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EMPF PP0014 - Conformal Coating Adhesion Over Low Residue Fluxes (May 1995)

https://store.aciusa.org/EMPF-PP0014-Conformal-Coating-Adhesion-Over-Low-Residue-Fluxes-May-1995--P98.aspx

) solder mask, and dry film solder mask when processed with low residue fluxes.  Test coupons were environmentally stressed and compared to coupons processed with a control group containing no flux and paste residues ) conformal coatings when applied over test coupons and mixed technology PWAs manufactured with low residue fluxes and pastes.  This study evaluated conformal coating adhesion to common printed circuit materials such as bare copper, hot air solder leveled (HASL), photoimageable (PI + Add to Cart Categories There are no subcategories. Share Tweet Pin It Recently Viewed EMPF PP0003 - Manufacturing Surface Mount Assemblies Using Lead Solder Replacements (June 1994) 400008 Price: $0.00 + Add to Cart IPC A-610 Rev. E to F Update Guide Price: $0.00 + Add to Cart Empfasis - Vol. 7 - No. 1 EMPF-V7-N1 Price: $0.00 + Add to Cart Top Sellers EMPF RB0009 - Solder Joint Volume Calculation Using a Spreadsheet (June 1993) 400027 Price: $0.00

Solder Mask Material - PCB Assembly,PCB Manufacturing,PCB design - OURPCB

https://www.ourpcb.com/solder-mask-material.html

. This technique is known as the dry film solder mask. The thickness of copper traces and complexity of PCB designs guide for the solder mask material   thickness Solder Mask Material - PCB Assembly,PCB Manufacturing,PCB design - OURPCB Skip to content Call Us Today:+86-311-87874960 | info@ourpcb.com Home About us Payment terms and conditions Custom Cable Assembly Custom Wiring Harmess PCB Manufacturing Manufacturing PCB Prototyping PCB Capabilities PCB Equipment PCB Gerbers PCB Assembly PCB Contact Us Home / Solder Mask Material Solder Mask Material Printed circuit boards usually have very closed space traces of copper and component pads . In addition to benefits as mentioned above, solder mask material also protects from scratching effects of movable electronics parts and thermal aging as shown in the figure below . Other names of solder mask material include solder resistance and solder stop masking. Photography is a technique to remove the solder mask material

Tenting Via - The Ultimate Guide To The Importance of PCBs

https://www.ourpcb.com/tenting-via.html

. Earlier, manufacturers had to face difficulty in tenting the vias as they used liquid photo-imageable (LPI) solder mask. But with the introduction of dry film solder mask, the process has become much easier . You can apply the solder mask over vias during the assembly process. First, the whole surface of the board is coated with solder mask ink and then left to dry . Our discussion will cover the various processes used to fill vias and the advantages associated with each of them. What is Tenting Via Solder-Filled Vias Better PCBs in Eagle Vias Not Covered Via in Pad Via Plugging Conclusion   1 . A via may be tented or left exposed — a tenting of a via means that solder mask has been used to cover the via over the hole in the shape of a tent or a skin . Tenting a PCB brings down the number of exposed conductive pads and reduces the chances of shorts arising from solder bridging. It also protects the vias from corrosion and external elements

Seika Introduces the McDry DXU-401DP Pass Through Dry Cabinet | Seika Machinery, Inc

http://seikausa.com/news/seika-introduces-mcdry-dxu-401dp-pass-through-dry-cabinet

Seika Introduces the McDry DXU-401DP Pass Through Dry Cabinet | Seika Machinery, Inc Skip to Navigation ↓ Torrance, CA  Phone: (310) 540-7310  | Atlanta, GA  Phone: (770) 446-3116 San Francisco, CA  Phone: (510) 293-0580 | 24-hour Answering Service: (888) 734-5278 Search form Search Main menu Home Products Rubber Testing SEIKA TV News Representatives Company Info RFQ Seika Introduces the McDry DXU-401DP Pass Through Dry Cabinet TORRANCE, CA — February 2014 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the new McDry DXU-401DP Pass Through Dry Cabinet .   The McDry manufacturer continues to develop dry cabinets that meet the demand and requirements of an increasingly time-sensitive market . McDry cabinets dehumidify ICs to prevent micro-cracking and are an alternative to baking, MBBs and Nitrogen storage. The DXU-401DP Pass Through Dry Cabinet will be displayed for the first time in Booth

Solder Paste Recycling System | Green Technology | Seika Machinery, Inc

http://seikausa.com/solder-paste/recycling-system

: Recycling System Solder Paste Recycling UnitSolder paste used with screen printers has a limited shelf life. When solder paste is exposed to the environment, solvents evaporate and cause it to dry Solder Paste Recycling System | Green Technology | Seika Machinery, Inc Skip to Navigation ↓ Torrance, CA  Phone: (310) 540-7310  | Atlanta, GA  Phone: (770) 446-3116 San Francisco, CA  Phone: (510) 293-0580 | 24-hour Answering Service: (888) 734-5278 Search form Search Main menu Home Products Rubber Testing SEIKA TV News Representatives Company Info RFQ Solder Paste . This leads to misprints, which requires disposal since it is no longer useable. However, instead of disposing of it, solder paste now can be recycled in-house . Seika's new SPR Unit enables the separation of flux and solder, using a special solder pot mechanism that inverts during each cycle. In approximately 34-45 minutes, the unit turns wasted solder paste into solder bar

