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Feb 1, 2018 | ... >"...electro-chemical migration failures..." Come on Michael, You are totally selling it here.< Evtimov: What do you mean? Are you saying that electro-chemical migration failures like tin whiskers and dendrites are not a concern? Are you one of those ECM deniers? Look here: * NASA "Metal
Jan 31, 2018 | "...electro-chemical migration failures..." Come on Michael, You are totally selling it here.
Jul 19, 2016 | Hi Pavel … Sad that you lost your "Soldering In Electronics" by R. J. Klein Wassink Points are: * According to Google Books, there is no eBook [https://books.google.com/books/about/Soldering_in_Electronics.html?id=P1aaAAAAIAAJ]. * Publisher: Electrochemical Publications Limited [Asahi House, 10
May 9, 2013 | for evaluating the compatibility of coating materials with other process materials. In his book [Cleaning and contamination of electronics components and assemblies, Brian N. Ellis, Electrochemical Publications Limited, 1986, 0901150207], BEllis recommended not using a solder mask if you intend to coat
Nov 15, 2012 | in the development and characterization of a manufacturing process,” said Doug Pauls, one of the leaders in the 5-32b SIR and Electrochemical Migration Task Group that developed IPC-9202, Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance. Testing
Mar 2, 2012 | to header legs by soldering or mechanical methods Answer (Infrared) See datasheets for pin out connections . See http://www.cambion.co.uk/Catalogue/Parts/1813.htm for recommended sockets. Answer (Electrochemical
Jan 17, 2011 | SMTnet Newsletter Aug 1999 by B Ellis Title: A Comprehensive Guide to the Design and Manufacture of Printed Board Assemblies Vol. 1 & 2 Editor: William Macleod Ross Publisher: Electrochemical Publications Limited, GB This two-volume work can possibly be considered the definitive work on all
Sep 8, 2010 | SERA testing (sequential electrochemical reduction analysis)can measure surface oxidation, not sure on inner layers.
Nov 30, 2009 | "Environment Friendly Electronics: Lead-free Technology", J Hwang, Electrochemical Publications, 2001 , Chapter 6.2, contains a significant amount of data on 58Bi/42Sn that may help you better understand the 58Bi/42Sn solder alloy. We're not so sure that you'll find much on SAC305
Sep 22, 2009 | They could be correct about the silver if it weren't such a small portion of the connection. Study "electrochemical series of metals" to understand how metals react with each other.
Jul 14, 2008 | & Diepstraten, G; Circuits Assembly; 01-MAY-07 * Soldering in Electronics, RJ Klein-Wassink, Electrochemical Publications, 2nd e, Chapter 4.4. * J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications * Coombs' Printed Circuits
May 29, 2008 | for Microelectronic Assemblies Edited by Karl Puttliz and Kathleen Stalter Published by Marcel Dekker Flexible Circuit Joe Fjelstad - Electrochemical Publications Area Array Interconnection Handbook Karl Puttlitz & Paul A Totta - -Kluwer Academic Publishers Comprehensive Guide to Design, Manufacture of Printed Board Assemblies Bill MacLeod Ross - Electrochemical Publications Quality Assessment of Printed Circuit Boards (Out of Print search on line its worth it) Preben Lund - Bishop Graphics Inc. SMT for PC Board Design (2nd - 3rd Edition) James Hollomon - Prompt Publications Printed Circuit Handbook (5th Edition) Clyde Coombs, Jr. - McGraw Hill Electronic Failure Analysis Handbook Perry L. Martin Mc Graw Hill Microelectronics Packaging Handbook (1st Edition) Tummala and Rymaszewski - Van Nostrand Reinhold Soldering in Electronics (2nd Edition) Klein Wassink - Electrochemical Publications
Feb 25, 2008 | ="_blank">http://en.wikipedia.org/wiki/Dendrite_(crystal) For us, electromigration is the electrochemical process that creates dendrites. As a bonus, here's a link to an article on conductive anode filament [CAF]: http://www.empf.org/empfasis/2007/Jan07/cond
Jul 28, 2007 | silver ALL are subject to corrosion in Battelle Class 3 environments (creep corrosion and/or fiber assisted electrochemical migration, blistering/peeling of conductive corrosion products, etc.) * Only SnPb HASL and immersion tin survive this environment ** SnPb HASL is not Pb-free ** Immersion tin has
May 21, 2007 | : Soldering in Electronics; RJ Klein Wassink; Electrochemical Publications 1989 [090115024X]; Table 4.8, p164
