Electronics Forum: electron (Page 6631 of 7889)

Re: Hot-Air Leveling.

Electronics Forum | Wed Jun 10 10:28:48 EDT 1998 | Steve Schrader

| Hello, | Some time ago before I was an engineer the company that I work for now made it a company policy to not allow hot air leveling for reasons that I do not know about yet. All I know that this policyt agreed with the MIL standards at the time

Re: BGA Rework

Electronics Forum | Tue Jun 16 15:06:48 EDT 1998 | Bob Willis

I must say that I feel when the board has been correclty designed with corner marks on the edge of the BGA the optical systems are not necessary on 0.50/0.060" pitch. I like both air and IR the IR has the major benifit that you do not need all the ex

haloing on SMT PCBs

Electronics Forum | Mon Jun 08 13:26:59 EDT 1998 | D.Hammond

I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot of

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 14:52:46 EDT 1998 | Mike

| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 16:20:43 EDT 1998 | Earl Moon

| | How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 12:42:01 EDT 1998 | Earl Moon

| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr

Re: BGA In-circuit Failure Analysis

Electronics Forum | Tue Jun 16 15:10:27 EDT 1998 | Bob Willis

Simple x-ray inspection works well have a word with those nice people at Nicolet or Glenbrook. One of them was featured on my x-ray training video for BGA. A procedure for inspection criteria is on my web site if it is of use. | | How do I mechanical

What's the Deal W. Philips Topaz??

Electronics Forum | Mon Jun 08 07:49:40 EDT 1998 | smd

In our continued search for another flex machine, we reconsidered Philips Emerald (low Vol/high mix Mfg). We already have a CSM so it makes a little sense. Then the salesman started talking about the Topaz. The Topaz supposedly is "practically the sa

Re: What's the Deal W. Philips Topaz??

Electronics Forum | Sat Jun 13 07:23:18 EDT 1998 | Dave F

| In our continued search for another flex machine, we reconsidered Philips | Emerald (low Vol/high mix Mfg). We already have a CSM so it makes a little sense. Then the salesman started talking about the Topaz. The Topaz supposedly is "practically th

TCP solder / desolder / rework

Electronics Forum | Fri Jun 05 08:30:20 EDT 1998 | Wolfgang Hantz

We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. Now, - th


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