3D Automated X-ray Inspection Systems - Saki Products

https://www.sakiglobal.com/automated-x-ray-inspection-axi-3d-products.html

for: Absence of solder Bridging Dry joints Fillet defects Foreign material Head-in-pillow and non-wetted defects Insufficient solder Lifted bump Lifted chips Lifted leads Misalignment Opens Presence , such as dry joints and voids, and generates the associated data. The systems are built on a one-ton granite base with a rigid gantry structure for stability that delivers extremely reliable, consistent, clear images and results and ensures the thermal stability . It is the ideal inspection platform for various test applications, including a wide range of solutions for non-destructive testing (NDT). Its customized solutions can be used in the semiconductor industry to inspect electronic components and solder in applications such as flip chip attachment, laser through-hole (LTH . Saki's PCT technology utilizes a high-resolution image composed from 200 imaging slices acquired through the board, solder joints, and components, whereas other AXI machines only use about five slices for imaging of continuous 3D images without joints. Reconstruction of images is done on-the-fly, for every solder joint, creating 3D data for the entire sample

True 3D X-ray Vision Inspection Systems - Saki America

https://www.sakiglobal.com/automated-x-ray-inspection-axi.html

. Such precision machine control, 3D reconstruction, 3D inspection, and 3D viewing are all unique developments by Saki. AXI inspects for: Absence of solder Bridging Dry joints Fillet defects Foreign material Head-in-pillow and non-wetted defects Insufficient solder Lifted bump Lifted chips Lifted leads Misalignment Opens Presence . Saki's PCT technology utilizes a high-resolution image composed from 200 imaging slices acquired through the board, solder joints, and components, whereas other AXI machines only use about five slices for imaging . Saki's AXI systems address 3 market segments: Printed circuit board (PCB) – usually part of the PCB assembly process after reflow Solder ball joint inspection of BGAs Solder joint inspection on the back face of QFNs Solder joint inspection for all parts such as chips , connectors, and insert parts on the PCB Power module High power X-ray tubes (225kV) Void inspection inside the solder joint of an insulated gate bipolar transistor (IGBT ) soldering inspection AXI is the best technology for accurately reconstructing the shape of solder balls and fillets to perform reliable solder inspection

http://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/ti1-zestron-sw-en.PDF

.  Dries fast and residue-free on stencils after dry wipe.  Good delineation stability and reduced solder balling (see Technical Information 4 . Areas of application: Stencil underside wipe cleaning Additional product information: Solder paste (unsoldered) ++ Technical Information 3 @zestron.com Advantages compared to other cleaners:  Due to its wide process window ZESTRON® SW reliably removes solder pastes from the stencil underside – 0 PPRROODDUUCCTT FFEEAATTUURREESS Extensively tested and suitable for cleaning of lead-free solder pastes Product is free of any critical substances according to SIN & SVHC lists 100 . Drying SMT printer with or without vacuum drying ZESTRON ® SW Dry fleece or vacuum

https://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/ti1-zestron-sw-en.PDF

.  Dries fast and residue-free on stencils after dry wipe.  Good delineation stability and reduced solder balling (see Technical Information 4 . Areas of application: Stencil underside wipe cleaning Additional product information: Solder paste (unsoldered) ++ Technical Information 3 @zestron.com Advantages compared to other cleaners:  Due to its wide process window ZESTRON® SW reliably removes solder pastes from the stencil underside – 0 PPRROODDUUCCTT FFEEAATTUURREESS Extensively tested and suitable for cleaning of lead-free solder pastes Product is free of any critical substances according to SIN & SVHC lists 100 . Drying SMT printer with or without vacuum drying ZESTRON ® SW Dry fleece or vacuum

Microsoft Word - Spheres_TDS.doc

https://qualitek.com/wp-content/uploads/2017/12/bga_td_all.pdf

& Storage Q-Pearl Solder Spheres are available in 50K per vial or in bulk quantities upon request. Recommended storage is in a clean, dry environment Microsoft Word - Spheres_TDS.doc TECHNICAL DATA SHEET Solder Spheres, Rev. 0, 11/17 QUALITEK ® Q-PEARL SOLDER SPHERES CORPORATE HEADQUARTERS USA: 315 Fairbank St. Addison, IL ● 630-628-8083 : 3B/F, YiPa Print Bldg. 351 # JiHua Rd., Buji Shenzhen, China 518112 ● 86 755 28522814 ● FAX 86 755 28522787 TECHNICAL DATA SHEET Solder Spheres, Rev . 0, 11/17 Description Qualitek ® Solder Spheres are designed for higher I/O and performance-driven applications. Newer integrated circuits contain ball grid array (BGA ) and chip-scale packaging (CSP) formats where solder spheres replace I/O pins. Qualitek Solder Spheres are manufactured using alloys with very low oxide levels that meet IPC-J-STD-006C requirements

LFTipTinner_TDS.pdf

https://qualitek.com/tip_tinner_bi58_tds.pdf

LFTipTinner_TDS.pdf Lead Free Tip Tinner DESCRIPTION Tip Tinner is a mixture of solder powder and thermally stable, oxide-reducing compounds : SnAgCu, SnAg, SnBi, SnCu Tip Tinner is packed in 1 ounce cans. STORAGE & DISPOSAL Tip Tinner should be store in a cool, dry place. Dispose of in accordance with local regulations. Qualitek ® is a trademark of Qualitek International, Inc. TEL: (630) 628-8083 FAX: (630) 628-6543 E-MAIL: solder@qualitek.com HOME PAGE:http://www.qualitek.com HEADQUARTERS: 315 Fairbank St., Addison, IL 60101

