Electronics Forum | Tue Aug 26 13:28:50 EDT 2008 | qaman
I am new to the board so be gentle with me. There are standards such as IPC-610 for PCB assembly, IPC-600 for bare boards, etc. Is there a "standard" for electro-mechanical assembly? Is there an IPC standard or any other industry approved standard
Electronics Forum | Tue Sep 02 13:30:05 EDT 2008 | evtimov
I am new to the board so be gentle with me. > There are standards such as IPC-610 for PCB > assembly, IPC-600 for bare boards, etc. Is there > a "standard" for electro-mechanical assembly? Is > there an IPC standard or any other industry > appro
Electronics Forum | Sat Jun 28 22:52:34 EDT 2003 | ramanandkini
We have an Electromechanical assembly (clock) that has a step motor on the board. This electromechanical assembly is assembled in a screw less plastic moulded casing. The plastic casing is neither air tight nor water proof. The board is with SMOBC+ H
Electronics Forum | Thu Oct 03 09:53:08 EDT 2002 | Jim Gryga
I am looking for a software package that can provide me with a ballpark estimate of labor time required to assemble electro-mechanical products. The inputs that I imagine would include number and size of fasteners, number of wire connections, number
Electronics Forum | Tue Dec 28 09:36:34 EST 1999 | Dan Woodward
Certainly automatic placement, preferably with vision system assistance will yield a more repeatable process. Process repeatability (paste deposition, connector placement, reflow cycle, etc.) will be your key to success here. Another possibility yo
Electronics Forum | Sun Feb 15 10:47:16 EST 1998 | SMT-ASSY
In reference to your Email response, we will propose to you in the next few days a course curriculum which we hope you will find of great interest. As we told you we offer courses for assemblers and techs in PTH, SMT soldering, SMT full process using
Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
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