Electronics Forum | Mon Jul 14 13:45:17 EDT 2008 | ck_the_flip
Patrick... Contact LENGTH as in inches, mm, or cm...not time..is decreased with a slower belt speed. The slower the speed, the less contact LENGTH with the wave per unit time ...whereas at a faster speed, your leads are contacting more solder, th
Electronics Forum | Fri Feb 20 12:55:43 EST 2004 | russ
Ah, the old contour wave. I don't really know how to adjust those to get correct backflow to reduce your solder volume. I need to ask why you are worried about this. Do you have a QC requirement in excess of IPC class3 wich allows for this joint t
Electronics Forum | Wed Nov 08 15:59:19 EST 2000 | jackofalltrades
We are currently evaluating a "selective soldering machine" from Ersa. We have been using it for about a month or so now and have found it to be very useful on "difficult to wave solder spots", but it is not as fast as a wave soldering machine. It mi
Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F
Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c
Electronics Forum | Fri May 05 11:58:25 EDT 2000 | John Sims
We are using NR300F from Alpha. Topside board temp is 220 deg. F. We have 3 bottom side convection preheaters, and we use a foaming fluxer. The machine (except for the rotary chip wave) is almost identical to the old econopak. An electrovert appl
Electronics Forum | Tue Jan 30 14:59:07 EST 2001 | MikeF
I thought Contact Length refered to the travel distance the board stays in contact with the solder. I measured it using a tempered glass plate that also showed me if I had an even footprint of contact with the wave. By this definition, conveyor spe
Electronics Forum | Wed Apr 04 12:35:15 EDT 2001 | davef
These solder balls are where [top / bottom]? Describe the breadth and degree of this problem across all assemblies. Finally, describe your wave solder machine, a common profile for this board, and the board [beyond that it's mixed tech, like are
Electronics Forum | Mon Jan 17 08:09:05 EST 2000 | Mark Anderson
As stated previous, the following elements all have a effect on solder beading. Solder Paste, stencil apertures(reduction of home plate), stencil thickness, printing parameters, placement height, reflow preheat and soaking slope and dwell, manufactur
Electronics Forum | Tue Dec 21 19:48:27 EST 1999 | Russ
John, we have waved 0603 packages for a long time, We have also started on 0402. Are you concerned with shorting across the component body or to other components? You should have no problems with these parts in a wave process. A couple of things
Electronics Forum | Wed Jul 14 11:36:56 EDT 1999 | Jimmy Strain
| | | Hi All, | | | Does any one experienced the solder on gold finger after | | | reflow. Its about 5 to 8 mils diameter . | | | We'd clean the entire screen printer, mounter & reflow as well, | | | but doesn't help much. | | | | | | | | Mr Kong..