Ultrasonic Stencil Cleaning Process and Eco-Friendly Products from KYZEN

https://www.kyzen.com/processes/ultrasonics-2/

volatility to rapidly evaporate and dry after  cleaning ULTRASONIC IMMERSION / WATER RINSE CLEANING PROCESS ( AQUANOX A8830 ) Step 1: Aquanox A8830 cleans solder paste from stencil apertures in ultrasonic cleaning tanks, using a 10 > Electronics Assembly Cleaning > Ultrasonics Ultrasonics Ultrasonic stencil cleaning is one of the preferred methods for removing trace levels of solder paste from stencil openings . The desirable properties of a reliable stencil cleaning agent include: The ability to rapidly dissolve the solder paste flux vehicle Material compatibility with the nano-coating and equipment Non-flammable Low odor Ability to rinse with the cleaning agent Sufficient : Aquanox A8830 rapidly dissolves the flux composition for all solder paste types including water soluble, rosin and no-clean. Step 3: Maximum wash cycle time is typically less than 4 minutes. Step 4 : Aquanox A8830 easily rinses with water, leaving no residue on stencil surfaces.  The active ingredients in Aquanox® A8830 are not consumed during the solder paste cleaning process and very little chemistry is lost when running at ambient process temperatures

Cybersolv C8882 | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions

https://www.kyzen.com/products/cybersolv-c8882/

> Cybersolv C8882 Cybersolv C8882 Cybersolv® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. Cybersolv C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes . Cybersolv C8882 is a solvent-based stencil cleaning fluid specifically designed to clean wet solder paste, SMT adhesive and flux residue from stencils (conventional and plastic pump), mis-printed PCBs, wave soldering pallets and tools, fixtures and squeegees. Cybersolv C8882 dissolves the flux vehicle, which allows solder balls to release from the stencil during the stencil printer wipe sequence : Understencil Wipe Cleaning – Solvates the flux resin compositions within uncured solder pastes. Effectively cleans and removes solder paste that has a tendency to stick to the aperture walls and bottom of the stencil . Following the wipe process, a dry wipe and vacuum process rapidly dry the stencil following the cleaning process. Hand-wipe, Immersion Stencil and Pallet Cleaning

Metcal Tip Care Poster 2014

https://www.okinternational.com/File%20Library/Metcal/Application/HandSoldering/Solar/Extending%20Tip%20Life/Metcal-Tip-Care-Poster-2014.pdf

Metcal Tip Care Poster 2014 Tip Care DON'T use small, ne tips unless necessary DON'T use a dry sponge, a rag, or an abrasive to clean tips DON'T use household sponges DON'T leave the system running after you are nished DON'T put tips away dirty and untinned DON'T use tip tinners to clean tips DON'T use excessively high temperature series tips DON'T drag solder with general purpose tips DON'T feed solder to the tip DON'T use high temperatures with no clean uxes DON'T use pilers on a tip cartridge DON'T use excessive or overly active ux DON'T press down, or rub the tip hard over leads DON'T use & de-ionized water DO turn the system o when not in use DO tin tips with RMA-cored solder when nished DO use Metcal’s brass brush to clean heavily oxidized tips DO use the lowest possible tip temperature series for the job DO use specialty tips for drag soldering DO feed solder directly to the joint DO avoid high-activity

Metcal Tip Care Poster 2014

http://www.okinternational.com/File%20Library/Metcal/Application/HandSoldering/Solar/Extending%20Tip%20Life/Metcal-Tip-Care-Poster-2014.pdf

Metcal Tip Care Poster 2014 Tip Care DON'T use small, ne tips unless necessary DON'T use a dry sponge, a rag, or an abrasive to clean tips DON'T use household sponges DON'T leave the system running after you are nished DON'T put tips away dirty and untinned DON'T use tip tinners to clean tips DON'T use excessively high temperature series tips DON'T drag solder with general purpose tips DON'T feed solder to the tip DON'T use high temperatures with no clean uxes DON'T use pilers on a tip cartridge DON'T use excessive or overly active ux DON'T press down, or rub the tip hard over leads DON'T use & de-ionized water DO turn the system o when not in use DO tin tips with RMA-cored solder when nished DO use Metcal’s brass brush to clean heavily oxidized tips DO use the lowest possible tip temperature series for the job DO use specialty tips for drag soldering DO feed solder directly to the joint DO avoid high-activity

Archives for July 28th, 2015 | Baja Bid LLC

http://bajabid.com/2015/07/28/

; Seho 3250 Selective Solder; PAS Ultrasonic Welders; Air-Vac & Amistar Rework Stations; QMT 100 Tape & Reel; Austin American Stencil Cleaner; Dry Storage Boxes; Conveyors : DEK Horizon 01 Screen Printer; Yestech YTV-BX Bench Top AOI; Universal 4688A “GSM2” Machines & Feeders; Mancorp “Lead-Free” Wave Solder; Vitronics Reflow Oven

Archives for July 28th, 2015 | Baja Bid LLC

https://bajabid.com/2015/07/28/

; Seho 3250 Selective Solder; PAS Ultrasonic Welders; Air-Vac & Amistar Rework Stations; QMT 100 Tape & Reel; Austin American Stencil Cleaner; Dry Storage Boxes; Conveyors : DEK Horizon 01 Screen Printer; Yestech YTV-BX Bench Top AOI; Universal 4688A “GSM2” Machines & Feeders; Mancorp “Lead-Free” Wave Solder; Vitronics Reflow Oven

Integrated Stencil Cleaner | Accessories & Options | Speedprint UK

https://www.speedprint-tech.com/smt-solutions/accessories-and-options/integrated-stencil-cleaner/

. Speedprint’s stencil cleaning system contains the most powerful vacuum system technology available and is fully programmable, allowing for wet and dry cleaning and an unlimited level of programmable options + SOLDER PASTE INSPECTION STENCIL AUTO LOAD AND UNLOAD SPEED ENHANCEMENT STENCIL PASTE DISPENSE INTEGRATED STENCIL CLEANER MAINTENANCE ADVANTAGE SOLDER PASTE MANAGEMENT STENCIL ADJUST SYSTEM SNUGGER