Jan 16, 2007 | DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this book more than any other book. It lays ; Electrochemical Publications; ISBN 0901150207 Handbook for Critical Cleaning; Barbara & Ed Kanegsberg; CRC Press; ISBN: 0849316553; [December 2000] Handbook of Aqueous Cleaning Technology For Electronic Assemblies; FR Cala, AE Winston; Electrochemical Publications; ISBN: 0901150312;  Components Passive Viswanadham, Pratap Singh; Kluwer Academic Publishers; ISBN: 0412105918; 1st edition; [January 1998] SMT Assembly A Comprehensive Guide To The Design And Manufacture Of Printed Board Assemblies - Volume 1 & 2; W. MacLeod Ross; Electrochemical Publications; V1: ISBN [V1] 0901150320, [V2] 0901150339;  A
Aug 13, 2006 | ANSI-J-STD-001, MIL-P-28809, MIL-STD-2000: LT 10.07 �gm/in^2 NaCl equivalent Electrochemical failures are the result of contaminants residing on the surface of the laminate and/or components of an assembly. To create the reverse plating cell that produces electromigration, required components are : * Bias voltage * Moisture * Active ionic material. For more reading, Google => electrochemical migration What flux are you using?
Aug 3, 2006 | You might consider an oxygen monitor (or lack of oxygen monitor). A fast response-rate analyzer should be used. There are several types of analyzers on the market and each has different limitations. * If you are looking for a measurement ranging from air to ppm O2 then an electrochemical or micro
Oct 29, 2004 | Electrochemical migration under conformal coating: That's possible. Very few conformal coatings are water resistant. So, if you have ionic material on your board, standback. Uncured material under several IC: Materials like yours need moisture from the atmosphere to cure. So, when the material
Oct 27, 2004 | We are producing boards with Alpha 591S RMA No-Clean paste and are coating after SMC with Dow silicone ( toluene solvent based) conformal coating. We have experienced several failures due to soft shorts ( electrochemical migration?) We have also observed areas of uncured material under several ICs
Aug 11, 2004 | stubby legs can carry us and grab Coombs' "Printed Circuits Handbook" [McGraw-Hill 5e ISBN: 0071350160 ] Plating books are: "Electroplating: Fundamentals of Surface Finishing" Lowenheim, FA (0070388369 McGraw Hill) (1872422039 Electrochemical Pub) "Graham's Electroplating Engineering Handbook" 4Ed , Durney, LJ Chapman & Hall (0412741105) "Modern Electroplating : Electrochemical Society Series" 3Ed, Lowenheim, FA John Wiley (0471549681) 'Metal Finishing Guidebook and Directory'. Published annually by Elsevier Science Publications, New York, New York, USA. ISSN 0026-0576. Lecture notes on plating:
May 10, 2004 | The three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinning operation. * Surface stripping chemistry and then a standard retinning operation. * Electrochemical conversion chemistry and then a standard retinning operation. Keep in mind . * Electrochemical conversion is great, but level of cleanliness and some surface materials (eg, iron) can contaminate the electrochemical cell. ROSA cathode grids have an iron tolerance on the that requires periodic maintenance schedule attention.
Apr 20, 2004 | and then a standard retinning operation. * Electrochemical conversion chemistry and then a standard retinning operation. Keep in mind that none of the three basic methods work on everything and all are highly dependent on just what/amount of finish remains on the component lead and the amount of oxidation chemistries are specific to the surface (eg, copper, nickel, or alloy 42, etc.) to be stripped. Electrochemical conversion is great, but level of cleanliness and some surface materials (eg, iron) can contaminate the electrochemical cell. ROSA cathode grids have an iron tolerance on the that requires
Mar 9, 2004 | attributable to flux residues. Chlorides will generally initiate and propagate electrochemical failure mechanisms, such as metal migration and electrolytic corrosion, when combined with water vapor and an electrical potential. The amount of chloride that can be tolerated on an assembly depends on the flux
Sep 9, 2003 | and Surface Mount Technology, No. 9, Oct., 1991, Wela Publications, Ayr, Scotland, Table 5. RJ Klein-Wassink gives additional references in "Soldering in Electronics" [Electrochemical Publications; ISBN: 090115024X; 1989], 184.108.40.206. IPC-HDBK-001, page 64 gives additional references. Here's another
Feb 28, 2003 | Paul We don't like to mix metals on press fits. Yano, we do gold on gold or solder on solder, but we don't mix metals [except with imm silver / tin] to avoid electrochemical corrosion. Is that bad information or does AMP think that's not a problem?
