Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
Electronics Forum | Thu Jan 20 12:10:29 EST 2000 | Dave F
Hany: I have never understood why the add-on boards in PCs have gold plating on their connectors. In the military and in avionics, they require gold on connectors to protect from wear and corrosion. But PCs ave very different. PCs: * Are obsolet
Electronics Forum | Wed Jan 19 11:37:18 EST 2000 | Mark D. Milward
Does anyone consider the use of a Cyberoptics LSM solder paste thickness measurement system to be a valid test in determining the viscosity of solder paste. This procedure was proposed as an alternative to using the Malcolm gage for viscosity testing
Electronics Forum | Thu Jan 20 15:11:26 EST 2000 | Russ
I tested out the OK unit and found it to be a "down and dirty" rework machine that will do BGAs if demeanding thermal requirements are not needed. My largest concern was the lack of bottom side preheat. I have recently purchased the Air-Vac DRS24 a
Electronics Forum | Thu Jan 20 15:47:39 EST 2000 | Kris W
Rob, I am currently using a BGA-3000 from OK, which works fairly well. I did find that the customer support for the purchase of nozzles and stencils was very poor (overpriced and long lead times). I did find stencils for a good price through Mini
Electronics Forum | Wed Jan 19 17:01:18 EST 2000 | Chad Notebaert
You can buy desicant packs and indicator cards to place back in the original or a new bag with the BGA's and re-seal using a heat sealer (Vac Seal being the best). If properly done the material will be kept below the 20% RH level. Another option woul
Electronics Forum | Mon Jan 17 13:09:12 EST 2000 | Dennis _F
We seem to have voids show up in one out of 5 BGAs during x-ray inspection. The x-ray is set up to accept the joint with anything less then 30% void area. I need anyones input of what during the process we can do to decrease the voiding and/or a good
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Wed Jan 19 22:28:20 EST 2000 | Dave F
Taking things from a slightly different angle: Cost of assembling various packages based on volume: C/R placement: |$0.01 to 0.04 per part SOIC: | $0.03 PLCC based on lead count: | 20-39 $0.16 | 40-59 $0.18 | 60-79 $0.20 | 80-