Electronics Forum | Wed Mar 01 17:07:50 EST 2000 | Dave F
Brian: Several things: � Many CAD systems offer compliant pad design libraries � Look at IPC-SM-782 "Surface Mount Design And Land Pattern Standard" � Some times, component manufacturers have the best information about pad designs for their compone
Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv
Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
Electronics Forum | Thu Mar 02 21:17:41 EST 2000 | Dave F
Dave: It's good to know what that stuff is. With your NiO, you have the typical ENIG problem. I can imagine some causes for your disaster: * too thin gold plating * oxidized nickel under gold plating * porous nickel plating * wrong soldering pr
Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Wed Mar 01 17:29:30 EST 2000 | Eldon Sanders
Thanks Dave for your reply. I have found a supplier that can cut it, but I am trying to save the tooling cost and the minimum purchase dollar ammount imposed by the supplier. If an off the shelf item existed I could buy what I wanted when I wanted.
Electronics Forum | Mon Feb 28 08:18:03 EST 2000 | Engineer
I'm currently researching new rework equipment, and was wondering if anyone had any recommendations. We currently have an older PACE hot air system that has had mixed results. It tends to overheat the board and IC. Is the IR any better, or has hot ai
Electronics Forum | Sat Feb 26 09:22:19 EST 2000 | Dave F
Jason: Assuming you wantto reuse the TSOPs, two things come to mind: 1 Don't bend the leads. This can be caused by not melting the solder on all leads at the same time. 2 Don't break the body. This can be caused by moisure absorbed by the case ex
Electronics Forum | Fri Feb 25 16:23:10 EST 2000 | Russ
Assuming that you need information such as the type and size of screw to the recommended torque value. I have found great information from the torque tool manufacturers themselves! There is an ANSI spec but I don't know the specifics. Your torque d
