Electronics Forum: electron (Page 4376 of 7890)

BTU Paragon 150 Reflow Oven

Electronics Forum | Sun Apr 23 09:07:42 EDT 2006 | kanna

i have one problem here with BTU TRS-14. we encounter Over temperature Alarm trigger when run lead free product. our profiling peak temp is 230 degree's and the temperature set point at zone 4 top/bottom is 260 degree's. can any help on this issue

BTU TRS-14

Electronics Forum | Tue Apr 25 01:23:28 EDT 2006 | kanna

Thanks. currently we already reduce the temperature and change the bimetallic switch. can anyone help me on the alert problem. the alert trigger when the zone 1 section empty without board. current temperature setting is 187 even i lower the tem or i

BTU TRS-14

Electronics Forum | Wed Apr 26 04:36:36 EDT 2006 | rlackey

I don't believe that the TRS14's are suitible for lead free - the max temp rating from the data sheet is 275oC. When you get near temperatures like 350 C I'm under the impression that the oven itself would start suffering embrittlement damage. Howev

Fuji PAM measure

Electronics Forum | Fri Sep 16 12:58:49 EDT 2005 | vikkaraja

Fuji sells a PAM kit. It includes all the needed things you will need to accomplish this. It has a reel of 1206 black colored chips, doule sided tape, PCB, flopy with PAM program , and a ram card for the particular machine. I hope it help you some. G

quoting assembly work

Electronics Forum | Fri Sep 16 10:01:40 EDT 2005 | Mark

Get a hold of a couple different contract manufacturers with some fake jobs. Than see how they map out their quoting and assembly process. I know we map out the whole overall cost and break it down for the customer. But for competitive reasons I can'

Using Glue on Stencils What aperatures to use?

Electronics Forum | Fri Sep 16 13:03:11 EDT 2005 | james

We current use glue on our bottom side boards using stencils and screen printers. Our Glue aperatures that we use are very small rectangles and they seem to clog very easily. We currently are using Heraeus PD955PR #8 and see alot of boards that ar

Scrap criteria

Electronics Forum | Mon Sep 19 06:24:59 EDT 2005 | OEM Manufacturer

Does anybody know of any standards that are available that cover how many times a part or complete unit can be reworked before it is considered to be scrapped? I am currently writing a process to review this with a supplier. For example, a bga devi

Scrap criteria

Electronics Forum | Mon Sep 19 08:43:30 EDT 2005 | stepheniii

There is not "one size fits all" answer. One criteria I've heard used is scrap it after so many hours of troubleshooting if it's not fixed. End use of the board would be a factor as well. I would want someone giving up salvaging a board for a defibr

tape splicing pros and cons

Electronics Forum | Wed Sep 21 10:11:12 EDT 2005 | gregp

Hi Rob, I'm not sure I know what you mean. Are you referring to adding leaders to cut tapes in order to minimize component loss? Also, I've never heard of tapes snapping. Is this something you see regularly on a particular piece of equipment? Th

tape splicing pros and cons

Electronics Forum | Fri Sep 23 09:14:47 EDT 2005 | Base

Hey Rob, I've seen operators splicing large tapes not just by sticking them together with a piece of splicing-tape, but additionally they overlap the tapes and (forcefully) insert the last pocket of the leaving reel into the first (empty) pocket of


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