Electronics Forum | Wed Aug 05 11:08:36 EDT 2009 | spitkis2
Hi, This may be a bit off the subject but thought I'd ask just in case. I am looking to identify a process / equipment for attaching solder balls to flip chips. Solder balls are 75 microns in diameter. With BGA's there are reballing kits that use
Electronics Forum | Wed Aug 05 23:02:09 EDT 2009 | mrduckmann2000
Help! We are havin issues installing the new Linear Tech LGA118's. We are installing 17 of these beast per assembly, the problem shorting? Any ideas? Linear Tech is usless, they blame heat, not a big enough reflow oven, moisture, part disty's...e
Electronics Forum | Thu Aug 06 16:32:38 EDT 2009 | markhoch
Yeah, those gosh darn disty parts...get you every time. lol Can we get just a little more info? Let's start with the basics... Stencil Thickness? Aperture Reduction? Leaded or Lead-Free? No-Clean or Water Soluble? How's your reflow? Have you prof
Electronics Forum | Thu Aug 06 21:50:19 EDT 2009 | fishingfool
Well Orbotech is basically out of business. They have sold their AOI to a company that is a basically a reseller. What that means is usually they have no people to improve software or make changes to improve the system. Not sure how Sony supports th
Electronics Forum | Thu Aug 13 15:16:16 EDT 2009 | davef
BoardHouse: You mean that our 'Martin Gershenson' might be this guy? Martin Gershenson; Christopher Associates Inc.,3617 W. MacArthur Blvd.Santa Ana, CA 92704; 714–979-7500 martin.gershenson@christopherweb.com So, you're implying that unlike some
Electronics Forum | Tue Sep 01 16:40:50 EDT 2009 | jimprice9
I am the North American sales manager for Sony. This exchange was brought to my attention by an amused friend. The VR systems was marketed under the brand name Varir and produced by Sony Kohda. It was discountinued over 3 years ago. The CPC500 is
Electronics Forum | Wed Aug 12 22:28:20 EDT 2009 | boardhouse
When choosing materials, do you specify your > thermal PCB needs? For instance, are you > specifying temperature or are you selecting > materials by brand name? With this type of product I would call out the material Manufacture and brand - Such
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Thu Aug 13 12:23:39 EDT 2009 | robhs
Thanks Dave. What you say makes complete sense. We ran a job a short while back in this way (though without bonding) and found we had a much higher than normal failure of the BGAs which I can only attribute to the secondary reflow. As I have only got
Electronics Forum | Fri Aug 14 08:01:25 EDT 2009 | davef
So, in order to understand your issue better, please * Tell us more about your process [eg, process flow, machine setting, measured temperatures, etc] * Tell us more about your materials [eg, board, paste, etc] * Describe the extent of the problem [e
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