Electronics Forum | Fri Jul 04 05:40:09 EDT 2008 | proy
Thanks, I'll give this a try. Peter
Electronics Forum | Fri Jul 04 00:36:25 EDT 2008 | shrek
Try a linear, very flat ramp rate on the order of 0.5 degrees celcius per second. I know this is hard to accomplish with a five zone, but try to lower the first couple of zones (the preheat zone), and then spike to reflow aggressively during your la
Electronics Forum | Thu Jul 10 10:25:05 EDT 2008 | gregoryyork
I guess the paste is Leaded hence the 220 Peak temp and the Sn100c is Eutectic at 227C so you need to be hotter to melt the HASL finish or you are relying on it alloying together with the paste which takes much longer. suggest running peak temp of 23
Electronics Forum | Thu Jul 03 19:27:54 EDT 2008 | proy
5 Zone HVA70 Oven Board 6 layer, 10" x 13" lots of space, most critical is 100 pin QFP AIM Water Soluble 487 Tin Lead paste on SN100C HASL boards This board is giving me disproportionate grief! I am running 23 in / min which gives me about 3.1 mi
Electronics Forum | Tue Jul 08 22:44:06 EDT 2008 | proy
I made progress and almost acceptable results by adding heat to the bottom of zone 4 HOWEVER, the core problem I uncovered last night/this morning was that the #4 top side blower had failed. I think this is the key why I was having so much trouble.
Electronics Forum | Tue Mar 04 08:56:38 EST 2008 | tonyamenson
I talked to a solder paste chemsist and found out a few things. From above (Dave F) states a test for solder paste involving reflow on a non-wettable surface. Commonly known as the solder ball test this test is performed all the time by paste manufa
Electronics Forum | Fri Feb 29 08:12:56 EST 2008 | davef
Solder paste suppliers often make recommendations on solder paste handling after removing it from the container [eg, jar, cartridge, etc]. For instance, Multicore Solder Paste Handling Guidelines, September 2004 says: As a general rule, paste that h
Electronics Forum | Tue Mar 27 01:52:23 EDT 2018 | buckcho
Hello Diego, are the components missing on the first side or the second side. Like Mr. Evtimov said, you can check before the oven the pcbs's visually and see what happens after the oven. In this way you can see if it is the oven for sure. Then there
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
Electronics Forum | Sun Mar 25 08:45:00 EDT 2018 | jacobidiego
Normally some random components of size 0604 or below and may be due to a thermal mass being close like a transformer or AC electrolytic caps. We tried changing fan speed, but this will change the thermal profile and avoid the thermal mass from bein
