Electronics Forum | Fri Mar 07 10:55:51 EST 2008 | slthomas
Not sure if you need help with the calculations or the application, so from the beginning: d=defective parts, p=number of parts, dpm=defects per million parts In a nutshell, d/p=dpm/1000000, so dpm=d/p*1000000 We use dpmo (defects per million op
Electronics Forum | Tue Mar 11 14:42:09 EDT 2008 | ck_the_flip
Here's a cheer I found on the ASQC Website. "Quality Cheer" by QC McSnigglets Who found it? WE DID! Who made it? THEY did. D - E - F - E - C - T - S Who found it? WE DID! Who made it? THEY did. D - E - F - E - C - T - S Du-du-du-du- DE-FECTS
Electronics Forum | Fri Mar 07 08:39:21 EST 2008 | mmjm_1099
Hey all I am looking for the full version of this if anyone has a copy. Below is the preview for this book. And if anyone has read through this book already please leave feedback on it. http://books.google.com/books?hl=en&id=Mpq1K9NFgs0C&dq=smt+ste
Electronics Forum | Mon Mar 10 08:17:41 EDT 2008 | smtnet51
I was never a big fan of inspection machines but we got a CKD machine in a couple of months ago and it's pretty impressive. Cycle time is faster than placement machines (in line) and so far has accurately called out issues. Bring one in and Demo on y
Electronics Forum | Fri Mar 21 12:39:52 EDT 2008 | stevea
Paste Inspection is critical to the overall printing process. There are at least 40 variables to this process. The idea of using only 2D printer inspection or worse yet, 3D (marginal at best) printer inspection demonstrates a serious gap in coverin
Electronics Forum | Mon Mar 31 18:05:46 EDT 2008 | mobytahoe
We evaluated (in-house) 3 Paste Inspection Machines: 1.Siemens 2.Agilent 3.Cyberoptics We also evaluated the MVP and Orbotech off-site. BY far, the CyberOptics machine performed the best. Gage R&R was remarkable, the s/w is second-to-none, pricing
Electronics Forum | Mon Mar 10 20:14:20 EDT 2008 | davef
We'd be unhappy with features that are not in copper that is at the same level as the component pads, because of difficulties the fabricator would have in maintaining registration between the copper pads and the ink used for the features not in coppe
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed Mar 12 10:26:10 EDT 2008 | realchunks
Why would a board failure related problem be a process problem. I agree most companies believe EVERY problem is a Proces Problem, but in the real world we know this is not true. A pad lifting means your solder joint was able to rip it off the boa
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
