of the legs isn't very clear. The legs are sort of blurred together. I had tried lowering the CCD offset in the part definition to -50, but it still looked bad. Could this

BGA soldering & BGA ball formation

Electronics Forum | Mon Nov 17 09:47:25 EST 2008 | cisridn

I would not recommend doing BGA soldering with only a hot air gun. I have done it in the past, but the boards would eventually come back from the field because the solder joints did not form correctly and the BGA would have to be reworked again. I

Shielding from Nearby Heat-Any Tricks

Electronics Forum | Wed Dec 24 18:31:04 EST 2008 | hegemon

If they share a common ground plane you are in for some difficulty in trying to prevent the second part from heating too much. What happens to the underfill material when it is softened by being heated beyond the 160C? Does it harden up again, or b

MPA III Power source

Electronics Forum | Wed Jan 21 10:27:27 EST 2009 | gidster

Ok. As you know the machines changed a bit after > 95 due to CE regulations. > > There are no drawing > on board/box level in Panasert > machines. > > However normaly i`ts the 100 volts > thats "shorting out" the machine and shuts it > down. C

CM cost formula

Electronics Forum | Fri Feb 06 15:12:51 EST 2009 | ccross

You need to base your costs on your labor and overhead rate as well as how much your other expenses are(selling, admin, etc) and profit you want to make. For example (let's use nice round numbers) if you place 10,000 parts per hour and your labor an

Larger than 18" on Quad QSP-2

Electronics Forum | Tue Mar 10 11:23:26 EDT 2009 | vetteboy86

I am setting up a board that is 18.27". In order to be able to reach the whole board, I need to slide the touch stop assembly a few inches further down the slide. After I completed this task, the board will not feed up to the touch stop. The board st


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