Electronics Forum | Fri Aug 20 10:44:40 EDT 1999 | k.t
| | Is there process by which one can do a double sided reflow (SMT on both sides) in one pass through the oven? | | | Probably not. I have heard people talk of it but never see it done and I wouldn't recommend it. | | Good luck | | Yes, it is d
Electronics Forum | Tue Aug 17 00:42:40 EDT 1999 | ScottM
| Does any one have any idea which is usualy more expensive, to get components on Reels or in Trays ( I mean large components ofcourse). | What is price diffrence percentage ? | | practicaly, is one method is prefered to the other? | | Thanks alot
Electronics Forum | Mon Aug 16 16:46:47 EDT 1999 | Mark Thaler
| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u
Electronics Forum | Tue Aug 17 13:39:30 EDT 1999 | Brian
| We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give us
Electronics Forum | Mon Aug 23 11:36:22 EDT 1999 | Phil B
| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u
Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon
| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow
Electronics Forum | Mon Aug 16 00:05:52 EDT 1999 | Will Grubb
Hello I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce whi
Electronics Forum | Sat Aug 14 17:39:37 EDT 1999 | Gerry S.
One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with the
Electronics Forum | Thu Aug 12 12:18:13 EDT 1999 | Kevin Hussey
| Q.C. manager asking me about spc's for Mydata Pick & Place. | Other then Visual inspection, is there other ways to automate | placement inspction? | | Thanks | Sure! There are a few automated vision systems available today that could be just wh
Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare
I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th