Nov 25, 2002 | Electrochemical Reduction Analysis ( used for pure Tin thickness ) or XRF Spectrometry ( used for total Tin from all layers ). I think you should have .65 microns of pure Tin or 1.0 microns of overall Tin to achieve desired results. That's just my opinion, I could be wrong!
Oct 18, 2002 | to maintain a solderable surface. The ROSA technology uses electrochemical reduction principles to convert surface oxides of a variety of surface finishes, thus restoring solderability. This process is performed in an aqueous solution so any residues are easily and quickly rinsed away. ACI has one
Aug 20, 2002 | of the solderable surface affect your ability to wet. About soldering to nickel, Manko says: * Electrochemical: Fairly easy to solder, may require a more active flux. * Electroless: Phosphorous is difficult to control. [The P co-deposits with the Ni.] So, high P, GT 5-7% [others say GT 8%], makes it difficult
Aug 16, 2002 | Dave- once again you are correct. ACI/Empf (www.aciusa.org or http://www.empf.org) have a process to electrochemically revert the process back to a usable form. contact Greg Wood at ACI 610-362-1200. Cal
Jul 26, 2002 | requires: * Bias voltage. * Moisture. * Active ionic material. Anyway, consider poking around TM-650 for a test to your liking, maybe 220.127.116.11 Electrochemical Migration Resistance Test.
Jul 18, 2002 | can create latent defects that might not become apparent before the product ships to the customer. * Soldering is about the coolest thing. People have been soldering since ~4000BC and still haven't figured-out how to do it. * Wassink "Soldering In Eletronics" Electrochemical Publications [090115024X
Apr 18, 2002 | and solder according to MIL-F-14072 is 0.65 volt. According to MIL-F-14072, the magnitude of the potential difference should not exceed 250 mV in order to minimize possible electrochemical corrosion.] * Can you use organic solderability preservative [OSP] instead of the ENIG? Press fit with OSP [organic
Apr 1, 2002 | nature of your: * Solder mask? * FR-4 construction of your boards? True. Epoxy is hydroscopic. It is used for many purposes in electronic manufacture. But the real issue isn�t moisture lovers. Electrochemical failures are the result of contaminants residing on the surface of the laminate and /or components of your assembly. To create the reverse plating cell that produces electromigration, required components are: * Bias voltage * Moisture * Active ionic material. Increasing any one of the these required components will increase in electrochemical migration. BIAS VOLTAGE. The circuit design will produce a finished assembly with low risk for electrochemical failure. Halide residues are usually the root cause of dendritic growth. Halide residue may be from fluxes in the assembly operation or from HASL fluxes used in PCB fabrication. You should investigate both areas, bare board and assembly
Mar 6, 2002 | , no metal migration, which are the big factors in figuring out electrochemical reliability. People often have a greater comfort with passing SIR than they do with passing ROSE tests. Of course, SIR testing takes a while. Actually, it is best to do both ion chromatography and SIR at the same time so you
Feb 27, 2002 | * Wassink "Soldering In Eletronics" 2e Electrochemical Publications 1989 ISBN 090115024X * Coombs "Printed Circuits Handbook" 5e McGraw-Hill 2001 ISBN 0071350160
Feb 25, 2002 | ) and bromide levels do not exceed 20 (mg/in2). In our experience, halide residue content higher than these levels is an indicator of progressively greater incidence of electrochemical failures.
Feb 2, 2002 | �8.4.2, Cracking Of Soldered Joints in the epic "Soldering In Electronics" by RJ Klein Wassink [Electrochemical Publications,ISBN 0 901150 24 X] covers cracking differented by: * Overloading * Creep * Fatigue You can't go wrong by starting there.
