Electronics Forum: dpak and misalignment (Page 1 of 2)

Re: D-Pak misalignment Problem

Electronics Forum | Fri Dec 03 18:01:56 EST 1999 | M Cox

Usually the alignment problem comes from pad design. The ground pad (largest) is too small. If that is the case (and even if it isn't) try placing a dot of SMT adhesive before placement (it will cure before reflow and hold the part in place). Goo

D-Pak misalignment Problem

Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss

We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve

Re: D-Pak misalignment Problem

Electronics Forum | Sat Dec 04 09:42:18 EST 1999 | Chris McDonald

Just as explained in a follow-up you are getting too much paste on the pad. The pad is probably the right size but you cant have your aperature the same size as your pad. What we have done is put a Cross in the stencil. This will reduce the paste and

Re: D-Pak misalignment Problem

Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss

Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb

Re: D-Pak misalignment Problem

Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron

Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad

Re: D Pak stencil apertures

Electronics Forum | Fri Dec 10 10:25:59 EST 1999 | Wolfgang Busko

Hi Larry, you might find something looking for the thread "D-Pak misalignment Problem - Kantesh Doss 23:43:23 12/02/1999" Good luck Wolfgang

SMT optimization and improvement

Electronics Forum | Wed May 31 22:17:24 EDT 2006 | EC

Hi Jack, I do not know what type of machine you are using and how old is your machine. But I have this problem before using Fuji machine. There are few things cause part throw.....placment speed, feeder, pick up tolerance, part dimension tolerance,

Rework and repair system suggestions

Electronics Forum | Fri Jan 28 09:30:07 EST 2005 | reash

Well the powers that be actually want to go with a regular rework station, for future growth. I guess they plan on using BGAs sometime in the near future. We're also planning on using a D-Pak device in this first board. So now we're looking at the

New Pick and Place Operation

Electronics Forum | Mon Jan 09 18:51:05 EST 2006 | grantp

Hi, I have used both MYDATA TP9, MY9 and more recently MY12. MYDATA machines are just not accurate, and we did everything possible, and every kind of upgrade they had. We ended up putting in Fuji XP based machines, and the differences are very notic

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno

We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with

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