SP710avi | SP700 Series Screen Printers | Speedprint UK

https://www.speedprint-tech.com/smt-solutions/sp710avi/

) technology precisely aligns the board and stencil, and checks for solder paste presence on the stencil before printing. DRc innovations include SmartCal, a zero-cost straightforward calibration facility that lets operators validate the process in 30 seconds or less @ 6-Sigma 2Cpk Full process repeatability to 20µm @ 6-Sigma 2Cpk Highly efficient vacuum-assisted under stencil cleaning: fully programmable, wet or dry, with or without vacuum Auto stencil load and eject to streamline product changeover Closed loop dual squeegee control for print process optimisation . Fully programmable print parameters Defect prevention with programmable Optical Paste Bead Management. Verifies solder paste presence on the stencil

Fully Automatic Solder Paste Printer - A5 - QYSMT

https://www.qy-smt.com/product-item/fully-automatic-solder-paste-printer-a5/

Fully Automatic Solder Paste Printer - A5 - QYSMT HOME ABOUT US PRODUCT & SERVICE Panasonic JUKI YAMAHA FUJI SAMSUNG SIEMENS HITACHI & I-PULSE UNIVERSAL ASSEMBLEON SANYO & SONY DEK & MPM AI Spare Parts SMT Machines SMT Peripherals Design & Make Special Nozzles Repair Service SUPPORT FAQ After-Sale Service NEWS VIDEO CONTACT US Search Menu A5 Fully Automatic Solder Paste Printer A5 At QYSMT we go the extra distance to offer you the very ° Squeegee Type Stainless steel(Standard), plastic Stencil Separation Speed 0.1~20mm/sec Programmable Cleaning System Dry、Wet、Vacuum (Programmable) Table Adjustment ranges X : ±10mm; Y:±10mm;θ:±2° CCD FOV 8×6 mm Solder Paste Inspection 2D Inspection (Standard ) Repeat Position Accuracy ±0.01mm Printing Accuracy ±0.025mm Cycle Time <7s (Exclude Printing & Cleaning

DEK GALAXY Screen Printer - QYSMT

https://www.qy-smt.com/product-item/dek-galaxy-screen-printer/

0.1 mm to 3 mm Understencil Cleaning Cyclone high speed cleaner, fully programmable with wet/dry/vacuum wipe with external solvent tank Compressed air supply 5-8 bar at 5 liters/minute Power supply 110 V to 240 V ±10 ™ software You Might Like These DEK HORIZON 02i SCREEN PRINTER DEK ICON i8 Screen Printer DEK GALAXY Screen Printer Fully Automatic Solder Paste Printer

Auto SMT Solder Paste Screen Printer-PCB magazine loader,PCB loader,PCB conveyor,PCB Multi Magazine

https://www.ascen.ltd/Products/Solder_paste_printer/394.html

Auto SMT Solder Paste Screen Printer-PCB magazine loader,PCB loader,PCB conveyor,PCB Multi Magazine Loader,pcb conformal coating machine,PCB cutting machine,PCB inspection conveyor,pcb optical Skype:supplier889 PCB Handling conveyor PCB conveyor PCB loader and unloader Solder paste printer PCB buffer Smart Production equipment PCB depaneling machine Axial component lead forming PCB auto optical &unloader PCB custom conveyor pcb cutting machine solder dross recovery system Industrial air purification Conformal coating machine Solder paste printer Home > Products > PCB Handling conveyor > Solder paste printer > > Show all Auto SMT Solder Paste Screen Printer Model: AS-C8printer Brand: ASCEN Delivery Time: 30 days Desciption : SMT PCB Solder Paste Screen Printer for SMT is needed to screen print solder paste onto the printed circuit board (PCB) before placement of surface mount components (SMD

full auto PCB screen printer-PCB magazine loader,PCB loader,PCB conveyor,PCB Multi Magazine Loader,p

https://www.ascen.ltd/Products/Solder_paste_printer/513.html

Skype:supplier889 PCB Handling conveyor PCB conveyor PCB loader and unloader Solder paste printer PCB buffer Smart Production equipment PCB depaneling machine Axial component lead forming PCB auto optical &unloader PCB custom conveyor pcb cutting machine solder dross recovery system Industrial air purification Conformal coating machine Solder paste printer Home > Products > PCB Handling conveyor > Solder paste printer > > Show all full auto PCB screen printer Model: SE700 Brand: ASCEN Delivery Time: 28 days Desciption: full auto PCB screen printer Model SE700 is a very accurate fully automatic SMT stencil .   Applicable PCB types: LCD TV, STB, LED, family cinema, vehicle electronics. besides general electronics products. If you want the fully auto PCB screen printer how to work on the line, Please click here automatic PCB solder paste printing machine printing the PCB board Features:  1 automatic cleaning function: dry and wet three cleaning mode, the software is free Set the cleaning mode and the length of the cleaning paper 5

Moisture Sensitive Devices (MSD) Council

https://www.smta.org/msd/msd.cfm

. During solder reflow, the combination of rapid moisture expansion and materials mismatch can result in package cracking and/or delamination of critical interfaces within the package Sensitive Surface Mount Devices , released in 1999 and revised in July 2002. The standard dictates that moisture sensitive devices must be properly classified, identified, and packaged in dry bags until they are needed for PCB assembly to be stored in dry cabinets or dry bags. The following issues are commonly found to cause significant levels of escape with existing manual procedures . Keep track of the remaining floor life and expiration of MSDs while they are loaded on placement machines. Additional opportunities are provided in the standard to account for dry storage under certain conditions . A sealed dry bag with desiccant does not require high vacuum. A simple heat seal with the proper quantity of desiccant is sufficient. High vacuum can actually be detrimental by increasing the amount of moisture diffusion through the bag. 4

