Electronics Forum | Tue May 31 16:31:02 EDT 2011 | xray
Hi, Besides the 2 machines mentioned which are part comparison machines that require the operator to provide a pass/fail on each ref id, there is a system called the FA Inspector which offers the mode described above and two additional modes: 1. Au
Electronics Forum | Tue May 24 13:18:43 EDT 2011 | leemeyer
We had a Quad 4C that was fitted with a dispensing nozzle. It was perfect for jobs like this. Place the 1st component in the paste, add a dot or 2 of paste to the top of that part and then place the 2nd component on top. I beleive that you may be ta
Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef
Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t
Electronics Forum | Tue Jun 07 20:56:47 EDT 2011 | aoiguy
Any and all input will be greatly appreciated. So here it goes. I'm having an issue where the cad I'm getting from customers is referencing pin 1 as the parts placement. This isn't an issue for surface mount, however the aoi machine that we have in
Electronics Forum | Thu Aug 11 07:01:34 EDT 2011 | franxsmt
Thank you very much for your informative and helpful reply. I have a few more questions:) 1- So for the case 1: should I apply the glue to the PCB with the same method as I apply solder paste? (with screen printer and squeegee). If so, I would guess
Electronics Forum | Fri Sep 02 19:31:40 EDT 2011 | jlawson
I agree that if information is processed correctly up front in process down stream QA becomes less expensive ie AOI etc as AOI at end of lines is telling you you have made mistakes in up stream. I better to eliminate mistakes or have process to avoid
Electronics Forum | Fri Aug 26 10:37:24 EDT 2011 | ndion
I'm looking for some guidance here and would appreciate input from some seasoned professionals. I am the Op. Mgr. for a medium sized electronics contract manufacture, but my background is almost exclusively in the machine tool industry and I would li
Electronics Forum | Thu Sep 08 12:50:39 EDT 2011 | deanm
We use both the black conductive and blue static dissipative ESD totes in the production of Class 3 military electronic assemblies. In some cases we use ESD bags, but most board assemblies are placed directly in an ESD tote with a lid. The totes cont
Electronics Forum | Thu Sep 15 21:25:43 EDT 2011 | darby
G'day folks - haven't been around for some time but still soldering on. Question for y'all. One of my design engineers has shown me a Creative PCI audio card with a TQFP48 attached. 0.4mm pitch. Let's say the pin width is 0.2mm and the pad design ha
Electronics Forum | Thu Sep 15 21:36:52 EDT 2011 | darby
I also posted this in the design section... G'day folks - haven't been around for some time but still soldering on. Question for y'all. One of my design engineers has shown me a Creative PCI audio card with a TQFP48 attached. 0.4mm pitch. Let's say
