Electronics Forum: drafted (Page 1 of 6)

Re: US implementation

Electronics Forum | Thu Jul 20 17:03:04 EDT 2000 | Bob Willis

Yes this is the draft plan in Europe 2008. Bob

X-Ray Criteria for BGA Solder Ball

Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory

It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography

X-Ray Criteria for BGA Solder Ball

Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory

It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography

SMT machine shift to China

Electronics Forum | Thu Jan 11 18:21:07 EST 2007 | SWAG

We shipped one to Canada (draft dodger).

Re: Compliance

Electronics Forum | Thu Jul 20 16:32:01 EDT 2000 | Bob Willis

I guess you are refering to lead free solders. If you read through the draft directive the plans are defined but not who will do the monitoring. Some companies do have the ability to do this sort of task but not all. The latest documents are availab

Solderability test method (LF) for bare PCB brd

Electronics Forum | Mon Jan 23 20:58:08 EST 2006 | davef

J-STD-003B - Solderability Tests for Printed Boards is currently a "Working Draft". Look here: http://www.ipc.org/status.asp

Studie of the RoHS directive

Electronics Forum | Fri Jan 18 15:00:03 EST 2008 | patrickbruneel

European rocket science!!!! A 189 page report to conclude that if you ban something you will use less of it. http://ec.europa.eu/enterprise/environment/reports_studies/studies/draft_rep_study_rohs_directive_dec07.pdf

Batch cleaner

Electronics Forum | Wed Sep 01 01:47:43 EDT 2010 | markhoch

Sheesh Mike. Can I get you to do my homework too? I've got a term paper coming up on Forcasting Advancements in Artificial Intelligence. Due in two weeks. Let me know when you've got a rough draft I can critique. ;)

BGA Rework affected by cold weather?

Electronics Forum | Fri Dec 05 10:09:36 EST 2014 | robl

Hi Rob, Could be moisture getting into the boards or the BGAs or it could be drafts messing with the thermocouples measuring the heat at board level meaning you over cook it. Are you pre-baking the PCBAs & the BGAs before reworking and replacing?

IPC A-610 Moving from Rev E to Rev F

Electronics Forum | Tue Jul 04 20:31:21 EDT 2017 | davef

If you want in, 5-21h Bottom Termination Components (BTC) Task Group is in "Working Draft" revision from "A" to "B" of IPC-7093 - Design and Assembly Process Implementation for Bottom Termination SMT Components

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