Electronics Forum | Wed Jul 18 11:49:59 EDT 2007 | davef
The auditor may be using "verify" in an ESD Program context. See ANSI/ESD S20.20 [1999], 6.1.3, Compliance Verification Plan. It gives one definition of what the auditor may be seeking. For more on verification programs, look here: http://www.protek
Electronics Forum | Thu Jul 12 11:39:26 EDT 2007 | rgduval
Stephen, I'm hoping that that was the wording, as it makes the most sense. The Td being what it is would tend to make me think that it's a process consideration, rather than a RoHS consideration. Far as I can figure out, chemically, the material m
Electronics Forum | Fri Jul 13 09:43:16 EDT 2007 | lococost
wow, never heard of such a thing! Are you sure it's allways different types of material? Are you using a washer that isnt cleaned regular? I would check your product step by step, from bare PCB to finished product to find out where exactly in your
Electronics Forum | Mon Jul 16 08:42:14 EDT 2007 | realchunks
Hi Scott, Here is another thought. Check your wave solder machine visually. Does the wave flow on both sides of the nozzle? If not, you may have some dross build-up which may be causing your problem. Generally it will only happen on the very fir
Electronics Forum | Fri Jul 13 12:47:03 EDT 2007 | bschreiber
There are many threads regarding stencil cleaners. Here is a recent one: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10557&#Message42748 Regards, Bill Schreiber Smart Sonic Corporation E-mail: Bill@SmartSonic.
Electronics Forum | Fri Jul 13 12:20:33 EDT 2007 | jdumont
There are a lot of areas that could be leading to this problem. We have some of these issues on some boards with this solder as well but the hole fill still meets IPC class 3 requirement of 75% vertical hole fill. Through hole diameter is important.
Electronics Forum | Tue Jul 17 09:49:21 EDT 2007 | slthomas
We haven't used no-lead yet so I can't speak to the specifics of that part of the equation, but am I the only person here that sees "thick board or a board with a large ground plane" and immediately thinks this is a thermal issue? Am I oversimplifyin
Electronics Forum | Thu Jul 19 17:22:17 EDT 2007 | gregoryyork
You need to dwell the boards longer in the wave as the board is the largest heatsink. Just make sure the flux can take the longer dwell times anything up to 4 - 5 seconds so you may have to shallow your angle as well to around 5 - 6 degrees this will
Electronics Forum | Mon Jul 16 09:53:36 EDT 2007 | ed_faranda
Yes, you can use lead-free parts in a leaded process. And the other is true as well, no-lead free parts in a leaded process. BUT, you should not use leaded parts through a non-lead wave solder process and of course, your board will not be RoSH.
Electronics Forum | Mon Jul 16 10:26:54 EDT 2007 | davef
Ed: We agree with you that leadfree parts can be used with leaded paste. We disagree that lead part can be used with leadfree paste. Here is link to a previous discussion here on SMTnet on the topic: http://www.smtnet.com/forums/Index.cfm?CFApp=1&M
