Electronics Forum | Mon Apr 12 16:38:07 EDT 1999 | D. Lange
I have one assembly needing amp Z-Pack connectors installed (106509-1 & 106510-1). They require very expensive tooling part numbers for tooling are as follows: Bench model (SM-3, 814700-2) or Hydraulic floor model (SM-10/20 803880-6). Each re
Electronics Forum | Wed Mar 24 15:04:05 EST 1999 | Greg Curler
I am looking into replacing another business division's Acrylic coating process with our Urethane coating process. Unfortunately, MIL-I-46068 doesn't differentiate AR/UR's performance, and the MFR data sheets don't match up at all (they each spec di
Electronics Forum | Wed Mar 24 21:40:05 EST 1999 | Dave F
| I am looking into replacing another business division's Acrylic coating process with our Urethane coating process. Unfortunately, MIL-I-46068 doesn't differentiate AR/UR's performance, and the MFR data sheets don't match up at all (they each spec
Electronics Forum | Tue Mar 23 16:28:07 EST 1999 | CHANCE TURNER
| I am looking for clip art images of electronics assembly. Images like wave soldering, surface mount components, soldering irons... just general assembly graphics. Many sites have different individual images that they use I was just wondering if a
Electronics Forum | Mon Mar 15 15:47:51 EST 1999 | Steve Schrader
| Are stencils universal from one printer to another? We are looking into the possibility of going from Solderprint 1414 manual printer to a more automated printer. We are also considering bringing some boards we currently outsource in house. I w
Electronics Forum | Thu Feb 18 21:51:48 EST 1999 | Dave F
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | 3: I'm unaware of such documentation, but then again documen
Electronics Forum | Tue Feb 16 15:33:13 EST 1999 | Clifford Peaslee
| Cliff | | Each time I attempt to edit my account, or register the company, I get a failure message.... | | OOPPS type message. | | Wayne | If at first you don't succeed... try going to account manager home I am setting up the error scree
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
Electronics Forum | Thu Jan 14 21:24:35 EST 1999 | Bernie
Due to an foul up on my part, a circuit board ECO snuck up on me and I have a solder paste stencil that doesn't quite match the board. Two pads are off by about half a pad each. Can the solder paste stencil be modified? If so, what is the technique
Electronics Forum | Wed Jan 20 22:46:44 EST 1999 | Bernie
Thanks for the info. I modified the stencil, ran the boards, and just got a new stencil. Life is good again. Bernie | Due to an foul up on my part, a circuit board ECO snuck up on me and I have a solder paste stencil that doesn't quite match the boa
