Electronics Forum: electrical clearance (Page 1 of 2)

CSP assembly compliance to IPC-A-610 minimum electrical clearance

Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29

Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi

What is electrical clearance?

Electronics Forum | Thu May 26 21:04:04 EDT 2005 | thaqalain

What is electrical clearance?

Solder balls under LLP

Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos

Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c

Referee Call on Solder Balls

Electronics Forum | Thu Jan 31 13:01:33 EST 2013 | kmots15

Defect if its not coated. Defect - Class 1,2,3 • Solder balls are not entrapped, encapsulated or attached or can become dislodged in the normal service environment. • Solder balls violate minimum electrical clearance.

solder ball

Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw

Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j

minimum solder ball (bead) size

Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks

IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap

solder balls

Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve

The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac

solder splatter inspection

Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef

You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu

SMT electrolytic capacitor lead classification is???

Electronics Forum | Tue Dec 02 07:56:40 EST 2008 | realchunks

Wow, rocket science with Nasa specs! I like it. I don't see the trick question here, so I'll continue.... IPC simply states over hang of round or flattened (coined) leads is acceptable (class 1, 2, & 3) if it "does not violate minimum electrical c

solder ball

Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw

From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce

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