Electronics Forum: electron (Page 4151 of 7890)

lead free solder

Electronics Forum | Fri Dec 13 16:39:42 EST 2002 | Gris

Hi, Look for papers on SMTA there are a lot of papers on lead free rework. If you dont find any let us know here I am sure you will receive many. Here are a just a few http://www.google.com/search?hl=en&ie=UTF-8&oe=UTF-8&q=%22lead+free+rework%22&

Lead Filled Bean Bags for Thru-Hole Wave Solder Components

Electronics Forum | Sat Dec 14 10:10:04 EST 2002 | davef

This is a good idea. Heck, you could fill the bags with sand, if you wanted. Like anything else in the shop, bean bags require attention and maintenance. If you don't, eventually the seams on the bags loosen / break and you have to do a "clean-u

Lead Filled Bean Bags for Thru-Hole Wave Solder Components

Electronics Forum | Mon Dec 16 08:19:20 EST 2002 | Randy Villeneuve

We trasfered a product in some time ago and they were using erasers to hold down parts. Some parts will move around during wave and some parts just need to be positioned correctly after wave so hold downs are required. I personaly have never used a b

Lead Filled Bean Bags for Thru-Hole Wave Solder Components

Electronics Forum | Mon Dec 16 15:12:05 EST 2002 | sueph

I made a small bean bag from 100% cotton filled with rice, to hold down small resistors that wanted to tilt over solder wave. It worked fairly well as long as I didn't try to take it off the components to soon, as sometimes they would want to stick

Lead Filled Bean Bags for Thru-Hole Wave Solder Components

Electronics Forum | Wed Dec 18 14:08:18 EST 2002 | trynders

I have used these bean bags for several years now. They work great for holding down odd formed components during the wave process. I use the cotton ESD smock material and cut out what ever size I need. Works Great!.

Lead Filled Bean Bags for Thru-Hole Wave Solder Components

Electronics Forum | Fri Dec 20 17:01:23 EST 2002 | davef

The rice and soup mix illustrate the point that you probably should NOT be using the lead shot mentioned in the initial post on this thread. The oxide powder on the lead shot could work its way to the surface of the "bag", get onto troops' hands, an

component availability management

Electronics Forum | Sun Dec 15 14:32:46 EST 2002 | Carl Brytz

arzu, We have BOM parsing and normalization tools with revision management capabilties. We would like to discuss this with you as well determine what other functional requirements you may have. Depending your location one of our Applications Engine

Cracked vias

Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj

Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep

Fine pitch paste release problems.

Electronics Forum | Mon Dec 16 21:34:05 EST 2002 | grantp

Hi, Yes, the stencil does touch the PCB. Is there another method? Sorry to sound a bit dumb on that, however I don't have a lot of experience with automated stencil printing, and manual has been working well up to now with this BGA. Regards, Gra

Fine pitch paste release problems.

Electronics Forum | Mon Dec 16 21:40:27 EST 2002 | grantp

Hi, Thanks for the info, and I will check it out. Do you know where the IPC 7525 spec is? Does it explain why square is better? I know there is some theory I am missing here, and that's why we have problems. I am just freaking out trying to establi


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