Symposium on Counterfeit Parts and Materials

https://www.smta.org/counterfeit/exhibiting-companies.cfm

-time X-ray; De-capsulation / De-lid & Die Verification; Resistance to Solvents; Heated Solvents; Solder-ability; XRF RoHs; Scanning Electron Microscopy; Mechanical Measurement and 100% visual inspection. We are Certified to: AS6081; AS9120A; ISO9001 including Actives, Passives, ICs, Connectors, LCD’s and network cards. Our Value-Add services include: DMS Component Sourcing & Supply; Authentication & Electrical / Functional Testing; Tape & Reel; Bake & Dry-Pack; Excess Asset Purchase, Consignment

training - schedule1 - solder

https://www.solder.net/schedule1

training - schedule1 - solder Solder Call us Now! 1-847-797-9250 BEST soldering geeks enable electronics companies to be more effective through professional instruction, tools and taking secondary assembly projects off your plate HOME Services -Paneling Medical Device Laser Services Selective Solder Mask Removal Flex Circuit Machining Fine Wire Stripping Ribbon Cable Stripping Coverlay Laser Machining Inspection Electronic Sorting PCB Rework ) Space Application SMT Assembly Class Soldering 101 Wires and Terminals 101 Customized Solder Training Electronics Assembly Inspection IPC-A-610 Certified IPC Specialist (CIS ) ESD ESD Control Spanish Language Courses Registration LOCATION schedule1 MOBILE TRAINING ONLINE TRAINING TRAINING SUPPORT Instructor Bios FAQ Outsourced Solder Training IPC Certification Portal Removal Site Preparation Component Placement Component Reflow Inspection Reballing StencilQuick™ Method EZReball™ Method High Volume Method Ceramic Reballing Method Reballing Process BGA Handling DRY Packaging Challenges Optional Reballing Services Underfill rework Lead free rework INSPECTION OF ELECTRONICS HOW

Conformal Coating Dispense Machine Specifications

http://www.gpd-global.com/co_website/conformal-simplecoat-specs.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER (0.25") Transport Height 940 mm - 965 mm (37" - 38") Communication SMEMA Facility Requirements Air Supply 6 bar (85 psi) dry, clean air Exhaust Port minimum 250 CFM, 127 mm (5

Conformal Coating Dispense with Tilt and Rotate Machine Specifications

http://www.gpd-global.com/co_website/conformal-simplecoattr-specs.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER (0.25") Transport Height 940 mm - 965 mm (37" - 38") Communication SMEMA Facility Requirements Air Supply 6 bar (85 psi) dry, clean air Exhaust Port minimum 250 CFM, 127 mm (5

EP700_side-1_master.indd

https://www.europlacer.com/smt-screen-printer-ep710/?attachment_id=4316&download_file=5d64d6c66450c

. Our patented Dual Roving camera (DRc) technology precisely aligns the board and stencil, and checks for solder paste presence on the stencil before printing . Highly effi cient vacuum-assisted under stencil cleaning. Fully programmable. Wet or dry, with or without vacuum Auto stencil load and eject streamlines product changeover Closed loop dual squeegee control for print process optimisation . Fully programmable print parameters Defect prevention with programmable Optical Paste Bead Management. Verifi es solder paste presence on the stencil . Our patented Dual Roving camera (DRc) technology precisely aligns the board and stencil, and checks for solder paste presence on the stencil before printing . Highly effi cient vacuum-assisted under stencil cleaning. Fully programmable. Wet or dry, with or without vacuum Auto stencil load and eject streamlines product changeover Closed loop dual squeegee control for print process optimisation

EP700_side-1_master.indd

https://www.europlacer.com/es/smt-screen-printer-ep710/?attachment_id=4316&download_file=5d64d6c66450c

. Our patented Dual Roving camera (DRc) technology precisely aligns the board and stencil, and checks for solder paste presence on the stencil before printing . Highly effi cient vacuum-assisted under stencil cleaning. Fully programmable. Wet or dry, with or without vacuum Auto stencil load and eject streamlines product changeover Closed loop dual squeegee control for print process optimisation . Fully programmable print parameters Defect prevention with programmable Optical Paste Bead Management. Verifi es solder paste presence on the stencil . Our patented Dual Roving camera (DRc) technology precisely aligns the board and stencil, and checks for solder paste presence on the stencil before printing . Highly effi cient vacuum-assisted under stencil cleaning. Fully programmable. Wet or dry, with or without vacuum Auto stencil load and eject streamlines product changeover Closed loop dual squeegee control for print process optimisation

Material Packaging Applications

http://www.techconsystems.com/en/applications/industries/material-packaging-applications/?sef_rewrite=1

reliable dry plastic for their packaging equipment. Whether for Aerospace, Electronics or Medical Device manufacturing applications; Techcon has long been a reliable supplier providing high quality     Typical Packaging/Dispensing Products      Sealants Silicones Solder Paste Silver Paste Epoxies Flux UV Adhesives Greases Syringes and components Cartridges and components Barrier Kits Injection Kits Spool Valves Rotary Valves Controller OUR

Material Packaging Applications

http://www.techconsystems.com/en/applications/industries/material-packaging-applications

reliable dry plastic for their packaging equipment. Whether for Aerospace, Electronics or Medical Device manufacturing applications; Techcon has long been a reliable supplier providing high quality     Typical Packaging/Dispensing Products      Sealants Silicones Solder Paste Silver Paste Epoxies Flux UV Adhesives Greases Syringes and components Cartridges and components Barrier Kits Injection Kits Spool Valves Rotary Valves Controller OUR

https://www.btu.com/assets/global_solar_1.1_INTERVIEW_PAUL.pdf

. Our latest Pyramax product, intro- duced at APEX 2008, is the Pyramax 75A, which has extremely low running costs. For decades, BTU international has been a leading supplier of advanced thermal processing equipment for electronics manufacturing, which includes printed circuit board solder reflow and semiconductor —continued from page 10 Overview of Plasma Sources Suitable for Dry Etching of Solar Cells”, 28th IEEE Photovoltaic Specialists Confer- ence, Anchorage, September 19-22, 2000. A. Vijh, X. Yang, W. Du, X. Deng, 1

http://www.btu.com/assets/global_solar_1.1_INTERVIEW_PAUL.pdf

. Our latest Pyramax product, intro- duced at APEX 2008, is the Pyramax 75A, which has extremely low running costs. For decades, BTU international has been a leading supplier of advanced thermal processing equipment for electronics manufacturing, which includes printed circuit board solder reflow and semiconductor —continued from page 10 Overview of Plasma Sources Suitable for Dry Etching of Solar Cells”, 28th IEEE Photovoltaic Specialists Confer- ence, Anchorage, September 19-22, 2000. A. Vijh, X. Yang, W. Du, X. Deng, 1

