Electronics Forum | Mon Nov 09 02:39:38 EST 2009 | martinphill
No the machine is not capacity constrained. We do not use IPC-9850. Rated CPH is taken from Equipment manufaturer. Fuji-CP643. Universal HSP4796 We have 3 manufaturing units at different location Difficult to standardize OEE calculation
Electronics Forum | Mon Nov 09 06:42:55 EST 2009 | davef
If the machine is not capacity constrained, what is the point of measuring how close to the optimum efficiency that it is operating? * Capacity of individual machies are unimportant, unless they are capacity contrained * Capacity of your line is depe
Electronics Forum | Fri Nov 06 18:40:25 EST 2009 | davef
While you're waiting for others to reply, look here: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=13874&mc=19
Electronics Forum | Tue Dec 01 01:43:53 EST 2009 | micronpt
Sir, you could buy SMT spares from us.We are an Asian precision fabrication house, specialized in the SMT machine spare/ custom made parts.Email us micronpt@micronpt.Please visit http://www.micronpt.com for more info. Thanks Siva
Electronics Forum | Tue Nov 10 07:37:32 EST 2009 | scottp
I'm curious why your customer is concerned with BGA voiding. Normal process voids, even well in excess of IPC "limits", don't effect reliability so why monkey with the process to get rid of a non-issue?
Electronics Forum | Fri Nov 13 01:45:35 EST 2009 | hallwayit
Could you clear how much void content do you client required? Normally, 5% void content is permited in clients.
Electronics Forum | Mon Nov 16 03:31:22 EST 2009 | cunningham
I suggest you X-Ray the devices before you place them on the board we have just foun a large amount of voids on the BGA before its even placed
Electronics Forum | Mon Nov 09 14:01:07 EST 2009 | bettsd44
Good day all, I am in need of the calibration procedure for a model AQ-400 from Aqueous Tech. The manuals we have do not cover that. Any one? Anyone?
Electronics Forum | Tue Nov 10 07:35:04 EST 2009 | scottp
Step 1 is to find out what kind of opens you're getting through a cross-section or die & pry. Are they head in pillow, brittle fracture at the intermetallic, bulk solder cracks, ball separation from interposer? Without some basic failure analysis a
Electronics Forum | Mon Nov 09 22:51:34 EST 2009 | msherwood
How hard is it to replace and reformate the C: drve in a HSP 4796. I have all the disk I think and the cal disk. Is there something specail I should know before I start.
