Electronics Forum: e3503-1 (Page 1 of 1)

OSP adhesion

Electronics Forum | Tue Nov 10 13:31:00 EST 2009 | chris0595

When applying the ECCOBOND E3503-1 thermal adhesive to attach a HB-LED to the slug area of a MCPCB, should the OSP coating on the slug area first be removed? I have heard that OSP coatings have poor adhesion properties so I'm wondering how to do this

  1  

e3503-1 searches for Companies, Equipment, Machines, Suppliers & Information

Industry 4.0 Reflow Oven

Software for SMT placement & AOI - Free Download.
Non-heated dispensing system

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Fluid Dispense Pump Integration

High Throughput Reflow Oven
MSD Dry Cabinets

World's Best Reflow Oven Customizable for Unique Applications


ONLINE IPC Training & Certification