IPC APEX EXPO 2019 - Conference Brochure

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2019-Conference-Brochure.pdf

| JANUARY 31 8:00 am–2:00 pm Free Buzz Session: iNemi Next Generation Solder Materials Workshop 8:00 am–5:00 pm IPC Standards Development Committee Meetings 9:00 am–10 | January 29 and 30 Competitors will be presented with a soldered assembly that will be partially populated with components. Contestants will be required to remove six specific components, remove the old solder and clean the area of removed components AIM Solder ...............................3225 AIM, Inc. ..........................Supporter Air & Water Systems, LLC ........................2407 Airtech International, Inc. ........ 700 AIR-VAC Engineering ............... 1625 Akrometrix, LLC .....................................2435 Excellon Automation ..................101 Excelta ...................................... 1706 F&K Delvotec............................ 2102 Fancort Industries .................... 3313 FASTechnologies, Corp. ............525 FCT Solder .............................................1215 Koh Young Technology ............1908 Koki Solder America Inc. ..........................2332 Komax ..................................... 3509 Korea Printed Circuit Association (KPCA) ..............4409 Kulicke & Soffa Industries Inc

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2019-Pocket-Guide.pdf

Sober, Essex Technologies Group Inc. 10 High Frequency Test Methods Task Group: Frequency-Domain Methods D-24C 3:15 pm 5:00 pm Chair: John Coonrod, Rogers Corporation 16B 5-22A Rose Working Group 5-22A ROSE WORKING GROUP 3:15 pm 5:00 pm 7A Solder Alloy , Continental Automotive Systems 2 PCB/Microvia Reliability S07 3:30 pm 5:00 pm Bhanu Sood, NASA Goddard Space Flight Center 6C Solder Paste/ Reliability I S08 3:30 pm 5:00 pm Udo Welzel, Robert Bosch GmbH 1A Test/Inspection II S09 3:30 pm 5:00 pm Steve Butkovich Aerospace 9 Solder Stencil Task Group 5-21E 8:00 am 10:00 am Chair: Jeff Schake, ASM Assembly Systems 17A Materials Declaration Task Group 2-18B 8:00 am 12:00 pm Co-chairs: Aidan Turnbull, BomCheck; Mark Frimann, Texas Instruments Inc. 8 Flexible Circuits Frequency Board Performance Subcommittee D-22 8:00 am 10:00 am Chair: Lance Auer, Conductor Analysis Technologies, Inc. 14B Solder Paste Task Group 5-24B 8:00 am 10:00 am Chair: Karen Tellefsen, Alpha Assembly Solutions 11A Press Office 9:00 am 6:00 pm 16A : Marc Carter, SAIC; Michael Carano, RBP Chemical Technology, Inc. 11A Solder Mask Performance Task Group 5-33B 10:15 am 3:00 pm Co-chairs: Fonda Wu, Raytheon Company; Rene Martinez, Northrop Grumman Aerospace Systems 9 Flexible Circuits Specifications

Upcoming Expos

http://smta.org/expos/

improve print quality? • When should Type 5 solder paste be considered for fine feature printing? • What’s the difference between wet wiping and dry wiping? • Do wiper parameters, papers, solvents and sequences make a big difference? • What are the new Jeff Mogensen will discuss a host of new tools and technologies that will help achieve higher yields and maximize ROI in the areas of stencils, solder paste printing and inspection, reflow, and metrology at the world of PCB design...and beyond. Solder Paste and Voiding Challenges Tim O’Neill, Technical Marketing Manager, AIM Solder Tim O’Neill will present the salient details of two separate presentations “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing.” Special Thanks to Our Snack Sponsor: Join us after the Expo at Tin Lizzy's Cantina for a networking happy hour with light appetizers and drinks , INC. Koki Solder America/Tagarno USA KYZEN Corporation LPKF Laser and Electronics MET Stencil Multicircuits Inc. Murray Percival Company Nikon Metrology, Inc. PFC Flexible Circuits Limited PUREX INC Quality Associates RBB Systems, Inc. Rehm Thermal

Moisture Sensitive Devices (MSD) Council

http://smta.org/msd/msd.cfm

. During solder reflow, the combination of rapid moisture expansion and materials mismatch can result in package cracking and/or delamination of critical interfaces within the package Sensitive Surface Mount Devices , released in 1999 and revised in July 2002. The standard dictates that moisture sensitive devices must be properly classified, identified, and packaged in dry bags until they are needed for PCB assembly to be stored in dry cabinets or dry bags. The following issues are commonly found to cause significant levels of escape with existing manual procedures . Keep track of the remaining floor life and expiration of MSDs while they are loaded on placement machines. Additional opportunities are provided in the standard to account for dry storage under certain conditions . A sealed dry bag with desiccant does not require high vacuum. A simple heat seal with the proper quantity of desiccant is sufficient. High vacuum can actually be detrimental by increasing the amount of moisture diffusion through the bag. 4

Unisoft - MES software link to PLM, MRP, ERP.

