Electronics Forum | Mon Feb 07 19:49:50 EST 2000 | Tony Di Mauro
Jose, I have seen this defect before. We called it re-reflow. We found the part was originally attached at SMT. Later on after seeing a heat cycle at the wave machine the leads would de-attach causing an open at In-Circuit Test. Resolution was t
Electronics Forum | Sat Feb 05 09:01:15 EST 2000 | Dave F
JS: The issue is not how efficiently/effectively that you can run your placement machine, probably. The issue is how efficiently you can run that part of your assembly process that is the bottleneck. Other than improving quality, optimizing any pa
Electronics Forum | Mon Feb 07 13:20:03 EST 2000 | Dave F
Graham STOP!!! You can not be totally serious. A five year old cost model counts bean, and beans are beans. I have to know more about the calculation. If this bores some of your gear-heads, click on "return." � Help me with the terms: - "Ops cos
Electronics Forum | Thu Feb 03 20:45:28 EST 2000 | Gary
I have worked with the PDR type rework station on and off for 12 years and have found that the IR can offer a lot of advantages over hot air. As was mentioned the lack of nozzels is a great advantage. The back heater takes a while to warm up but on
Electronics Forum | Thu Feb 03 08:20:49 EST 2000 | JAX
Once you have the capabilities to track a board from the initial stages in kitting all the way out the door in box build the possibilities are endless. You will now have: 1. An exact count of your companies WIP. 2. The exact location of every board i
Electronics Forum | Wed Feb 02 16:36:22 EST 2000 | Mike Konrad
As the manufacturer of the Zero-Ion, I must correct one statement made by Dave F. According to the EMPF report sited in Dave�s response, �Static� based systems actually are more susceptible to carbon Dioxide adsorption than �Dynamic� based systems.
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
Electronics Forum | Tue Feb 01 19:22:11 EST 2000 | Jason Bentley
What kind of errors are you getting. make sure that you have the right size fid's and the color is correct in the program. This is the main problem that I run into and it usually corrects the problem. Make sure that it is looking in the right X and Y
Electronics Forum | Tue Feb 01 21:51:05 EST 2000 | Dave F
Roni: Ron gives good advice on the thickness of your Electroless Nickel - Immersion Gold (ENIG) solderability preservative. Several additional comments are ENIG: � More expensive than OSPs and HASL. � Much flatter surface than HASL, similar to OSP
Electronics Forum | Tue Feb 01 12:02:56 EST 2000 | Mike Konrad
Your question may be answered in two parts. First, if you are using a water soluble (OA) paste, then water is an excellent �solvent�. Water, in one way or another, is used to clean all fluxes and pastes from PCB�s. In some cases, a chemical is add