Jan 28, 2002 | Sounds like an interesting project. In Euroland and Japan, there are political moves with no scientific basis afoot to exclude lead from electronic products. There is a HUGE body of knowledge on the topic. For instance, Electrochemical Publications recently published "Environment
Jan 16, 2002 | aperture guidelines.
* Reading �Manufacturing Techniques For Surface Mounted Assemblies� RJ Klein Wassink & MMF Verguld; Electrochemical Publications . It gives pinching guidelines for different pad sizes.
* Employing the �Evolver� model [
Jan 3, 2002 | the acceptability of these connections.
* When you alloy metals, the combination of the metals determines the reliability of the solder connection. In "Lead-Free Solder - Technology & Applications For Environmentally Friendly Manufacturing" [Electrochemical Publications 2001 ISBN 0901150401], the author, Dr JS
Jan 3, 2002 | the acceptability of these connections. * When you alloy metals, the combination of the metals determines the reliability of the solder connection. In "Lead-Free Solder - Technology & Applications For Environmentally Friendly Manufacturing" [Electrochemical Publications 2001 ISBN 0901150401], the author, Dr JS
Oct 6, 2001 | ; Electrochemical Publications; ISBN 0 901150 31 2] on saponifiers, a SMTA member, and very smart. Always remember: Give the customer what he asks for, so long as he�s not too retarded.
Aug 22, 2001 | of information, probably repeated 9 scatzillion times in the fine SMTnet Archive that you'll be searching, is Wassink "Soldering In Eletronics" Electrochemical Publications. Can't go wrong it's THE BOOK.
Jul 23, 2001 | Prasad�s book, that an earlier poster mentioned, is good, but other books to consider are: * MacLeod Ross �Guide Design & Manufacturing V1 & V2� Electrochemical Publications * Wassink & Verguld �Manufacturing Techniques For Surface Mount Assembly� Electrochemical Publications * Look at the SMTA
May 24, 2001 | Try: * Poor looking solder connections * Good looking solder connections * Reliable solder connections Look to Ch 5 of "Manufacturing Techniques For Surface Mounted Assemblies"; RJ Klein Wassink & MMF Verguld; Electrochemical Pub; ISBN 0-901150-30-4 as a point reference.
Mar 3, 2001 | We test Parts and Components to IPC J-std-002/003. We also use a wetting Balance tester to determine solderability. We also test with SERA. We use ROSA to electrochemically revert the components back to their original state. Need more info ... email me firstname.lastname@example.org
Jan 6, 2001 | paste the other day � whatever.] I�d still be nervous about silver GT 3. HARD PART - ELECTROCHEMICAL MIGRATION Over the years, silver has developed a bad rep because it migrates more than more commonly used materials [eg, copper, gold, nickel]. Not to say those other materials won�t migrate given the chance. Electrochemical Migration (ECM). An unplanned electrolytic plating process. A film of polar solvent, often water, on a substrate surface provides a path for current flow between points with a difference in electrical potential. The process "grows" metal fingers between two traces, causing a short. Methods for measuring / observing electrochemical migration are: * IPC-TM-650, 2.6.13 * EP&P, 10/99, p. 45
Nov 8, 2000 | ACI offers solderability restoration services by using Reduced Oxide Soldering Activation (ROSA) technology to remove the oxide layers from circuit boards or components and then re-tin or otherwise coat them to maintain a solderable surface. The ROSA technology uses electrochemical reduction
Oct 16, 2000 | on the information mentioned in KW "Soldering �". References with a bunch more detail are: * "The Mechanics of Solder Alloy Wetting and Spreading" ISBN 0-442-01752-9, "Chapter 6: Oxidation of Solder Coatings" Dr. M. Tench * "An Examination of Artificially Aged PWB Surfaces Using Sequential Electrochemical
Aug 10, 2000 | Simon, when it comes to soldering those lovly little PCb's why not read Soldering in Electronics by R.J. Klien Wassink (electrochemical publications). Dave F found this to be a real hit in Jimbo's! ( I on the other hand, never mastered some of the big words and had to settle or lonely nights