Electronics Forum: electron (Page 5836 of 7890)

Cannon Fodder

Electronics Forum | Mon Sep 04 18:57:10 EDT 2006 | darby

From the Daily Telegraph. American Stephanie Smith was unfortunately injured when fired from a cannon at a circus in Adelaide. Let us hope she makes a full recovery. Her employer especially will hope this brave woman quickly regains full fitness and

support pins for double sided boards

Electronics Forum | Tue Sep 05 08:40:33 EDT 2006 | CL

SMAINTECH, Good Morning, We have installed the Gridlock tooling pin with stealth mode on our DEK's. It is a hard tooling pin array that resets the height if the pin for every board. The pin comes up until it comes into contact with something then lo

Fibers In Solder Joints

Electronics Forum | Wed Sep 06 11:08:09 EDT 2006 | Shep

I'm using an EKRA X5 printer. My QC department has been rejecting boards for "fibers" in solder joints. After investigation, I have determined that the fibers are coming from the stencil cleaner paper. I'm using JNJ Industries p/n 5404EK paper. A

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 03:47:07 EDT 2006 | vicknesh28

I have been getting non wets on fine pitch QFP packages on random leads during reflow process. I noticed that every time there is some flux residue left between the non-wet lead and the solder pad. No residue was not observed on the rest of the good

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 10:45:46 EDT 2006 | vicknesh28

Yes solder is reflowing on the pad but doesnt wick up the lead. Solder paste is sufficient. It just forms a saddle like appearance beneath the failing lead. The failed lead doesnt get reflowed at all. What puzzles me is how can hundreds of leads wet

Cracking

Electronics Forum | Thu Sep 07 08:50:45 EDT 2006 | Grant

Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has cracked off the PCB. It's below the intermetalic layer in the ball. Reflow otherwise looks good, and the raw components are clean. I am wondering what c

Paint flaking from Lead Free solder pot

Electronics Forum | Fri Sep 08 11:38:42 EDT 2006 | GS

Last april,I have seen same behavior on a pot using SACX. Phenomena happened just few days after start up of a brand new solder wave. I know they have got the pot replaced but I do not know what about the new pot if had same problem. I know they mad

Film Chip Capacitor reflow problems

Electronics Forum | Fri Sep 08 10:16:24 EDT 2006 | slthomas

We had problems with Panasonic film caps with a previous employer. The first step was to use their recommended pad layouts rather than industry standards for the part sizes. The second much more helpful resolution was to complain like hell to Panaso

Film Chip Capacitor reflow problems

Electronics Forum | Fri Sep 08 11:29:40 EDT 2006 | GPP

James, What type of profile are you using. Ramp-to-Spike, Ramp-Short Soak-Spike, or Long-Low Spike? I had a similar problem in a past life - random skews on chip components - and got rid of it by converting to Ramp-to-Spike (the old profile was R

Film Chip Capacitor reflow problems

Electronics Forum | Mon Sep 11 14:58:16 EDT 2006 | cuculi54986@yahoo.com

Steve, Let me guess, you were using this one: http://www.panasonic.com/industrial/components/pdf/abd0000ce10.pdf That part sucks. They have a newer part number that is supposedly "reflow-friendly". Unfortunately, I can't convince our quality de


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