eia

"eia" search results in the Electronics Forums



97 results found for "eia" in the Electronics Forums

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orientation of polarised smd components on reels/tapes

Jul 29, 2016 | The standard you need is EIA-481B. It details the taping of components from 8mm tape up to 200mm ta

Tape and Reel Flatness?

Nov 26, 2012 |

Peel Back Force

Aug 25, 2010 |

Peel Back Force

Aug 25, 2010 |

SMT Components - Pitch

Apr 13, 2010 | Electronic Industries Association (EIA) Standard 481

SMD nomenclature

Mar 27, 2007 |

SMD nomenclature

Mar 27, 2007 |

Tape and Reel - IPC/JEDEC or other Standards ?

Jan 23, 2007 | for SMDs, try to look for EIA-481.1.2.3, or may be the new version EIA-200 if I am not wrong. Als

"Gap" in completed solder joint between lead and pad

Nov 30, 2006 | Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001

Peel back force

Aug 31, 2006 |

Peel back force

Aug 31, 2006 | I rember time ago, the EIA-481 (1-2-3) and recntly may be EIA-200 ? sorry I anm not sure. Best Re

0402 feeders

Aug 3, 2006 |

Raw PCB packaging

Feb 22, 2006 |

Cover tape tearing

Dec 15, 2005 |

cap size and copper thickness vs part size questions

Nov 14, 2005 | Ceramic capacitors larger then EIA size 1812 are known to be very susceptible to thermal shock damag

SMT reels using paper for caps and have problems with feeder jam

Oct 27, 2005 | EIA-481-B Max tape thickness 1.1mm (not including bottom and top cover tapes which can be .1mm max

SMT reels using paper for caps and have problems with feeder jam

Oct 27, 2005 | Thanks Rob, Our tape does meet the Kemet spec but I am actually wondering if there is an EIA spec or

Component Package/Classification

Apr 13, 2005 | Dimension mm (LXW)||JIA||EIA 1.0X0.5||1005||0402 1.6X0.8||1608||0603

Need a Feeder Engineer

Mar 3, 2005 |

feeder pitch

Feb 14, 2005 | EIA-481 standard allows the maximum pitch on tape to be 4mm less than the tape width (12mm width and

BGA Solderability Standard

Sep 14, 2004 | USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern

Questions about SMT Process Control

Aug 13, 2004 | Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Termin

How to qualify move from water wash SMT process to No clean?

Jun 24, 2004 | IPC / EIA J-STD-001-C, Appendix B

What standards should electronic manufacturing meet?

Mar 9, 2004 | I suggest you look at the IPC/EIA J-STD-001C. It provides 3 different yardsticks depending on the en

SMT Component Tape Standards

Nov 25, 2003 | http://global.ihs.com/ ...is the distributor for EIA standards. It'll cost you about 50 bucks.

Why 50 mils in 0805 package instead of 40 mils.

Oct 6, 2003 | The EIA does not provide that information. EIA standards focus on component dimensions. Alternatel

Why 50 mils in 0805 package instead of 40 mils.

Oct 6, 2003 | Does the EIA standard recommend any standard PCB pad sizes (LxB)? and pitch-to-pitch (Pad) distances

Why 50 mils in 0805 package instead of 40 mils.

Oct 3, 2003 | EIA standard packages have a variety of L/W proportions. EIA||Dimension mm (LXW)||Proportion (L/W

EIA vs. CECC

Sep 10, 2003 | A customer recently questioned our use of the EIA curves for derating SMT devices for increased ambi

EIA vs. CECC

Sep 8, 2003 | A customer recently questioned our use of the EIA curves for derating SMT devices for increased ambi

Has anyone looked into Vacuum storage on moisture sensitive devi

Aug 19, 2003 | JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effec

Voids in solder fillet

Apr 17, 2003 | Thanks Dave! What level of voiding is acceptable? Would you please let me know if there is an EIA

Feeder tape size

Sep 27, 2002 |

Gold plated board, with csp's and 0603 with no clean apetures

Sep 26, 2002 | unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull,

SMT COMPONENTS

Jul 23, 2002 |

Moisture Barrier bags

May 3, 2002 |

Sn/Pb diffusion

May 3, 2002 |

Tray size

Apr 12, 2002 | Consider: * Finding JEDEC [ http://www.eia.org/jedec/ ] publication that includes matrix trays is:

SPC on SMT

Nov 20, 2001 | First, determine a standard to follow. IPC/EIA J-STD-001C "Requirements for Soldered Electrical and

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fluid dispensing pumps for integration

Reflow Oven