Electronics Forum | Tue Jul 21 14:35:31 EDT 2020 | charliedci
Yes, we have an old Universal axial and they still offer independent machines for axial, radial and DIP components, but I do not have the floor space for that. Some offer "odd form" insertion machines (Juki, Hanwha, Cenncorp)which is the direction I
Electronics Forum | Thu Jul 23 07:18:49 EDT 2020 | zgulkhan
I have built a smt pick and place machine a try for nozzle change you can see..https://www.youtube.com/watch?v=FrGPu49nKsw . I need help to improve it with vision system, any suggestion and Idea may highly be appreciated thanks in advance...
Electronics Forum | Fri Jul 24 03:23:34 EDT 2020 | xinyao
So I got this fully auto running machine line, that automatically pick, cut, edge grind, corner round the copper clad laminate, and I do not have a professional camara to shoot a video. How can shoot it with my phone, and still it looks amazing? Than
Electronics Forum | Wed Jul 29 18:51:29 EDT 2020 | davef
You're asking about unclad FR4 [G10 is not flame retardant] Just ask for 0/0 unclad FR4. Thicknesses: 0.010", 0.020", 0.031", 0.047", 0.059" 0.090" & 0.118" "What do you folks do when you need custom formers?" Call Butler Winding [I receive no benef
Electronics Forum | Mon Aug 10 12:58:04 EDT 2020 | SMTA-64386637
We have found Acrylic CC under QFNs is a failure mechanism in thermal cycling. The coating acts as a wedge and causes solder joint cracks. We do not coat QFNs. To enhance reliability we have the vias plugged with solder mask. This eliminates some
Electronics Forum | Thu Aug 20 07:11:25 EDT 2020 | sssamw
What your said looks like a acrylic coating thermal expansion causes small solder joint crack. Do you cure coating with heating, or heating after curing? Solder joint crack while you see resistor and QFN trouble? Clear and detail description of your
Electronics Forum | Tue Aug 04 14:29:14 EDT 2020 | dwl
Is the component an LGA or BGA? If its a BGA, it appears like the component is missing balls, if its an LGA, it appears like the solder isn't wetting to the component. What solder are you using? The wetting to the larger pads in the last pic seems
Electronics Forum | Fri Aug 07 03:16:33 EDT 2020 | rsatmech
It's a BGA component. Missing ball is not possible because we have enabled the vision in pick and place. Solder paste is OM353 type 5 Possibilities of Flux dry before reflow seems valid but I saw the board data it was completed on time like other
Electronics Forum | Fri Aug 07 20:07:16 EDT 2020 | emeto
Based on datasheet you can have balls with significant variation(twice volume) 0.13Sqr/0.19sqr = 0.46 I would suggest you tighten the machine recognition control. You will recognize BGA balls that are very different in size and reject the part. This
Electronics Forum | Wed Aug 05 08:57:23 EDT 2020 | oxygensmd
Snap off is an option to make distance between PCB and stencil. If the distance not enought, adjust the PCB thickness too. Mostly we don't use snap off, I more prefer if the stencil is tight with the PCB - I know, this make the stencil lifetime worst
