Electronics Forum: ecp and plus (Page 1 of 5)

Re: Delmat

Electronics Forum | Wed Nov 17 10:47:47 EST 1999 | Rob Fischer

CDM is a quality material. Life expectancy can't be stated in time but should be termed in cycles. I'm aware of companies with more than 50,000 passes. These companies have a documented maintenence program for their pallets including PM and cleani

COB and wire bond

Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef

4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New

GSM2 and FlexJet heads

Electronics Forum | Thu Mar 18 18:52:29 EDT 2010 | edwaterfall01

There is a retrofit kit to take care of the head cable problem that you mention. The s/n with 7P in it represents what is called the 7 Plus level of the head. There was one more level after that (09) for the GSM. The better heads mentioned in the

High-end SPI and AOI?

Electronics Forum | Wed Oct 14 08:39:01 EDT 2009 | edmaya33

Anybody here work with Viscom S3088-II QS SPI? I heard this machine offers an ultra high speed of inspection and a state of the art features. We have been working with Orbotech P36+ but all we got is headache. A 2K US$ illumination board always fai

X-Outs and Panel Arrays

Electronics Forum | Wed May 14 15:15:03 EDT 2008 | boardhouse

Hi Scott, I have worked for a State side PCB Manufacture and now a Taiwan Manufacture. At both shops the up charge was based on how many up the pallet array was plus layer count and complexity of product, charges ranged from free to 15%. Standa


Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

Parylene Coating and BGA Reliability

Electronics Forum | Fri Oct 18 12:40:35 EDT 2013 | robertwillis

Back in the mists of time there were two papers on the use of Parylene Coating and the improved thermal cycling results in 1990. It was on LCCC then shortly after on BGA. Does anyone know of results of recent trials or have a copy of the BGA papers.

Re: Pick and Place Machines

Electronics Forum | Fri Mar 05 18:09:38 EST 1999 | Earl Moon

| | We are trying to decide between a Contact Systems Model 3AV or a Multitronix Model DHM120 P&P machine. Any advice or feedback would be apreciated. | | | | Joe | | | Why not consider the Philips Topaz. The worlds number one seller in mid-range p

Fuji Pick and Place Machines

Electronics Forum | Wed May 19 09:44:24 EDT 2004 | rlackey

Hello again Grant, In addition to our Fuji CPs we run Universal machines, and although they are pretty reliable, they are not in the same league. Regarding Fuji Placement speed we hit 30K plus on a couple of boards with no issues, but you do have t

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 12:41:48 EDT 2015 | deanm

I chose a Vitronics XPM3i primarily for the AutoSet automatic profile generation feature. We are high mix and simply cannot profile every board. The AutoSet feature is quick, easy and we rely on it 100% and have great results. These ovens have had ve

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