Electronics Forum: electron (Page 5386 of 7890)

Re: SMD mounting method

Electronics Forum | Fri Feb 05 04:18:44 EST 1999 | Joni Siipola

| Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via holes to the

Re: BGA-Problems with adhesion of the solder balls

Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen

Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-

Y2K

Electronics Forum | Wed Feb 03 18:29:58 EST 1999 | Jerry Stafford

Have any of you tested or plan to test your machines for Y2K compliance. I would be interested in what you did or what you plan to do. Which machines? What parameters? It seems that it could be a career limiting move to test without getting manag

Re: PWB plating

Electronics Forum | Tue Feb 09 20:32:54 EST 1999 | Chris G.

| There is also the process where thicker levels or solder is being applied directly to the board. This means no solder paste is applied before component placement. Just flux, place, and refow. | | Chris G. | | Can you tell me more about the p

Re: Pace TF700 Rework Machine

Electronics Forum | Wed Feb 03 21:46:33 EST 1999 | Larry Mara

Steve, We are in the same boat--small and limeted on fund.We have a TF200 that pace is letting us demo, seems like good tool that we can add to as we need to.We are going to buy one.Great

In-Circuit Automation

Electronics Forum | Tue Feb 02 12:43:01 EST 1999 | Rich Cary

My company produces a mixed technology control unit for automotive applications. We recently purchased an automated handler for our GENRAD in-circuit testing equipment and have encountered a challenge. We have several through hole components that,

Cracking solder joints

Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick

I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is

Re: Product Tracability

Electronics Forum | Sun Jan 31 01:20:22 EST 1999 | M. Faisal

| Can anyone suggest a good 2D bar-code traceability software package? | Dear Charles: Panasonic Factory Automation has a wide range of CIM Software products that offer various tracability functions like component-panel tracability. I will be glad

Re: SMD/PTH Tantalum pad layout

Electronics Forum | Tue Feb 02 10:56:53 EST 1999 | Justin Medernach

| Would anyone have experience or information on where I could find pad geometry for tantalum capacitors that can be surface or plated thru hole mounted. | Yup, Check out IPC-782. That's got all the info on land geometries that you'd be looking f

white residue

Electronics Forum | Wed Jan 27 19:42:34 EST 1999 | parag palshikar

i am working with the noclean process and getting white residues on the bottomside of the board probably due to the wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperature a


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