Electronics Forum: dry solder (Page 16 of 61)

Solder Paste Inspection Criteria

Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis

The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ

Solder Mask Specification

Electronics Forum | Wed Oct 24 14:06:37 EDT 2001 | mparker

If you let your design team leave things up to chance, chances are something will go wrong. You are right to want to take control rather than be lead down an undesirable path by the fab house. Various masks serve certain desirable purposes. You need

Unusual solderability issue

Electronics Forum | Fri May 07 00:52:24 EDT 2010 | boardhouse

Hi Derek, just curious of one thing - are the vias within the BGA's the only vias covered or are all vias on the board covered. Just trying to figure out what is making this area different from the rest of the board. Regarding leaching, I do not be

Alpha 856 Flux For Wave Soldering

Electronics Forum | Thu Feb 16 11:42:29 EST 2006 | russ

I use Alpha 857 W.S. for wave is that what you mean? If so, I love this stuff, it solders everything. one downside to it is convection (wave , rework) can dry it out and leave white hazes and even residues at the joints.

BGA solderability / moisture

Electronics Forum | Mon Feb 11 21:54:14 EST 2002 | davef

LONG TERM Your plans to buy a vaccuum bag resealer and a batch drying oven sound good as you say, but you�re correct. They will not help with this current situation. SHORT TERM If your connections are clean, free of pits and holes with a smooth,

BGA soldering Problem

Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones

I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen

BGA soldering problems

Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones

I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen

BGA solderability / moisture

Electronics Forum | Mon Feb 11 13:28:36 EST 2002 | stepheno

We have some BGA's that don't solder very well. They weren't properly stored in regards to moisture protection. The balls look dull and rough. After reflow there seemed to be a diffinate line between the balls and the solder on the PCB's. I think

Solder paste height checking

Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS

First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the

Micro-BGA soldering

Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L

Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg


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