Electronics Forum: electron (Page 2681 of 7890)

BGA Installation with IR unsolder

Electronics Forum | Mon May 19 08:18:22 EDT 2008 | davef

You should set the temperature at liquidus point of the solder used on the BGA plus 20 to 25*C. So, for tin-lead that would be ~215*C. Most lead-free solders run about ~20 to 25*C higher than that.

BGA Installation with IR unsolder

Electronics Forum | Tue May 20 10:27:29 EDT 2008 | azimi789

I just set that as you said, but the component doesn't stick on the board. I use AMTECh Flux type: RMA-223.. what should I do ? Thanks.

BGA Installation with IR unsolder

Electronics Forum | Thu May 22 01:37:31 EDT 2008 | azimi789

I found out that the light is not heterogeneous, i am trying to solve this problem... from my web surfing I encountered an article that claimed there should be 200 grams Placement Pressure on the BGA while soldering ... is that really needed? 200 gr

Fuji CP43 placement

Electronics Forum | Mon May 19 09:56:57 EDT 2008 | aj

all, The placement was off on one panel ( 4 up ) out of the batch. It was off by approx 1mm in the y-axis. No obvious faults found with machine. Any experience of such problem - I am guessing this is a sign of something wearing on the machine or s

Envirosense Cleaner

Electronics Forum | Tue May 20 11:11:09 EDT 2008 | toddl

We use Envirogold for one of our customers boards. It is a fairly aggressive cleaner that works well on RMA fluxes. We have no complaints about its performance.

QSoft importing Cad Data

Electronics Forum | Tue May 20 09:46:57 EDT 2008 | leemeyer

Qsoft will accept a negative theta on import and change it to a positive theta. For example cad data with a -90 theta will appear as 270 theta after import.

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef

Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Mon Jun 09 06:37:42 EDT 2008 | roc2x

Hi, After reflow process we do Automatic inspection and after that direct to 5DX machine to check all the solder joints and we detected it at 5DX inspection. This card havent go to any testing.

Who makes the best after market Fuji nozzles ?

Electronics Forum | Tue Dec 16 04:28:16 EST 2008 | robi

New to the market Smtxtra nozzles been going 18 months in Europe doing well supplier to Oem and main CEMs, now in the US and Mexico, Well engineered product worth a check, if you need references they can supply.

Who makes the best after market Fuji nozzles ?

Electronics Forum | Tue Dec 16 12:25:29 EST 2008 | evtimov

I saw this company. Never tried it. http://www.epacnet.com/html/nozzles.htm emil


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