Electronics Forum | Fri May 02 11:11:49 EDT 2008 | lon_sanders
The cable required for the Thinline has to work as a true RS232 interface as the unit uses all the capabilities of RS232. You will have several problems with substitutes. These cables (part number e00-2787-26) are still avaliable from ECD, the home o
Electronics Forum | Fri Apr 25 04:44:56 EDT 2008 | jkhiew
Hi all, I mean after post adhesive oven curing (SMD at bottom side) prior to manual insert of PTH components (top side), what is the recommended storage time prior to wave soldering in order to avoid pin/blow holes and sunken joints issues (pcb asse
Electronics Forum | Wed Apr 23 10:19:53 EDT 2008 | mikesewell
Has anyone tried to increase the working height on their Mirtec AOI. We have several MV-2HTL machines and have a few boards that are over 2" tall. I'd rather not leave the parts out and have a secondary step to install them after inspection. I've
Electronics Forum | Wed Apr 23 10:51:09 EDT 2008 | ap
has anyone come across labelling of SMT carrier tapes? we test devices in a automated handler, but get some customers asking if we can apply numbered labels to the tape to identify the device, ie one label per device. This seems a bit crazy as the s
Electronics Forum | Thu Apr 24 20:52:03 EDT 2008 | davef
Use of a hot air gun to reflow solder that passes tests [after failing those tests] seems to indicate the standard process reflow was inadequate. To understand this better, we'd want to measure temperatures at various points on the board during reflo
Electronics Forum | Thu Apr 24 21:52:18 EDT 2008 | fowlerchang
We have measured the temperature of CSP solder joint. The peak temperature is 232oC and the wetting time above 217oC is 30s. But we use leaded solder paste instead of lead free solder paste. I doubt why no crack of solder joint was observed after cr
Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Fri Apr 25 14:14:48 EDT 2008 | blnorman
We just started having board warpage problems with one of our suppliers. The product has been in production for some time with no design changes, no material changes from the board supplier. Someone told me once that if the PCB cure was not corre
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Electronics Forum | Wed Apr 30 07:33:12 EDT 2008 | davef
It's not acceptable to us. More importantly, you need to determine if it's acceptable to your customer. Recognize that your little IPA scrub does NOT remove the OA flux residues from the board. It mearly spreads them out across the board and under c
.gif)
