Electronics Forum | Fri Jan 09 08:20:43 EST 2009 | caerleon
Does anyone have design knowledge of why some manufacturers remove solder resist from the area around pads on fine pitch devices? What purpose does it serve? I only know that it would be better for AOI as you would not have light being reflected fro
Electronics Forum | Tue Jan 20 12:23:13 EST 2009 | rgduval
Start off by suggesting that they buy the parts as they're going through their layout. Their engineers can output a BOM based on the design, and they ought to be able to buy to that. That also keeps you off the hook for material liability in case a
Electronics Forum | Wed Jan 21 03:09:56 EST 2009 | lkpdsund
I totally agree with Wolfman. I recently had the SMA responsibility for a new product from a new customer. The PCB had 600+ mounting positions. It took me almost two days insering them into the part library because an unusual number of the positions
Electronics Forum | Mon Jan 12 14:50:18 EST 2009 | mosborne
A customer of mine has a Quad 4C that will not home in the X. It used to have the problem in the Y then they changed the cards and now that machine will not home in the X when powered up. Anybody have any ideas. I think I know what the problem is, bu
Electronics Forum | Wed Jan 14 17:31:24 EST 2009 | swag
Doesn't sound like we use it exactly like your application. Similar to what davef says we use it for smaller to medium size or dense parts (sigle dot under the center of the part) that have potential to fall off on 2nd side processing. I can say it
Electronics Forum | Thu Jan 15 12:32:08 EST 2009 | vleasher
After doing some more research it looks like Loctite made a material called Cornerbond 3515 that seems as if it has the characteristics we are looking for such as curing after the solder is liquidous. But it appears that it isn't manufactured anymore
Electronics Forum | Thu Jan 15 15:16:56 EST 2009 | jsherrow
We recently had our customer report a component failure trend of a few percent. Analysis indicates wire bond failure internal to a d-pak caused by what appears to be chlorine contamination. We're running a lead free process with aqueous wash. 700 co
Electronics Forum | Thu Jan 22 09:04:22 EST 2009 | mefloump
Humiseal recommends a 1 to 1 mix ratio of 1B31 and Thinner 521. I have for that I need to thin my ratio more to get humiseal to spray correctly in our PVA650. Also I am using Humiseal 1B73 but the tech data sheets say the same for spraying. Try thinn
Electronics Forum | Fri Jan 16 12:03:46 EST 2009 | black5629
We are encountering similar problem as yesterdays posting, with solder not sticking to the pads but wicking to the leads on Leaded HAL finish boards, except we have tried two different solder paste lots with similar result. The oven profile and paste
Electronics Forum | Fri Jan 16 16:36:07 EST 2009 | boardhouse
i would not try to chemically clean the finish, you would just be asking for other problems. 1) I would ask your supplier their Hasl mix. Standard Lead hasl is 63/37 - it almost sounds like your boards have a higher content of Tin and your experien
