Electronics Forum | Fri Nov 02 12:01:26 EST 2001 | mparker
I have two cases where I must bake after DI wash. The moisture entrapment is specifically within microprocessor sockets. Without air gun blow out and baking, oxidation occurs that causes flaky contacts for the PGA. We will bake for 2-3 hours @ 60C. O
Electronics Forum | Thu Nov 01 04:32:52 EST 2001 | wbu
Jonathan, we do that all day. We do not use different pastes nor do we glue components nor do we run different profiles. Depends on what is meant by "small components". In our case it�s all that "bird seed" up to SO8. That will work for more parts.
Electronics Forum | Fri Nov 02 08:30:40 EST 2001 | fmonette
For double-side reflow boards, take note that if you have moisture-sensitive components on the first side, you will need to track their remaining floor life up to the final reflow. This is because the reflow process is too fast to effectively remove
Electronics Forum | Fri Nov 09 07:29:02 EST 2001 | henriksn
Hi, I would just like to add, that in our prototype production we often mount doublesided pcb's with components ranging from 0402 to BGA-280 to QFP-100. Of course we also mount and solder the side with the BGA's and QFP's last. Like the others here,
Electronics Forum | Thu Nov 01 17:40:52 EST 2001 | davef
Listen to Wolfgang. Your dull solder connection is a process indicator. Some 63Sn / Au solder connections look grainy, depending on how your process them and the materials involved. Gold dissolving in tin forms an intermetallic compound [AuSn4] th
Electronics Forum | Mon Nov 05 04:59:59 EST 2001 | madreindeer
hi, I have found dull joint when I have done trial if boards and cooling too fast.Also with Nitrogen.Some of paste don�t like Nitrogen too much. Also I have seen this when profile is not hot enough or flux haven�t survived to liquidus point. I wou
Electronics Forum | Thu Nov 01 04:31:47 EST 2001 | ianchan
I refer to IPC-A-610C, section 12.4.5, the defect term "dewetting". Can the experts pls help define the actual stages that constitute the formation of a dewetting defect? I do understand the common concept teachings that there may be contamination
Electronics Forum | Wed Nov 07 08:06:29 EST 2001 | hany_khoga
Dear All : 1- We assemble mixed technology boards. For some reasons, sometimes we store them semi assembled (only SMT). Knowing that they have plastic BGA,s , can the wave solder m/c affect or damage those BGA,S on continuation their production?
Electronics Forum | Mon Sep 16 13:04:19 EDT 2002 | dragonslayr
JoJo- please keep your "mining" for leads to other forums; you have activated a nearly one year old thread that has no relevance today other than your interest in your making a contact. Try contacting the original poster direct. If you have somethin
Electronics Forum | Mon Sep 16 20:26:29 EDT 2002 | davef
Oftimes when I see aggrandizing self-promotional postings like this, I ask Brian at SMTnet.com to: * Delete the posting, explaining why I consider the posting to be inappropriate. * Contact the offending poster and explain proper decorum on SMTnet.co
