Electronics Forum | Thu Jan 12 20:11:25 EST 2012 | davef
Isola water pressure. Between a 210°C normal tin lead cycle and a 250°C lead-free assembly cycle, the vapor pressure doubles. Reflow temperature [*C]||Vapor pressure of water [psi] 150||100 200||225 210||260 220||320 230||400 240||480 250||580 300||1
Electronics Forum | Wed Feb 21 16:14:44 EST 2001 | billschreiber
120 degrees F (49 degrees C.), check the fine-pitch apertures for shape distortion (stainless steel has a very poor memory, once it expands, it doesn�t always contract back to the same position). Check for dings and dents. A good stencil cleaning pr
Electronics Forum | Tue May 30 10:46:06 EDT 2000 | Travis Slaughter
Sounds like you could have a problem caused by the gold. How thick is the plating? Are the connector leads gold too? I have seen gold cause dry looking brittle solder joints in the past.
Electronics Forum | Wed Aug 22 22:07:53 EDT 2007 | mdm4ua
Easy fix is put a drop of washable mask on the side of part before reflow. The mask dries before the solder reflows and holds the part in place. After reflow it washes away.
Electronics Forum | Thu Aug 19 04:49:09 EDT 1999 | Earl Moon
| | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale
Electronics Forum | Fri Apr 17 14:12:27 EDT 1998 | Earl Moon
| Is there anybody to help me ? | We have small balls appearing on the boards soldered by | wave soldering machine and it looks that use of nitrogen | is linked to the problem (because without nitrogen, we have no more | problems). | That remind you
Electronics Forum | Thu Aug 05 16:15:18 EDT 2004 | pjc
Are you considering baking due to moisture exposure? Not all OSPs are created equal. I would check with your PWB fabricator about dry times and effects on their OSP finish. After you get it, I'd still try just one PWB for bake-dry out and check solde
Electronics Forum | Fri Feb 29 08:14:33 EST 2008 | cyber_wolf
Thats funny that you mention the WS609. That is the exact same paste we used back in the early 90's. That formulation is notorious for drying out and getting chunky. That is a very dated flux chemistry. I would advise looking into some of the twenty
Electronics Forum | Mon Jun 07 03:03:12 EDT 2004 | Frederic
I have a question about solder paste. When the solder paste lost her tackines (dry out) how can i refresh this solder paste?. Can i add a little flux? or it is ban. I noticed that after reflow solder joints look shiny but i can see some discolour (f
Electronics Forum | Wed Apr 23 03:19:30 EDT 2008 | jkhiew
Hi all, Can anyone advise me what is the recommended floor life for pcb assembly prior to wave soldering before drying/degassing ? Thks Joseph