https://www.unisoft-cim.com/cells-apparel.htm

> STOCK/SHIPPED > $DONE INDUSTRY — SOLAR PANELS $START > LOAD MODULES > APPLY SOLDERING FLUX > APPLY WIRE > HEAT WIRE > MODULES IN TRAY > ULTRASOUND CLEAN > DRY > LOAD ASSEMBLY FIXTURE > FLUX MODULE GROUPS > SOLDER MODULE GROUPS > TEST GROUP VOLTAGE > LOAD or EF or MF or CNR SMT PICK & PLACE TOP SIDE pass go to THRU HOLE INSERTION TOP SIDE or EF or MF or CNR THRU HOLE INSERTION TOP SIDE pass go to HAND ASSEMBLY PARTS or EF or MF or CNR HAND ASSEMBLY PARTS pass go to WAVE SOLDER or EF or MF or CNR WAVE SOLDER pass go to AUTOMATIC IN-CIRCUIT TEST or EF or MF or CNR AUTOMATIC IN-CIRCUIT TEST pass go to CAPTURE TEST DATA or EF or MF or CNR CAPTURE TEST DATA pass go to ATTACH SUB-ASSEMBLY ATTACH SUB-ASSEMBLY pass go to FUNCTIONAL TEST FUNCTIONAL TEST pass go GROUPS PANEL > INSERT/SOLDER METALLIC STRIP > ADD GLASS LAYER > ADD LAMINATE LAYER > APPLY SEALING FILM > PLACE IN VACUUM OVEN > TEST PANEL VOLTAGE > $DONE INDUSTRY — VEHICLE PAINTING $START > ACCEPTANCE > PRE-INSPECTION > WASH BAY IN > WASH BAY OUT

Unisoft - Manufacturing Execution System MES product and job tracking software - PCB assembly / PCBA

https://www.unisoft-cim.com/cells.html

MODULES > APPLY SOLDERING FLUX > APPLY WIRE > HEAT WIRE > MODULES IN TRAY > ULTRASOUND CLEAN > DRY > LOAD ASSEMBLY FIXTURE > FLUX MODULE GROUPS > SOLDER MODULE GROUPS > TEST GROUP VOLTAGE > LOAD GROUPS PANEL > INSERT/SOLDER METALLIC STRIP > ADD GLASS LAYER pass go to WAVE SOLDER or EF or MF or CNR WAVE SOLDER pass go to AUTOMATIC IN-CIRCUIT TEST or EF or MF or CNR AUTOMATIC IN-CIRCUIT TEST pass go to CAPTURE TEST DATA or EF or MF or CNR CAPTURE TEST DATA pass go to ATTACH SUB-ASSEMBLY ATTACH SUB-ASSEMBLY

IPC TM-650 Test Methods Manual | IPC

http://ipc.org/test-methods.aspx

) UV Initiated Dry Film Solder Mask - 2/88 TM 2.3.24 Porosity of Gold Plating - 2/78 TM 2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85 TM Materials Quality/Test Design Printed Electronics Lead Free Market Research Management Roadmap Artwork/Test Vehicles/Solder Kits Presentation 2.2.13.1A Thickness, Plating in Holes, Microhm Method - 1/83 TM 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95 TM 2.2.14.1 Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95 TM 2.2.14.2 Solder Powder Particle Size Distribution - Optical Image Analyzer Method - 1/95 TM 2.2.14.3 Determination of Maximum Solder Powder Particle Size - 1/95 TM 2.2.15 Cable Dimensions (Flat Cable) - 6/79 TM 2.2.16 Artwork Master Evaluation by Use of a Drilled Panel - 12/87 TM

Cure (Permanency) UV Initiated Dry Film Solder Mask

http://ipc.org/TM/2.3.23.1a.pdf

Cure (Permanency) UV Initiated Dry Film Solder Mask 1.0 Scope This test method covers the cure, or perma- nence testing of ultraviolet-initiated dry film solder mask (sol- der resist) organic coatings . Dry film solder masking is the application of a film coating on laminates and circuits. Follow- ing processing and curing, the dry film mask covers only those areas where no solder is to appear and, conversely, does not cover those areas where soldering is intended . 2.0 Applicable Documents None 3.0 Test Specimens IPC Test Board IPC-B-25 preproduc- tion board, or a sample production board with the dry film solder mask coating applied and cured as recommended by the manufacturer. See Procedure 5.1. 4.0 Apparatus 6.1 Load pre-selected test solution into Surface Analyzer. The manufacturer recommends specific test solutions, which are commercially available, for particular dry film solder masks ) UV Initiated Dry Film Solder Mask Date 2/88 Revision A Originating Task Group N/A Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC

J.M.W. - ADMIN Inventory Listing

http://www.jmw-inc.com/Listing.asp?FindThis=

with 4GN30KA Gear Head SMT Spare Parts N/A 4RK25GN-AMUL Oriental Motor AC Magnetic Brake Motor SMT Spare Parts N/A 5IK40GN-SH-230 Oriental Motor Induction Motor SMT Spare Parts N/A SWA-1 SWPC Solder Wave Electromagnetics DC Motor SMT Spare Parts N/A 145817 DEK Camera X Servo Motor SMT Spare Parts N/A 107319-2 DEK Servo Motor SMT Spare Parts N/A 2-5001-372-00-0 Electrovert Solder Bar Feeder Motor (Dayton 4Z06A INLINE SMT GBC-460-1000-NL Workstation Conveyor SMT Conveyors WO-460-EXL INLINE SMT WO-460-EXL Wave Solder Unloader SMT Conveyors GBC-460-500-IC INLINE SMT GBC-460-500-IC Connecting Conveyor SMT Conveyors 120601 AirVac PCBRM-12 Rework Station Rework Spare Parts N/A 3-0616-113-01-2 Electrovert N/A Solder Nozzle Plate SMT Spare Parts N/A Panadac941A Panasonic N/A Enclosure SMT Spare Parts N/A 110QD-QDP-20-A1 Jonathan Mfg. Co. N/A Drawer Slide SMT Spare Parts N/A 110QD-QDP-16-A1 Jonathan Mfg. Co. N /A SHD4216 Hdecibal N/A Buzzer SMT Spare Parts N/A SC955160 Celduc N/A Relay SMT Spare Parts N/A SM71B4-B5 B & M N/A AC Motor for Folungwin Solder Pump SMT Spare Parts N/A PFL203 Unknown N/A Bearing Flange Cover SMT Spare Parts N/A S9KH150B SPG N/A Gear Head

