Electronics Forum: dull board pads (Page 1 of 243)

square pads

Electronics Forum | Wed Mar 03 11:30:18 EST 1999 | dave reese

Are square pads more difficult to wavesolder than round pads? I am referring to a through hole board.

PCB pads corrosion

Electronics Forum | Tue Dec 15 15:21:17 EST 2015 | davef

Peculiar that ENIG boards are corroded, not that it can't happen. * J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * J-STD-003, Solderability Tests for Printed Boards The first person I'd talk with is my

caps moving from pads

Electronics Forum | Wed Sep 21 18:09:03 EDT 2005 | PWH

We've had parts jump off pads on occasion due to panels or boards that are restricted in a carrier during reflow. The boards/panels expand and the restriction causes them to warp thus popping parts around during cool down. Doesn't sound like your p

Via's in BGA pads

Electronics Forum | Wed Apr 21 13:21:33 EDT 1999 | Scotty

Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The process

Re: square pads

Electronics Forum | Thu Mar 04 12:49:49 EST 1999 | SMTASSY

| Are square pads more difficult to wavesolder than round pads? | I am referring to a through hole board. | Usualy square pads are for indication of pin 1 on a DIP for example. There might be a difference in the capilary affect due to a different su

0603's on 0805 pads

Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas

We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is

adhesive on pads

Electronics Forum | Tue Apr 02 22:58:10 EST 2002 | davef

Whatever I've said, my intent has never been to insult you. Smack you yes, insult you no. True, you never said the word �strings� but you did say � * �� shouldn't I be able to expect enough green strength from my epoxy to hold 0603 caps in place wi

adhesive on pads

Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef

Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco

adhesive on pads

Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas

* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo

adhesive on pads

Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef

You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a

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