Electronics Forum | Fri Aug 23 12:35:09 EDT 2002 | msjohnston
Has anyone done a study or know of one that addresses the flow / no-flow underfill differences for CSP devices. My main interest is in the reliability of the CSP and underfill. Any help would be great. Thanks, Mike
Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi
weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??
Electronics Forum | Sun Aug 25 07:15:55 EDT 2002 | cnoonan
What are the industry standards for eutectic solder-paste in conjunction with the life span of solder-paste. What is the recommended duration of solder-paste on a printed circuit board. Example: You print a board, how long can it sit before runnin
Electronics Forum | Mon Aug 26 09:02:53 EDT 2002 | blnorman
Our requirement is 2 hours after printing before the board needs to go through the oven. Course we're in the humid south where on those 95%+ RH days we do get solder balling.
Electronics Forum | Tue Aug 27 01:19:38 EDT 2002 | zolasteven
Hi, I have a few questions regarding printed circuit board. What is the difference between the solder pads and the solder resist or mask? What is the purpose for the solder resist? What color is it? When printing solder paste should the paste be
Electronics Forum | Wed Aug 28 19:30:45 EDT 2002 | davef
This all gets confusing with this jargon and that. There is a fair amount of tutorial material on the web. For instance: http://brl.ee.washington.edu/CE/notes/lec_pcb.pdf
Electronics Forum | Wed Aug 28 11:52:24 EDT 2002 | lysik
What kind of print problems are you Having? Off pad, Voids? Or is it slumping, etc? You really should be all set with OSP boards. If I can get some more specific info I could probably help.
Electronics Forum | Tue Sep 10 01:51:46 EDT 2002 | bentzen
Hi. The towel was red and white as the Japanese flag ! The issue was addressed to Fuji Japan and was handled there. Vision type 11 and 12 do not allow protruding nozzles, so for 0603 (1608) they can't be used. Regards Brian
Electronics Forum | Wed Aug 28 19:35:13 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Electronics Forum | Thu Aug 29 20:34:02 EDT 2002 | ppwlee
A gap of 150-200� between potential shadow components is enough to eliminate those problems. Dave, Can you clarify? Do you mean 0.015 to 0.02?? Peter