SMT Spare Parts - Electrovert, DEK, MPM

http://www.jmw-inc.com/SMT_Spare_Parts.asp

/A Pump SMT Spare Parts N/A CM34D25FC2A Leeson N/A Motor 130V, 2500RPM, 2.3 Amps, 1/3 HP SMT Spare Parts N/A Chaintensioner1 Electrovert N/A Conveyor Drive Chain Tensioner SMT Spare Parts N/A Solderlevelfloat Electrovert N/A Solder Level Float, Missing parts SMT Spare Parts Head SMT Spare Parts N/A SWA-1 SWPC Solder Wave Analyzer SMT Spare Parts N/A P21NRXD-LNN-NS-00 Pacific Scientific 1.8 Step Motor SMT Spare Parts N/A M61A6GD4W Panasonic Motor with M6GA12.5B Gear Head SMT Spare Parts N/A 24A2BEPM-D3 Bodine DC Motor SMT /A 2-5001-372-00-0 Electrovert Solder Bar Feeder Motor (Dayton 4Z06A) SMT Spare Parts N/A 10-PSSH-0 Baldor DC Motor SMT Spare Parts N/A 2-5001-196-01-4 Electrovert DC Motor SMT Spare Parts N/A USAREM-03DE2K Yaskawa AC Servo Motor SMT Spare Parts N/A 125

Fluidmove for Windows XP Software

http://www.nordson.com/en-us/divisions/asymtek/products/Software/Pages/FmXP-Fluidmove-for-Windows-XP-Software.aspx

. Both wet and dry dispensing runs can be performed from the Programming Window for testing and fine-tuning a dispensing program. In addition:  Simplified setup and configuration routines prompt you through initial system and software calibration for the height sensor, camera offset, purge station, and scale station locations, making setup . The following are a few examples: FmXP software supports a wide variety of applications, including CSP/BGA/MEMS underfill, precise coating, encapsulation, flip chip underfill, flux, SMA, solder paste and more

Microsoft Word - Formulation Considerations for Automated Dispensing of Lea–

http://www.nordson.com/en-us/divisions/asymtek/Documents/Papers/2004_03%20_automated_dispensing_lead_free_solder_paste_NordsonASYMTEK.pdf

Microsoft Word - Formulation Considerations for Automated Dispensing of Lea– 1 Formulation Considerations for Automated Dispensing of Lead Free Solder Paste Alan Lewis, Director of Application Engineering, Asymtek alewis@asymtek.com Abstract : Dispensing solder paste with automated dispensing equipment provides many challenges that must be overcome before a production process can be considered robust . The primary challenge to overcome is the tendency for solder paste to plug in dispensing pumps and needles. This paper outlines the important process parameters that must be determined and controlled for good production robustness, including the selection of valve or pump technology, selection of dispensing needles, selection of solder paste packaging, generic equipment settings, and paste formulation. In particular, the effect and interdependence of solder paste mesh size , % metal content, and alloy of metal is discussed. Many production facilities have overcome these problems, only to have them re-appear when switching to a lead free solder formulation

8981_03

http://islandsmt.com/wp-content/uploads/2017/05/8981_03-1.pdf

. This is an important variable. The solder paste needs time to roll into apertures on the stencil. To set the forward and reverse print speeds, click in the Speed box and type the print speed, or scroll to the required value mode refers to the type action performed on the forward and backward strokes of the printhead. During a Print stroke the squeegee is in full contact with the stencil and pushes solder paste through the apertures onto the PCB. During a Flood stroke the squeegee pushes solder paste across the surface of the stencil without being in contact with the stencil. Three combinations of strokes, or print modes, are available: • Print/Print • Print/Flood • Flood/Print To set the Print Mode, click the appropriate Dispenser Introduction The Accuflex paste dispenser option automatically places solder paste on the stencil. You can define where paste is positioned, the amount deposited, and how often it is dispensed during production. The automatic paste dispenser (Standard Tab) Procedure To enable paste dispensing during production, use Setup Paste dispenser Standard tab as follows: Step Action Chemical Hazard Solder paste contains lead. Lead poses a potential risk to health and the environment. Areas internal

http://islandsmt.com/wp-content/uploads/2017/04/vt9000flyer.pdf

solder, tombstone and 2-D paste defects: missing, insufficient, excessive, smear, billboard components, dry joints, coplanarity, shorts, lifted leads, blow bridging, alignment voids holes (wave solder) 2.5-D paste defects • Straightforward program setup and flexible adaptation to product changeovers • Designed for easy integration into existing SMT lines The VT-9000 series provides cost-effective inspection of your electronics assemblies at the pre- and post- solder stages . VT-9000 solutions feature advanced 2-D and 3-D inspection techniques for accurate, consistent detection of paste, component placement and solder joint defects at full line speeds ™ Pre-Solder AOI System VT-9300™ Post-Solder AOI System Boards Inspected Pre-solder SMT and through-hole Post-solder SMT, through-hole and mixed technologies Number of CCD cameras 5 13 Fault Coverage Placement

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Software for SMT

fluid dispensing pumps for integration